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Zhengqing Gan

from Clayton, CA
Age ~43

Zhengqing Gan Phones & Addresses

  • Clayton, CA
  • Pleasant Hill, CA
  • Los Angeles, CA
  • Des Moines, IA
  • Ames, IA
  • Danville, CA

Work

Company: Bridgelux, inc. Mar 2011 Position: Phosphor engineer

Education

Degree: Master School / High School: Iowa State University 2009 to 2010 Specialities: Electrical Engineering

Skills

Characterization • Design of Experiments • Experimentation • Afm • Labview • C

Interests

Opv • Semiconductor Devicesprogramming • Guitar • Programming • Badminton • Semiconductor Devices • Semiconductor Devices Programming • Web Designingguitar • Running • Web Designing • Web Designing Guitar • Oled

Industries

Telecommunications

Resumes

Resumes

Zhengqing Gan Photo 1

Staff Process Development Engineer

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Location:
San Francisco, CA
Industry:
Telecommunications
Work:
Bridgelux, Inc. since Mar 2011
Phosphor Engineer

University of California at Los Angeles Jun 2010 - Nov 2010
Postdoctoral Scholar

Iowa State University Aug 2005 - Aug 2010
Research Assistant

Iowa State University Aug 2003 - Dec 2005
Teaching Assistant
Education:
Iowa State University 2009 - 2010
Master, Electrical Engineering
Iowa State University 2003 - 2010
PhD, Condensed Matter Physics
Fudan University 1999 - 2003
BA, Applied Physics
Skills:
Characterization
Design of Experiments
Experimentation
Afm
Labview
C
Interests:
Opv
Semiconductor Devicesprogramming
Guitar
Programming
Badminton
Semiconductor Devices
Semiconductor Devices Programming
Web Designingguitar
Running
Web Designing
Web Designing Guitar
Oled

Business Records

Name / Title
Company / Classification
Phones & Addresses
Zhengqing Gan
DFW SCITECH, LLC
4116 Greenfield Dr, Richardson, TX 75082
3701 Junius St, Dallas, TX 75246
4316 Swiss Ave, Dallas, TX 75204
1294 Shell Cir, Clayton, CA 94517

Publications

Us Patents

Phosphor Placement In White Light Emitting Diode Assemblies

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US Patent:
20130193465, Aug 1, 2013
Filed:
Jan 31, 2012
Appl. No.:
13/361965
Inventors:
Tao Xu - Fremont CA, US
Zhengqing Gan - Pleasant Hill CA, US
Assignee:
Bridgelux, Inc. - Livermore CA
International Classification:
H01L 33/50
US Classification:
257 98, 438 29, 257E33061
Abstract:
A white LED assembly includes a blue LED die attached to a substrate. A first volume of a first luminescent material surrounds the blue LED die in a lateral dimension such that none of the first luminescent material is disposed directly over the blue LED die. The first luminescent material includes a relatively inefficient phosphor having a peak emission wavelength longer than 620 nm and includes substantially no phosphor having a peak emission wavelength shorter than 620 nm. A second volume of a second luminescent material is disposed over the first volume and the blue LED die. The second luminescent material includes a relatively efficient phosphor having a peak emission wavelength shorter than 620 nm and includes substantially no phosphor having a peak emission wavelength longer than 620 nm. Placement of the first and second luminescent materials in this way promotes removal of heat from the inefficient phosphor and reduces the likelihood of interabsorption.

Phosphor Placement In White Light Emitting Diode Assemblies

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US Patent:
20130341669, Dec 26, 2013
Filed:
Aug 28, 2013
Appl. No.:
14/012901
Inventors:
Zhengqing Gan - Clayton CA, US
Assignee:
Bridgelux, Inc. - Livermore CA
International Classification:
H01L 33/50
US Classification:
257 98, 438 27
Abstract:
A white LED assembly includes a blue LED die attached to a substrate. A first volume of a first luminescent material surrounds the blue LED die in a lateral dimension such that none of the first luminescent material is disposed directly over the blue LED die. The first luminescent material includes a relatively inefficient phosphor having a peak emission wavelength longer than 620nm and includes substantially no phosphor having a peak emission wavelength shorter than 620nm. A second volume of a second luminescent material is disposed over the first volume and the blue LED die. The second luminescent material includes a relatively efficient phosphor having a peak emission wavelength shorter than 620nm and includes substantially no phosphor having a peak emission wavelength longer than 620nm. Placement of the first and second luminescent materials in this way promotes removal of heat from the inefficient phosphor and reduces the likelihood of interabsorption.

