Tolga Acikalin

20110109335, May 12, 2011

Nov 6, 2009

12/590379

Christopher R. Schroeder - Gilbert AZ, US
Christopher W. Ackerman - Phoenix AZ, US
James C. Shipley - Gilbert AZ, US
Tolga Acikalin - Chandler AZ, US
Ioan Sauciuc - Phoenix AZ, US
Michael L. Rutigliano - Chandler AZ, US
James G. Maveety - Campbell CA, US
Ashish X. Gupta - Chandler AZ, US

G01R 31/26
F28D 15/00
G01R 31/10

32475008, 16510431, 16510433, 32476201

An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

20220413236, Dec 29, 2022

Jun 25, 2021

17/358502

- Santa Clara CA, US
Sushrutha Reddy GUJJULA - Chandler AZ, US
Tolga ACIKALIN - San Jose CA, US
Ravindranath V. MAHAJAN - Chandler AZ, US
James E. JAUSSI - Hillsboro OR, US
Chia-Pin CHIU - Tempe AZ, US

G02B 6/42
H01L 25/16
H01L 23/00
H01L 23/367
H01S 3/04

Embodiments described herein may be related to apparatuses, processes, and techniques related to thermally and/or electrically coupling a thermal die to the surface of a photonic integrated circuit (PIC) within an open cavity in a substrate, where the thermal die is proximate to a laser on the PIC. Other embodiments may be described and/or claimed.

20220415742, Dec 29, 2022

Jun 23, 2021

17/356239

- Santa Clara CA, US
Tolga Acikalin - San Jose CA, US
Anand Haridass - Bangalore, IN
Vikrant Thigle - Bangalore, IN

Intel Corporation - Santa Clara CA

H01L 23/34
H01L 23/36
H01L 23/48

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a package substrate, and a die, electrically coupled to the package substrate, including a silicon substrate having a first surface and an opposing second surface; a device layer at the first surface of the silicon substrate; and a dielectric layer, having a heater trace, at the second surface of the silicon substrate.

20220416428, Dec 29, 2022

Jun 24, 2021

17/357658

- Santa Clara CA, US
Tae Young Yang - Portland OR, US
Shuhei Yamada - Hillsboro OR, US
Tolga Acikalin - San Jose CA, US
Johanny Escobar Pelaez - Zapopan, MX
Kenneth Foust - Beaverton OR, US
Jason Mix - Portland OR, US
Renzhi Liu - Portland OR, US

H01Q 9/04
H01Q 1/22

Various embodiments provide systems, devices, and methods for an antenna assembly included in an integrated circuit (IC) package. The antenna assembly may be used for near field wireless communication such as package-to-package and/or chip-to-chip communication. The antenna assembly may include a feed plate (e.g., a top feed) that is capacitively coupled to a first via and a second via. The feed plate may further be capacitively coupled to a loading structure. The first via may be conductively coupled to a ground potential. In some embodiments, the antenna assembly may further include a stub structure (e.g., an open stub or a short stub) that is conductively coupled to the second via. An impedance matching network may be coupled between the feed plate and an IC die that communicates using the antenna assembly. Other embodiments may be described and claimed.

20220199556, Jun 23, 2022

Dec 23, 2020

17/131863

- Santa Clara CA, US
Tae Young YANG - Portland OR, US
Tolga ACIKALIN - San Jose CA, US
Johanny ESCOBAR PELAEZ - Zapopan, MX
Kenneth P. FOUST - Beaverton OR, US
Chia-Pin CHIU - Tempe OR, US
Renzhi LIU - Portland OR, US
Cheng-Yuan CHIN - Las Vegas NV, US

H01L 23/66
H01L 29/93
H01L 23/14
H01Q 15/00
H01Q 1/42
H01Q 15/14
H01Q 1/22

In various aspects, a package system includes at least a first package and a second package arranged on a same side of the package carrier. Each of the first package and the second package comprises an antenna to transmit and/or receive radio frequency signals. A cover may be arranged at a distance over the first package and the second package at the same side of the package carrier as the first package and the second package. The cover comprises at least one conductive element forming a predefined pattern on a side of the cover facing the first package and the second package. The predefined pattern is configured as a frequency selective surface. The package system further includes a radio frequency signal interface wirelessly connecting the antennas of the first package and the second package. The radio frequency signal interface comprises the at least one conductive element.

20200314614, Oct 1, 2020

Mar 29, 2019

16/369560

- Cupertino CA, US
Bahareh Sadeghi - Portland OR, US
Shengbo Xu - Newark CA, US
Tolga Acikalin - San Jose CA, US
Javier Perez-Ramirez - North Plains OR, US
Richard D. Roberts - Hillsboro OR, US

H04W 4/44
H04W 8/08
H04B 10/11
H04W 8/24
G06N 20/00
H04W 12/00
H04W 12/06

The subject matter described herein presents various technical solutions for the technical problems facing autonomous vehicles (e.g., fully autonomous and semi-autonomous vehicles). To address technical problems facing wireless communication cost and latency, a heterogeneous roadside infrastructure can be used to improve the ability for a vehicle to communicate with a data source. To address technical problems facing interruption of vehicle services due to an abrupt loss of connection, a quality of service system provides the ability to determine and share quality of service information, such as location-based information, maps, interference data, and other quality of service information. To address technical problems facing high volume data upload and download between autonomous vehicles and cloud-based data services, optical wireless communication (OWC) provides increased data throughput and reduced complexity, and may be beneficial for short-range high-mobility wireless communications.

20170082861, Mar 23, 2017

Sep 21, 2015

14/859489

- Santa Clara CA, US
Tolga Acikalin - San Jose CA, US

Intel Corporation - Santa Clara CA

G02B 27/09
G01N 15/02
G02B 3/04
G02B 3/06
G02B 19/00
H01S 5/00

Systems and techniques are disclosed for flat-top intensity laser sheet beam generation. The system includes a source of light directed at a first optical component arranged to receive the light and generate spherical aberration (e.g., third order positive aberration) in the light rays. The spherical aberration results in positive aberrations in the light in a first plane and also results in the light being substantially collimated in a second plane perpendicular to the first plane. In some cases, the source of light is provided from a laser diode and the first optical component is one of an aspherical lens and a spherical lens. The system also includes a second optical component for focusing the light in the second plane. In some cases, the second optical component is a cylindrical lens.

20150285857, Oct 8, 2015

Jun 22, 2015

14/746764

- Santa Clara CA, US
Christopher W. ACKERMAN - Phoenix AZ, US
James C. SHIPLEY - Gilbert AZ, US
Tolga ACIKALIN - San Jose CA, US
Ioan SAUCIUC - Phoenix AZ, US
Michael L. RUTIGLIANO - Chandler AZ, US
James G. MAVEETY - Campbell CA, US
Ashish GUPTA - Chandler AZ, US

G01R 31/28
G01R 31/26

An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.