Srikanth Kamireddi

20180284843, Oct 4, 2018

May 9, 2018

15/975522

- Cupertino CA, US
Erik G. de Jong - San Francisco CA, US
Dele N. Memering - Langhome PA, US
Xiao Bing Cai - Suzhou, CN
Palaniappan Chinnakaruppan - Cupertino CA, US
Jong Kong Lee - Melaka, MY
Srikanth Kamireddi - Cupertino CA, US
Sawako Kamei - Cupertino CA, US
Feng Min - Changzhou, CN
Jing Zhang - Shanghai, CN
Xiang Du - Shenzhen, CN
Sai Feng Liu - Shenzhen, CN

G06F 1/16
B24B 37/04
B05D 1/02
B23K 26/402
G04B 39/00
G04B 37/00
B24C 11/00
B24C 1/08
B23K 26/364
B24B 29/00
B24B 7/22
B23K 103/00
H01Q 1/24

A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.

20170087683, Mar 30, 2017

Dec 30, 2015

14/984275

- Cupertino CA, US
Srikanth Kamireddi - Cupertino CA, US

B24B 1/00
B44C 1/22
C09K 3/14

A ceramic component and methods for making a ceramic component are disclosed. In particular, a sapphire component may be polished by positioning a compliant pad adjacent to a surface of the sapphire component. An abrasive slurry may be disposed or introduced between the compliant pad and the surface. The compliant pad may be moved with respect to the surface to produce a polished surface. The abrasive slurry may include a liquid component having a high pH level and medium-sized abrasive particulates.

20160059383, Mar 3, 2016

Sep 2, 2015

14/842962

- Cupertino CA, US
Srikanth Kamireddi - Cupertino CA, US

B24C 1/08

A polishing system and method for polishing a channel formed within a component is disclosed. The polishing system may include a tooling element operable to be positioned within a recess formed partially through a component. The tooling element may include an outer surface having a geometry corresponding to a geometry of the recess formed in the component. The tooling element forms a channel between the recess of the component and the tooling element when positioned in the recess. The system may also include a first member in fluid communication with a first opening of the channel, and a second member in fluid communication with a second opening of the channel. The second opening may be in fluid communication with the first opening via the channel. Additionally, the first and second member may be configured to continuously vary a pressure within the channel to move an abrasive slurry within the channel.

20160062405, Mar 3, 2016

Aug 26, 2015

14/836943

- Cupertino CA, US
Erik G. de Jong - Cupertino CA, US
Dale N. Memering - Cupertino CA, US
Xiao Bing Cai - Suzhou, CN
Palaniappan Chinnakaruppan - Cupertino CA, US
Jong Kong Lee - Melaka, MY
Srikanth Kamireddi - Cupertino CA, US
Sawako Kamei - Cupertino CA, US
Feng Min - Cupertino CA, US
Jing Zhang - Shanghai, CN
Xiang Du - Shenzhen, CN
Sai Feng Liu - Shenzhen, CN

G06F 1/16
B23K 26/402
B23K 26/364
B05D 1/02
B24C 1/08

A cover for an electronic device and methods of forming a cover is disclosed. The electronic device may include a housing, and a cover coupled to the housing. The cover may have an inner surface having at least one of an intermediate polish and a final polish, a groove formed on the inner surface, and an outer surface positioned opposite the inner surface. The outer surface may have at least one of the intermediate polish and the final polish. The cover may also have a rounded perimeter portion formed between the inner surface and the outer surface. The rounded perimeter portion may be positioned adjacent the groove. The method for forming the cover may include performing a first polishing process on the sapphire component using a polishing tool, and performing a second polishing process on the groove of the sapphire component forming the cover using blasting media.