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Kousik Ganesan

from Chandler, AZ
Age ~43
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Also known as:
Rousik Canesan, Ganesan Kousik
Phone and address:
3652 E Mead Dr, Chandler, AZ 85249
Related to:
Rajalakshmi GanesanKovsik Ganesan
Connected to:
A Ganesan, 45Ajay K Ganesan, 34Aravind Ganesan, 45Ashok Ganesan, 55Gangesh K Ganesan, 52Gayatri D Ganesan, 60Karthika Ganesan, 35Kavitha Ganesan, 36Malini Ganesan, 42Manikandan Ganesan, 48

Kousik Ganesan Phones & Addresses

  • 3652 E Mead Dr, Chandler, AZ 85249
  • Phoenix, AZ
  • Buckeye, AZ
  • 18670 Boones Ferry Rd, Tualatin, OR 97062 (503) 486-5365
  • Hillsboro, OR
  • Tigard, OR
  • Ames, IA
  • Charlottesville, VA

Work

Company: Intel corporation Jan 2013 Address: CHANDLER, AZ Position: Engineering manager

Education

School / High School: Iowa State University Specialities: Chemical Engineering

Skills

Semiconductors • Thin Films • Design of Experiments • Characterization • Spc • Manufacturing • Semiconductor Industry • Process Simulation • Electroplating • Materials Science • R&D • Failure Analysis • Engineering Management • Chemistry • Process Engineering • Statistical Process Control

Industries

Semiconductors

Resumes

Resumes

Kousik Ganesan Photo 1

Engineering Technology Development Manager And Technologist

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Location:
Chandler, AZ
Industry:
Semiconductors
Work:
Intel Corporation - CHANDLER, AZ since Jan 2013
ENGINEERING MANAGER
Intel Corporation - Chandler, AZ Feb 2011 - Jan 2013
Senior Process Engineer
Novellus Systems - Tualatin, OR Aug 2005 - Feb 2011
Senior Process Engineer
Iowa State University May 2005 - Aug 2005
Research Scientist
Iowa State University Aug 2003 - May 2005
Research Associate
Education:
Iowa State University
University of Virginia
Central Electrochemical Research Institute
Skills:
Semiconductors
Thin Films
Design of Experiments
Characterization
Spc
Manufacturing
Semiconductor Industry
Process Simulation
Electroplating
Materials Science
R&D
Failure Analysis
Engineering Management
Chemistry
Process Engineering
Statistical Process Control

Publications

Us Patents

Closed Contact Electroplating Cup Assembly

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US Patent:
7985325, Jul 26, 2011
Filed:
Oct 30, 2007
Appl. No.:
11/929638
Inventors:
Robert Rash - Portland OR, US
Shantinath Ghongadi - Wilsonville OR, US
Kousik Ganesan - Hillsboro OR, US
Zhian He - Beaverton OR, US
Tariq Majid - Wilsonville OR, US
Jeff Hawkins - Portland OR, US
Seshasayee Varadarajan - Lake Oswego OR, US
Bryan Buckalew - Tualatin OR, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C25D 17/06
US Classification:
204242, 20429701, 2042971, 20429714, 204279
Abstract:
Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

Magnetically Actuated Chuck For Edge Bevel Removal

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US Patent:
8172646, May 8, 2012
Filed:
Feb 27, 2009
Appl. No.:
12/394339
Inventors:
Jingbin Feng - Lake Oswego OR, US
Aaron LaBrie - Oregon City OR, US
Kousik Ganesan - Tualatin OR, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
B24B 1/00
US Classification:
451 41, 451367, 451397, 451385, 279106, 414941
Abstract:
Provided are magnetically actuated wafer chucks that permit a wafer to be clamped or unclamped at any time during a process and at any rotational speed, as desired. Such wafer chucks may include constraining members that are movable between open and closed positions. In a closed position, a constraining member aligns the wafer after wafer handoff and/or clamps the wafer during rotation to prevent it from flying off the chuck. In an open position, the constraining member moves away from the wafer to allow liquid etchant to flow from the wafer edge without obstruction. The constraining members may be, for example, cams, attached to arms or links of the chuck. The cams or other constraining members move between open and closed positions by self-balancing forces including a first force, such as a spring force, that acts to move a cam in a first direction, and a non-contact actuate-able force, such as a magnetic force, that acts to move the cam in the opposite direction. The resulting cam motion is smooth and continuous.

Wafer Electroplating Apparatus For Reducing Edge Defects

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US Patent:
8172992, May 8, 2012
Filed:
Dec 8, 2009
Appl. No.:
12/633219
Inventors:
Vinay Prabhakar - Fremont CA, US
Bryan L. Buckalew - Tualatin OR, US
Kousik Ganesan - Tualatin OR, US
Shantinath Ghongadi - Wilsonville OR, US
Zhian He - Beaverton OR, US
Steven T. Mayer - Lake Oswego OR, US
Robert Rash - Portland OR, US
Jonathan D. Reid - Sherwood OR, US
Yuichi Takada - Tualatin OR, US
James R. Zibrida - Portland OR, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C25B 9/02
US Classification:
20429709, 2042971, 20429714, 20429708
Abstract:
Methods, apparatuses, and various apparatus components, such as base plates, lipseals, and contact ring assemblies are provided for reducing contamination of the contact area in the apparatuses. Contamination may happen during removal of semiconductor wafers from apparatuses after the electroplating process. In certain embodiments, a base plate with a hydrophobic coating, such as polyamide-imide (PAI) and sometimes polytetrafluoroethylene (PTFE), are used. Further, contact tips of the contact ring assembly may be positioned further away from the sealing lip of the lipseal. In certain embodiments, a portion of the contact ring assembly and/or the lipseal also include hydrophobic coatings.

