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Wenjun Chen

from Fremont, CA
Age ~35
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Also known as:
Wen Jun Chen, Chen Wenjun
Phone and address:
38767 Farwell Dr, Fremont, CA 94536
Related to:
Lisa Masako Chen, 44Liang Lin Chen, 63Jing Chen, 41Jin Chen, 32Shelly ChenYing Teng, 50Li Chen, 38
Connected to:
Aaron C Chen, 48Agnes H Chen, 50Aharon A Chen, 67Aiai Chen, 34Aini Chen, 35Aiqing Chen, 47Amy T Chen, 61Andreas Chen, 34Anna Chen, 50Anne H Chen, 55

Wenjun Chen Phones & Addresses

  • 38767 Farwell Dr, Fremont, CA 94536
  • Hayward, CA
  • Union City, CA
  • 1321 Harrington St, Fremont, CA 94539

Resumes

Resumes

Wenjun Chen Photo 1

Florida Institute Of Technology

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Location:
San Francisco, CA
Industry:
Information Technology And Services
Work:
Oracle Jul 1997 - Mar 2017
Principle Hardware Engineer and System Dvt Lead
Sun Microsystems Sep 1997 - Feb 2010
Staff Hardware Design Engineer
Sep 1997 - Feb 2010
Florida Institute of Technology
Education:
Florida Institute of Technology
Master of Science, Masters, Engineering
Skills:
Board Development
Design Verification Testing
Cross Functional Team Leadership
Cloud Computing
Debugging
Embedded Systems
Hardware
Hardware Architecture
Perl
Program Management
Software Development
System Architecture
System Design
Testing
Unix
Interests:
Photography
Wenjun Chen Photo 2

Wenjun Chen

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Skills:
Project Management
Rf Test
Wenjun Chen Photo 3

Wenjun Chen

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Skills:
Microsoft Office
Microsoft Word
Powerpoint
Microsoft Excel
Windows
Outlook
Wenjun Chen Photo 4

Principle Engineer At Oracle

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Location:
San Francisco Bay Area
Industry:
Information Technology and Services
Wenjun Chen Photo 5

Wenjun Chen

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Location:
United States
Wenjun Chen Photo 6

Wenjun Chen

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Location:
United States

Publications

Us Patents

Integrated Circuit Chip Test Adapter

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US Patent:
6727717, Apr 27, 2004
Filed:
Sep 27, 2001
Appl. No.:
09/965275
Inventors:
David J. Kim - San Jose CA
Anthony Kozaczuk - Burlingame CA
Wenjun Bill Chen - Fremont CA
Assignee:
Sun Microsystems, Inc. - Santa Clara CA
International Classification:
G01R 3102
US Classification:
324755
Abstract:
An apparatus for testing an integrated circuit chip includes a printed circuit device having connector pads, contacts, and traces extending between at least some of the connector pads and the contacts. The printed circuit device has openings therethrough, intersecting the contacts, that are adapted to receive the pins extending from the integrated circuit chip so that the contacts may electrically contact the pins extending from the integrated circuit chip. The apparatus further includes a connector electrically interconnected with at least some of the connector pads. The apparatus is adapted to be disposed between the integrated circuit chip and a chip socket, such that the pins extending from the integrated circuit chip may be inserted through the printed circuit device and into the chip socket.

Modular Spring Loaded Pci Card Retaining Device

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US Patent:
6775147, Aug 10, 2004
Filed:
Oct 17, 2002
Appl. No.:
10/273040
Inventors:
David Kwang Jae Kim - San Jose CA
William W. Ruckman - San Jose CA
Wenjun William Chen - Fremont CA
Assignee:
Sun Microsystems, Inc. - Santa Clara CA
International Classification:
H05K 500
US Classification:
361752, 361759, 211 4117
Abstract:
According to one embodiment, a computer system is disclosed. The computer system includes an enclosure and a card retaining assembly. The card training assembly is mounted within the enclosure to support printed circuit boards (PCBs). The card retaining assembly includes a housing, mounted within the enclosure that has one or more cavities. In addition, the card retaining assembly includes one or more retaining devices configured to be inserted into the one or more cavities in order to support the PCBs.

Emi Seal For System Chassis

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US Patent:
6909043, Jun 21, 2005
Filed:
Nov 12, 2003
Appl. No.:
10/706203
Inventors:
David K. Kim - San Jose CA, US
William W. Ruckman - San Jose CA, US
Wenjun Chen - Fremont CA, US
Assignee:
Sun Microsystems, Inc. - Santa Clara CA
International Classification:
H05K009/00
US Classification:
174 35GC, 361685
Abstract:
A method and apparatus for providing an EMI seal in a system chassis. The EMI seal is provided by a bezel assembly for a storage medium drive. The bezel assembly includes a front bezel having an aperture through which a tray can extend for loading and unloading of the storage medium drive, and a tray bezel attached to the tray. Attached to the front bezel is an electrically conductive link. Both the front bezel and the tray bezel include an electrically conductive inner surface. Upon closing the tray, the electrically conductive link provides an electrical connection between the inner surface front bezel and the inner surface of the tray bezel.

