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Thomas E Vavul

from San Francisco, CA
Age ~61
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Also known as:
Thomas S Vavul, Thomas E Wynn, Thomas E Vavill, Tom Vavul
Phone and address:
725 Florida St UNIT 14, San Francisco, CA 94110
(415) 401-0922
Related to:
Erin Ann Cartwright, 58
Connected to:
Dimitrios Vavylonis, 52Alan C Vawdrey, 48Edward Vawser, 76James E Vawser, 51John A Vawser, 41Destri R Vawter, 44Douglas M Vawter, 75Eric F Vawter, 53Joan E Vawter, 62Joshua W Vawter, 46

Thomas Vavul Phones & Addresses

  • 725 Florida St UNIT 14, San Francisco, CA 94110 (415) 401-0922
  • 725 Florida St, San Francisco, CA 94110
  • 745 Florida St, San Francisco, CA 94110
  • 745 Florida St #14, San Francisco, CA 94110
  • 685 Haight St, San Francisco, CA 94117
  • Palo Alto, CA
  • Grand Rapids, MI
  • South Bend, IN
  • Indianapolis, IN
  • 725 Florida St UNIT 14, San Francisco, CA 94110

Work

Company: Kla-tencor Position: Senior software engineer

Education

School / High School: Purdue University 1981 to 1986

Industries

Semiconductors

Resumes

Resumes

Thomas Vavul Photo 1

Senior Software Engineer

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Location:
San Francisco, CA
Industry:
Semiconductors
Work:
Kla-Tencor
Senior Software Engineer
Education:
Purdue University 1981 - 1986

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mr. Thomas Vavul
Atlas Restaurant Supply, Inc.
Restaurant Equipment & Supplies
52245 U. S. 33 North, P. O. Box 4075, South Bend, IN 46634
(574) 272-3343

Publications

Us Patents

System And Method For Determining Reticle Defect Printability

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US Patent:
6381358, Apr 30, 2002
Filed:
Apr 27, 2000
Appl. No.:
09/559512
Inventors:
Anthony Vacca - Ceder Park TX
Thomas Vavul - San Francisco CA
Donald J. Parker - San Jose CA
Zain Saidin - Sunnyvale CA
Sterling G. Watson - Palo Alto CA
James N. Wiley - Menlo Park CA
Assignee:
KLA-Tencor Corporation - San Jose CA
International Classification:
G06K 900
US Classification:
382145, 382144, 348 86
Abstract:
A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect.

System And Method For Determining Reticle Defect Printability

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US Patent:
6731787, May 4, 2004
Filed:
Apr 30, 2002
Appl. No.:
10/137133
Inventors:
Anthony Vacca - Cedar Park TX
Thomas Vavul - San Francisco CA
Donald J. Parker - San Jose CA
Zain Saidin - Sunnyvale CA
Sterling G. Watson - Palo Alto CA
James N. Wiley - Menlo Park CA
Assignee:
KLA-Tencor Corporation - San Jose CA
International Classification:
G06K 900
US Classification:
382145, 382144, 348 86
Abstract:
A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect.

System And Method For Determining Reticle Defect Printability

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US Patent:
20020126888, Sep 12, 2002
Filed:
Feb 11, 2002
Appl. No.:
10/074857
Inventors:
Anthony Vacca - Cedar Park TX, US
Thomas Vavul - San Francisco CA, US
Donald Parker - San Jose CA, US
Zain Saidin - Sunnyvale CA, US
Sterling Watson - Palo Alto CA, US
James Wiley - Menlo Park CA, US
Assignee:
KLA-TENCOR CORPORATION
International Classification:
G06K009/00
US Classification:
382/145000
Abstract:
A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.

System And Method For Determining Reticle Defect Printability

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US Patent:
20030138138, Jul 24, 2003
Filed:
Jan 13, 2003
Appl. No.:
10/342414
Inventors:
Anthony Vacca - Cedar Park TX, US
Thomas Vavul - San Francisco CA, US
Donald Parker - San Jose CA, US
Zain Saidin - Sunnyvale CA, US
Sterling Watson - Palo Alto CA, US
James Wiley - Menlo Park CA, US
Assignee:
KLA-TENCOR CORPORATION
International Classification:
G06K009/00
US Classification:
382/145000
Abstract:
A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.

System And Method For Determining Reticle Defect Printability

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US Patent:
20040096094, May 20, 2004
Filed:
Nov 13, 2003
Appl. No.:
10/712576
Inventors:
Anthony Vacca - Cedar Park TX, US
Thomas Vavul - San Francisco CA, US
Donald Parker - San Jose CA, US
Zain Saidin - Sunnyvale CA, US
Sterling Watson - Palo Alto CA, US
James Wiley - Menlo Park CA, US
Assignee:
KLA-TENCOR CORPORATION
International Classification:
G06K009/00
US Classification:
382/141000
Abstract:
A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.

System And Method For Determining Reticle Defect Printability

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US Patent:
20050140970, Jun 30, 2005
Filed:
Feb 25, 2005
Appl. No.:
11/067179
Inventors:
Anthony Vacca - Cedar Park TX, US
Thomas Vavul - San Francisco CA, US
Donald Parker - San Jose CA, US
Zain Saidin - Sunnyvale CA, US
Sterling Watson - Palo Alto CA, US
James Wiley - Menlo Park CA, US
International Classification:
G01N021/00
US Classification:
356237200
Abstract:
A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.

System And Method For Determining Reticle Defect Printability

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US Patent:
20070140548, Jun 21, 2007
Filed:
Nov 22, 2006
Appl. No.:
11/603536
Inventors:
Anthony Vacca - Cedar Park TX, US
Thomas Vavul - San Francisco CA, US
Donald Parker - San Jose CA, US
Zain Saidin - Sunnyvale CA, US
Sterling Watson - Palo Alto CA, US
James Wiley - Menlo Park CA, US
International Classification:
G06K 9/00
US Classification:
382145000
Abstract:
A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.

System And Method For Determining Reticle Defect Printability

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US Patent:
20080133160, Jun 5, 2008
Filed:
Oct 31, 2007
Appl. No.:
11/980862
Inventors:
Anthony Vacca - Cedar Park TX, US
Thomas Vavul - San Francisco CA, US
Donald J. Parker - San Jose CA, US
Zain Saidin - Sunnyvale CA, US
Sterling G. Watson - Palo Alto CA, US
James N. Wiley - Menlo Park CA, US
International Classification:
G06F 19/00
US Classification:
702 81
Abstract:
A method and software program for determining printability of a defect on a reticle or photomask onto a substrate during processing. That is performed by creating a pixel grid image having a plurality of individual pixel images showing the defect. A gray scale value is assigned to each pixel image of the pixel grid image and a probable center pixel of the defect is selected. Then the polarity of the defect is determined, with a coarse center pixel of the defect optionally selected using the probable center defect and polarity of the defect. If a coarse center pixel is selected, then a fine center of the defect can optionally be selected from the coarse center pixel and polarity of the defect. From the center pixel the physical extent of the defect can be determined followed by the determination the transmissivity energy level of the physical extent of the defect. Optionally, the proximity of the defect to a pattern edge on the reticle or photomask can be determined using the physical extent and polarity of the defect. Then the printability of the defect can be determined from the transmissivity energy level of the defect and characteristics of the wafer fabrication process being used to produce the substrate from the reticle or photomask.
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Thomas E Vavul from San Francisco, CA, age ~61 Get Report