US Patent:
20110009965, Jan 13, 2011
Inventors:
Sreeramamurthy ANKEM - Silver Spring MD, US
International Classification:
A61F 2/44
A61F 2/32
A61F 2/38
A61F 2/42
A61F 2/02
A61F 2/30
B32B 5/18
B32B 3/26
B28B 1/48
B05D 5/00
B28B 1/00
B23K 26/00
US Classification:
623 1711, 623 2211, 623 2014, 623 2118, 623 1719, 623 1811, 623 1718, 623 2221, 4332011, 428332, 451 38, 428221, 216 56, 264156, 427243, 264603, 2191216
Abstract:
The present invention relates to improved biomedical implantable material comprising a plurality of pores, of which one or more of the pores are interconnected below the surface of the material. The improved biomedical implantable material may be used in biomedical implant devices such as orthopedic implants, spinal implants, neurocranial implants, maxillofacial implants, and joint replacement implants. The present invention also relates to a method of preparing an improved biomedical implantable material, comprising subjecting an implantable material to a pore-forming treatment and optionally further subjecting the material to a surface-modifying treatment. The biomedical implantable material may be used in other applications, which as applications where two surfaces are contacted and bonding between the surfaces is required.