Plating Method And Apparatus With Multiple Internally Irrigated Chambers

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US Patent:
8262871, Sep 11, 2012
Filed:
Dec 17, 2009
Appl. No.:
12/640992
Inventors:
Steven T. Mayer - Lake Oswego OR, US
Shantinath Ghongadi - Wilsonville OR, US
Kousik Ganesan - Tualatin OR, US
Zhian He - Tigard OR, US
Jingbin Feng - Lake Oswego OR, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C25B 9/00
C25D 17/00
US Classification:
204263, 204242, 205 80
Abstract:
An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.

Electroplating Cup Assembly

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US Patent:
8377268, Feb 19, 2013
Filed:
Jun 6, 2011
Appl. No.:
13/154224
Inventors:
Robert Rash - Portland OR, US
Shantinath Ghongadi - Wilsonville OR, US
Kousik Ganesan - Hillsboro OR, US
Zhian He - Beaverton OR, US
Tariq Majid - Wilsonville OR, US
Jeff Hawkins - Portland OR, US
Seshasayee Varadarajan - Lake Oswego OR, US
Bryan Buckalew - Tualatin OR, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C25D 17/06
C25D 7/12
US Classification:
20429701
Abstract:
Embodiments of a closed-contact electroplating cup are disclosed. One embodiment comprises a cup bottom comprising an opening, and a seal disposed on the cup bottom around the opening. The seal comprises a wafer-contacting peak located substantially at an inner edge of the seal. The embodiment also comprises an electrical contact structure disposed over a portion of the seal, wherein the electrical contact structure comprises an outer ring and a plurality of contacts extending inwardly from the outer ring, and wherein each contact has a generally flat wafer-contacting surface. The embodiment further comprises a wafer-centering mechanism configured to center a wafer in the cup.

Rapidly Cleanable Electroplating Cup Seal

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US Patent:
8398831, Mar 19, 2013
Filed:
Apr 4, 2011
Appl. No.:
13/079745
Inventors:
Shantinath Ghongadi - Wilsonville OR, US
Robert Rash - Portland OR, US
Jeff Hawkins - Portland OR, US
Seshasayee Varadarajan - Lake Owsego OR, US
Tariq Majid - Wilsonville OR, US
Kousik Ganesan - Hillsboro OR, US
Bryan Buckalew - Tualatin OR, US
Brian Evans - Elmira OR, US
Assignee:
Novellus Systems, Inc. - San Jose CA
International Classification:
C25D 17/00
C25D 9/00
F16J 15/00
US Classification:
20429714, 20429701, 20429705, 20429706, 20429707, 20429708, 20429709, 2042971, 204279, 277650
Abstract:
Embodiments of a closed-contact electroplating cup assembly that may be rapidly cleaned while an electroplating system is on-line are disclosed. One disclosed embodiment comprises a cup assembly and a cone assembly, wherein the cup assembly comprises a cup bottom comprising an opening, a seal surrounding the opening, an electrical contact structure comprising a plurality of electrical contacts disposed around the opening, and an interior cup side that is tapered inwardly in along an axial direction of the cup from a cup top toward the cup bottom.

Apparatus And Method For Edge Bevel Removal Of Copper From Silicon Wafers

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US Patent:
8419964, Apr 16, 2013
Filed:
Aug 27, 2008
Appl. No.:
12/199412
Inventors:
Kousik Ganesan - Tualatin OR, US
Shanthinath Ghongadi - Wilsonville OR, US
Tariq Majid - Wilsonville OR, US
Aaron Labrie - Oregon City OR, US
Steven T. Mayer - Lake Oswego OR, US
Assignee:
Novellus Systems, Inc. - Fremont CA
International Classification:
H01L 21/302
US Classification:
216 92, 216100, 216105, 134 13, 438748, 438754, 438906
Abstract:
Chemical etching methods and associated modules for performing the removal of metal from the edge bevel region of a semiconductor wafer are described. The methods and systems provide the thin layer of pre-rinsing liquid before applying etchant at the edge bevel region of the wafer. The etchant is less diluted and diffuses faster through a thinned layer of rinsing liquid. An edge bevel removal embodiment involving that is particularly effective at reducing process time, narrowing the metal taper and allowing for subsequent chemical mechanical polishing, is disclosed.

Plating Method And Apparatus With Multiple Internally Irrigated Chambers

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US Patent:
8540857, Sep 24, 2013
Filed:
Aug 9, 2012
Appl. No.:
13/571199
Inventors:
Steven Mayer - Lake Oswego OR, US
Shantinath Ghongadi - Tigard OR, US
Kousik Ganesan - Tualatin OR, US
Zhian He - Tigard OR, US
Jingbin Feng - Lake Oswego OR, US
Assignee:
Novellus Systems, Inc. - Fremont CA
International Classification:
C25B 9/00
C25D 17/00
C25D 7/12
US Classification:
204263, 204242, 204252
Abstract:
An apparatus for electroplating a layer of metal onto a work piece surface includes a membrane separating the chamber of the apparatus into a catholyte chamber and an anolyte chamber. In the catholyte chamber is a catholyte manifold region that includes a catholyte manifold and at least one flow distribution tube. The catholyte manifold and at least one flow distribution tube serve to mix and direct catholyte flow in the catholyte chamber. The provided configuration effectively reduces failure and improves the operational ranges of the apparatus.
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Kousik Ganesan from Chandler, AZ, age ~43 Get Report