Ven R Holalkere

6813149, Nov 2, 2004

Jun 29, 2001

09/896869

Barrett M. Faneuf - Lakewood WA
William E. Berry - Tacoma WA
Ven R. Holalkere - Dublin CA
David S. De Lorenzo - Olympia WA

Intel Corporation - Santa Clara CA

G06F 116

361687, 361694, 622592, 415176

An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.

6836407, Dec 28, 2004

Jan 4, 2002

10/039146

Barrett M. Faneuf - Lakewood WA
Ven R. Holalkere - Dublin CA
Stephen W. Montgomery - Federal Way WA

Intel Corporation - Santa Clara CA

G06F 120

361687, 361695, 622592, 165 803

A computer system is described of the kind having a frame and a plurality of server unit subassemblies that are insertable into the frame. Each server unit subassembly has a chassis component which engages with a frame component on the frame. Heat can transfer from the chassis component to the frame component, but the server unit subassembly can still be moved out of the frame. In one embodiment, an air duct is located over a plurality of the frame components. Heat transfers from the frame components to air flowing through the duct. A modified capillary pumped loop is used to transfer heat from a processor of the server unit subassembly to thermal components on the frame.

7079388, Jul 18, 2006

Sep 1, 2004

10/931634

Barrett M. Faneuf - Lakewood WA, US
William E. Berry - Tacoma WA, US
Ven R. Holalkere - Dublin CA, US

Intel Corporation - Santa Clara CA

G06F 1/16

361687, 361694, 622592, 415176

An improved air-cooling system for high performance, high density electronic equipment comprises, in one embodiment, a single fan having a radial impeller, a baffle having an inlet portion to efficiently direct air into the fan intake, and a two-tiered outlet plenum to direct one airflow specifically at the highest heat-generating components and another airflow at all components. The air-cooling system is designed to provide maximum cooling for a low-height, high heat-generating electronics module such as a server. By using only a single fan that is matched to the low resistance airflow characteristics of the baffle, the air-cooling system offers significant advantages over multi-fan systems. Also described are a computer server and methods of making heat-dissipation equipment.

7115987, Oct 3, 2006

Dec 31, 2003

10/750234

Ven R. Holalkere - Dublin CA, US
Ravi Prasher - Tempe AZ, US
Stephen Montgomery - Seattle WA, US

Intel Corporation - Santa Clara CA

H01L 23/34

257713, 257719

Integrated stacked microchannel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter. The integrated stacked microchannel heat exchanger and heat spreaders are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.

7402048, Jul 22, 2008

Mar 30, 2006

11/393540

Pascal C. Meier - Sunnyvale CA, US
Michael W. Leddige - Beaverton OR, US
Mohiuddin Mazumder - San Jose CA, US
Mark Trobough - Olympia WA, US
Alok Tripathi - Beaverton OR, US
Ven R. Holalkere - Lakewood WA, US

Intel Corporation - Santa Clara CA

H01R 12/00

439 65

An apparatus includes a printed circuit board (PCB) and a first flexible conductive cable (“flex cable”) secured to the PCB. The apparatus also includes a daughter card having an end adjacent to the PCB and a second flex cable secured to the daughter card. The apparatus further includes a connector which provides an electrically conductive connection between the first flex cable and the second flex cable. The connector is positioned to sandwich a portion of the first flex cable between the connector and the PCB.

20030184967, Oct 2, 2003

Mar 29, 2002

10/112633

Ven Holalkere - Dublin CA, US
Barrett Faneuf - Lakewood WA, US

G06F001/20
G06K007/10

361/687000, 235/472010

A method and apparatus for cooling an electronic component within a handheld device comprised of an extension to the casing of the handheld device and at least one portion of a cooling apparatus within the extension.

20050169831, Aug 4, 2005

Feb 4, 2004

10/773004

Stephen Montgomery - Seattle WA, US
William Berry - Lakewood WA, US
Ven Holalkere - Lakewood WA, US
Ravi Prasher - Chandler AZ, US

D01F009/12

423447100, 977DIG001

Embodiments of the invention provide a three-dimensional nanotube structure. For one embodiment, a connector molecule is created that has bonding sites capable of bonding with one end of an open-ended nanotube segment and bonding sites capable of bonding with the corresponding bonding sites of a plurality of other connector molecules. For one embodiment, the connector molecule is cone-shaped, with base of the cone determined so as to bond with the edge of the open-ended nanotube and the point of the cone comprising a single molecule capable of bonding with the corresponding molecules of two or more other connector molecules. In one embodiment, the three-dimensional nanotube structures are incorporated into a polymer matrix to form a composite polymer having improved thermal conductivity. For one embodiment, the composite polymer is used to form efficient and cost-effective heat dissipation devices.

20060244127, Nov 2, 2006

Jun 14, 2006

11/453428

Ven Holalkere - Dublin CA, US
Ravi Prasher - Phoenix AZ, US
Stephen Montgomery - Seattle WA, US

H01L 23/34

257706000

Integrated stacked microchannrel heat exchanger and heat spreaders for cooling integrated circuit (IC) dies and packages and cooling systems employing the same are disclosed. In one embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an interstitial solder or a solderable material in combination with solder. In another embodiment, a stacked microchannel heat exchanger is operatively and thermally coupled to an IC die or package using an adhesive. In a further embodiment, a stacked microchannel heat exchanger is operatively coupled to an IC die or package by fasteners and is thermally coupled to the IC die or package using a thermal interface material. The integrated stacked microchannel heat exchanger and heat spreaders may be employed in a closed loop cooling system including a pump and a heat rejecter. The integrated stacked microchannel heat exchanger and heat spreaders are configured to support either a two-phase or a single-phase heat transfer process using a working fluid such as water.