Search

Dongbin Hou

from Plano, TX
Age ~39
Get Report
Also known as:
Bin Hou Dong
Phone and address:
6604 Tawny Oak Dr, Plano, TX 75024
Connected to:
Amber R Hou, 29Benjamin B Hou, 53Bingshu Hou, 36Chun J Hou, 66Deyi Hou, 43Diane Hou, 30Donald Hou, 70Fong Y Hou, 73Frances M Hou, 58Garvy Hou, 64

Dongbin Hou Phones & Addresses

  • 6604 Tawny Oak Dr, Plano, TX 75024
  • Allen, TX
  • Dallas, TX
  • Lubbock, TX
  • Blacksburg, VA
  • Maynard, MA

Work

Company: Virginia tech Sep 2011 Address: Blacksburg, VA Position: Research assistant of center for power electronics systems

Education

School / High School: Texas Tech University 2007 to 2010

Skills

Power Electronics • Electrical Engineering • Magnetics Characterization and Design • Matlab • Characterization • Pcb Design • Analog Circuit Design • Simplis/Simetrix • Spectroscopy • Ansys Maxwell • Design and Integration of Point of Load ...

Languages

English • Mandarin

Industries

Electrical/Electronic Manufacturing

Resumes

Resumes

Dongbin Hou Photo 1

System Engineer

View page
Location:
6604 Tawny Oak Dr, Plano, TX 75024
Industry:
Electrical/Electronic Manufacturing
Work:
Virginia Tech - Blacksburg, VA since Sep 2011
Research assistant of Center for Power Electronics Systems
Education:
Texas Tech University 2007 - 2010
Skills:
Power Electronics
Electrical Engineering
Magnetics Characterization and Design
Matlab
Characterization
Pcb Design
Analog Circuit Design
Simplis/Simetrix
Spectroscopy
Ansys Maxwell
Design and Integration of Point of Load Converter
Languages:
English
Mandarin

Publications

Us Patents

Integrated Magnetic Device With Laminate Embedded Magnetic Core

View page
US Patent:
20210375540, Dec 2, 2021
Filed:
Apr 26, 2021
Appl. No.:
17/240656
Inventors:
- Dallas TX, US
Kenji Otake - Nagano, JP
Zhemin Zhang - Allen TX, US
Byron Lovell Williams - Plano TX, US
Dongbin Hou - Plano TX, US
Sombuddha Chakraborty - Redwood City CA, US
International Classification:
H01F 41/04
H01F 17/00
H01F 17/04
Abstract:
A laminate embedded core and coil structure comprises a magnetic core embedded in a laminate structure that includes two types of laminates. A first laminate embeds the coils of the structure and a second laminate fills space between the magnetic core and the first laminate, as well as space below the magnetic core and lower surface of the first laminate. The first and second laminates form a laminate structure that protects and improves isolation of the magnetic components. Solder resist encloses the laminate structure, magnetic core and coils. The laminate embedded core and coil structure may be assembled on a transformer leadframe of various types using non-conductive paste.
Control profile
Dongbin Hou from Plano, TX, age ~39 Get Report