Methods Of Making Light-Emitting Assemblies Comprising An Array Of Light-Emitting Diodes Having An Optimized Lens Configuration

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US Patent:
20220320051, Oct 6, 2022
Filed:
Apr 12, 2022
Appl. No.:
17/719361
Inventors:
- Livermore CA, US
Tao Tong - Pleasanton CA, US
Zhengqing Gan - Clayton CA, US
International Classification:
H01L 25/075
H01L 33/60
H01L 33/50
H01L 33/62
H01L 33/56
H01L 33/54
Abstract:
Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

Led Array Package

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US Patent:
20220262991, Aug 18, 2022
Filed:
May 3, 2022
Appl. No.:
17/735362
Inventors:
- Fremont CA, US
Scott WEST - Pleasanton CA, US
Cem BASCERI - Livermore CA, US
Zhengqing GAN - Livermore CA, US
International Classification:
H01L 33/56
H01L 33/46
Abstract:
Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

Led Array Package

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US Patent:
20210226104, Jul 22, 2021
Filed:
Dec 23, 2020
Appl. No.:
17/132325
Inventors:
- Fremont CA, US
Scott WEST - Pleasanton CA, US
Cem BASCERI - Livermore CA, US
Zhengqing GAN - Livermore CA, US
International Classification:
H01L 33/56
H01L 33/46
Abstract:
Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.

Methods Of Making Light-Emitting Assemblies Comprising An Array Of Light-Emitting Diodes Having An Optimized Lens Configuration

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US Patent:
20190371770, Dec 5, 2019
Filed:
Aug 13, 2019
Appl. No.:
16/539972
Inventors:
- Livermore CA, US
Tao Tong - Pleasanton CA, US
Zhengqing Gan - Clayton CA, US
International Classification:
H01L 25/075
H01L 33/60
H01L 33/50
H01L 33/62
H01L 33/56
H01L 33/54
Abstract:
Light emitting assemblies comprise a plurality of Light Emitting Diode (LED) dies arranged and attached to common substrate to form an LED array having a desired optimum packing density. The LED dies are wired to one another and are attached to landing pads on the substrate for receiving power from an external electrical source via an interconnect device. The assembly comprises a lens structure, wherein each LED die comprises an optical lens disposed thereover that is configured to promote optimal light transmission. Each optical lens has a diameter that is between about 1.5 to 3 times the size of a respective LED die, and is shaped in the form of a hemisphere. Fillet segments are integral with and interposed between the adjacent optical lenses, and provide sufficient space between adjacent optical lenses so that the diameters of adjacent optical lenses do not intersect with one another.

High Efficiency Chip-On-Board Light-Emitting Diode

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US Patent:
20190287950, Sep 19, 2019
Filed:
Feb 19, 2019
Appl. No.:
16/279402
Inventors:
- Fremont CA, US
Vladimir ODNOBLYUDOV - Danville CA, US
Zhengqing GAN - Clayton CA, US
International Classification:
H01L 25/075
Abstract:
An LED CoB structure with the combination use of blue and red LED dies is used to achieve warm white light, with good quantum conversion efficiency at a reasonably low cost. Both the red and blue LED dies are fabricated on transparent substrates. The current density of the LED dies is designed to match the different degradation rate of each type of LED die. The methods used to achieve high efficiency include adjusting the power, wavelength, and/or position of the dies.

Led Array Package

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US Patent:
20190273192, Sep 5, 2019
Filed:
Feb 5, 2019
Appl. No.:
16/267958
Inventors:
- Fremont CA, US
Scott WEST - Pleasanton CA, US
Cem BASCERI - Livermore CA, US
Zhengqing GAN - Livermore CA, US
International Classification:
H01L 33/56
H01L 33/46
Abstract:
Various aspects of a light emitting apparatus includes a substrate. Various aspects of the light emitting apparatus include a light emitting die arranged on the substrate. The light emitting die includes one or more side walls. Various aspects of the light emitting apparatus include a reflective die attach material extending along the one or more side walls of the light emitting die.
Zhengqing Gan from Clayton, CA, age ~43 Get Report