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Venu M Turlapaty

from Henderson, NV
Age ~64
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Also known as:
Venu Te Turlapaty, Venugopal M Turlapaty, Venu T Murthy, Vence M Turlapaty, Venugopal M Purlapaty, Venu Purlapaty, Turlapaty M Venugopal, Veniu Purlapaty
Related to:
Teresa A LeviFrances Murphy, 76Sara LeviMargaret Murphy
Connected to:
Sivapriya Turlapati, 45Sree K Turlapati, 49Teresa M Turlek, 70Angela L Turley, 43Bernadette J Turley, 56Brandon M Turley, 45Brian K Turley, 63Camille B Turley, 63Cary D Turley, 49Chad A Turley, 52

Venu Turlapaty Phones & Addresses

  • Henderson, NV
  • 14859 Endicott St, Saint Paul, MN 55124 (952) 322-5124
  • Vadnais Hts, MN
  • Elmwood, NE

Work

Company: Bs consulting Position: Project manager

Industries

Medical Devices

Resumes

Resumes

Venu Turlapaty Photo 1

Project Manager At Bs Consulting

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Position:
Project Manager at BS Consulting, Project Manager at Boston Scientific
Location:
Greater Minneapolis-St. Paul Area
Industry:
Medical Devices
Work:
BS Consulting
Project Manager
Boston Scientific since 2005
Project Manager

Business Records

Name / Title
Company / Classification
Phones & Addresses
Venu M. Turlapaty
President
Electro Thermal Solutions LLC
Business Services
399 Colleen Dr, Saint Paul, MN 55127

Publications

Us Patents

Modular, Semiconductor Reliability Test System

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US Patent:
60972009, Aug 1, 2000
Filed:
Oct 7, 1996
Appl. No.:
8/725935
Inventors:
Venu Turlapaty - Vadnais Heights MN
Brent Harry - White Bear Lake MN
Timothy McMullen - Lino Lakes MN
Richard Benjamin - White Bear Lake MN
Assignee:
Aetrium Incorporated - North St. Paul MN
International Classification:
G01R 3122
US Classification:
324760
Abstract:
A system (10) for performing semiconductor reliability tests is disclosed including an oven (36) having open axial ends for slideably receiving a board (12). The board (12) includes an oven region (16) which is removably received in the oven (36) and which is located intermediate connection and exterior regions (14, 18) located axially outside of the oven (36). A temperature sensor (30) is positioned in the oven region (16) and its calibration device (32) is located in the exterior region (18). Contacts (34) on the axial free edge of the connection region (14) are slideably received in an electrical connector (72). The board (12) is formed of low heat transfer material so that the connection and exterior regions (14, 18) and the electrical connector (72) is not heated by the oven (36) and includes a handle (22) on the axial free edge of the exterior region (18). The heat transfer element (38) of the oven (36) has a large thermal mass and is in close and uniform proximity to the DUTs (28) received on the board (12).
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Venu M Turlapaty from Henderson, NV, age ~64 Get Report