Inventors:
Trebor Heminway - Ashland MA, US
Brian Massey - Marlborough MA, US
Michael Powers - Amherst NH, US
Russel S. Sossong - Shrewsbury MA, US
Assignee:
Matsushita Electric Industrial, Co., Ltd. - Osaka
International Classification:
B23K 35/14
Abstract:
A solder preform for attaching an optical fiber having a diameter to a fiber attach pad, the solder preform comprising a body including solder at least on a bottom surface thereof, the body having a groove extending along a first face from a first end to a second, the groove being larger in width than the diameter of the optical fiber to allow unimpeded alignment of the optical fiber. The solder preform above, wherein the body is formed substantially as a geometric shape, for example, a substantially rectangular box, a substantially cubical box, substantially a cylinder, substantially a semi-cylinder, substantially a sphere, substantially a semi-sphere, and substantially a cone or any geometric shape having a flat surface and a groove found therein.