Computer System Layout And Cooling Configuration

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US Patent:
7036027, Apr 25, 2006
Filed:
Oct 21, 2002
Appl. No.:
10/274824
Inventors:
David K. Kim - San Jose CA, US
William W. Ruckman - San Jose CA, US
Anthony Kozaczuk - Burlingame CA, US
Wenjun Chen - Fremont CA, US
Talal J. Ahwal - Santa Cruz CA, US
Assignee:
Sun Microsystems, Inc. - Santa Clara CA
International Classification:
G06F 1/20
US Classification:
713300, 713322, 361687
Abstract:
Disclosed are novel methods and apparatus for provision of efficient, effective, and/or flexible computer system layout and/or cooling configuration. In accordance with an embodiment of the present invention, a method of cooling a computer system is disclosed. The computer system may include a plurality of heat generating electrical components that require cooling. The method includes: providing at least two cooling fans arranged front to back of the computer system to create a push (inlet) and pull (outlet) airflow to cool the computer system and providing a plurality of temperature sensors located at various locations within the computer system to sense a local temperature.

Apparatus And Methods To Contain Electro-Magnetic Interference

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US Patent:
20030037941, Feb 27, 2003
Filed:
Aug 24, 2001
Appl. No.:
09/939255
Inventors:
David Kim - San Jose CA, US
William Ruckman - San Jose CA, US
Wenjun Chen - Fremont CA, US
International Classification:
H05K009/00
US Classification:
174/03500R
Abstract:
The present invention discloses methods and apparatus for installing printed circuit boards within an electronic assembly. One embodiment of the present invention is an electro-magnetic interference shielding apparatus for an electronic assembly comprising a shielding partition that separates a first compartment from a second compartment. The apparatus further comprises a top enclosure capable of engaging with the shielding partition to form a plurality of contact seams. The contact seams are capable of restricting electro-magnetic interference from passing through the shielding apparatus. The top enclosure can be capable of tool-free installation and removal to provide access to the interior of the electronic assembly.

Method And Apparatus For Reducing Noise In Electrical Power Supplied To A Semiconductor

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US Patent:
20030224546, Dec 4, 2003
Filed:
May 30, 2002
Appl. No.:
10/159402
Inventors:
Wenjun Chen - Fremont CA, US
International Classification:
H01L021/00
H01L021/20
US Classification:
438/019000, 438/393000
Abstract:
A method and apparatus for decoupling a voltage supply from a semiconductor device is provided. A substrate has a plurality of spaced apart electrical connections positioned on thereon, wherein at least first and second ones of the connections are coupled to first and second terminals of a voltage supply respectively. A capacitor is coupled to the substrate and interstitially positioned within the spaced apart connections. The capacitor has first and second leads coupled with the first and second terminals of the voltage supply. A semiconductor device is coupled to the substrate in mating relationship with the pattern of spaced apart electrical connections, wherein the capacitor is positioned below the semiconductor device and immediately adjacent the voltage supply terminals of the semiconductor device.

Heat Sink Frame With Improved Electromagnetic Interference (Emi) Suppression Characteristics

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US Patent:
20040075982, Apr 22, 2004
Filed:
Oct 21, 2002
Appl. No.:
10/277185
Inventors:
David Kim - San Jose CA, US
William Ruckman - San Jose CA, US
Wenjun Chen - Fremont CA, US
James Poore - San Jose CA, US
International Classification:
G06F001/20
H05K007/20
US Classification:
361/687000, 361/718000
Abstract:
Disclosed are novel methods and apparatus for provision of a heat dissipation device with improved EMI suppression characteristics. In accordance with an embodiment of the present invention, an apparatus is disclosed. The apparatus may include a printed circuit board, which forms at least one grounding pad and at least one mounting hole. The apparatus may further include an integrated circuit, a heat dissipation device mounted on the integrated circuit, and a frame mounted on the printed circuit board through the mounting hole. The frame may include at least one frame leg in electrical contact with the grounding pad. The frame may form an electromagnetic interference (EMI) shield to limit an EMI leakage generated by the integrated circuit.

Reflection Mechanism For Illuminating Insignia On A Computer System

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US Patent:
20040090768, May 13, 2004
Filed:
Nov 8, 2002
Appl. No.:
10/291313
Inventors:
David Kim - San Jose CA, US
Milton Lee - Mountain View CA, US
Russell Brovald - Mountain View CA, US
William Ruckman - San Jose CA, US
Wenjun Chen - Fremont CA, US
International Classification:
F21V007/00
F21V033/00
US Classification:
362/085000, 362/307000, 362/253000
Abstract:
A reflection mechanism for illuminating insignia on a computer system is provided. The reflection mechanism uses one or more angled reflectors that diffuse light through transparent insignia provided in the housing of the computer system. Such use of angled reflectors reduces hot spots typically attributable to direct light projection and provides uniform illumination of the transparent portions of the insignia.
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Wenjun Chen from Fremont, CA, age ~35 Get Report