US Patent:
20160056540, Feb 25, 2016
Inventors:
- Santa Clara CA, US
Purna C. Subedi - Irvine CA, US
Yatin Buch - Tustin CA, US
Jason Cook - Huntington Beach CA, US
Changru Zhu - Santa Ana CA, US
George Sideris - Irvine CA, US
Robert Balue - Santa Ana CA, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01Q 21/00
H05K 5/00
H05K 7/14
H01P 1/213
Abstract:
A modular high power, low passive intermodulation, active, universal, distributed antenna system interface tray that includes one or more front-end RF frequency duplexers instead of a high power, low passive intermodulation attenuator to achieve superior FIM performance. A cable switch matrix allows for the use of the system among varying power levels and accomplishes the above in a modular architecture.