Search

Ronald J Weachock

from Pottsville, PA
Age ~68
Get Report
Also known as:
Ron J Weachock
Phone and address:
2035 High Rd, Primrose, PA 17901
(570) 544-2089
Related to:
Jessie Butensky, 36John E Schleicher, 72Diane Weber, 75Kanden Moyer, 46Bruce Hart, 65John Moyer, 92
Connected to:
Donald S Wead, 69Casey B Weade, 38Robert J Weadick, 91Ronald A Weadick, 77Shirley H Weadley, 83Andrew T Weadock, 47Christine R Weadock, 58Shawn M Weadock, 54Tiffany M Weadock, 37Ryan C Weadon, 44

Ronald Weachock Phones & Addresses

  • 2035 High Rd, Pottsville, PA 17901 (570) 544-2089
  • 230 High Rd, Pottsville, PA 17901 (570) 544-2089
  • 235 High Rd, Pottsville, PA 17901 (570) 544-2089
  • 235 High Rd, Pottsville, PA 17901 (570) 617-0182

Work

Company: Lsi corporation Dec 1995 Position: Senior member of technical staff, failure analysis engineer

Education

School / High School: PENNSYLVANIA STATE UNIVERSITY 1999 Specialities: Electrical Eng. Tech

Skills

Professional Development: Laboratory and... • ISO 9001 • OSHA • ISO 14000

Resumes

Resumes

Ronald Weachock Photo 1

Ronald Weachock Pottsville, PA

View page
Work:
LSI CORPORATION

Dec 1995 to Jan 2011
Senior Member of Technical Staff, Failure Analysis Engineer
AT&T

1995 to 1995
Senior Technical Associate
Education:
PENNSYLVANIA STATE UNIVERSITY
1999
Electrical Eng. Tech
Skills:
Professional Development: Laboratory and chemical hygiene safety, ISO 9001, OSHA, ISO 14000

Publications

Us Patents

Integrated Circuit Package Including Wire Bonds

View page
US Patent:
20090098687, Apr 16, 2009
Filed:
Oct 10, 2007
Appl. No.:
11/973859
Inventors:
Joze Eura Antol - Hamburg PA, US
John William Osenbach - Kutztown PA, US
Ronald James Weachock - Pottsville PA, US
International Classification:
H01L 21/603
US Classification:
438124, 257E21519
Abstract:
It has been found that integrated packages having dies with at least 10 bonding pads separated by a pitch of 65 μm or less are susceptible to corrosion upon wire bonding to these pads and subsequent encapsulation in a passivating material. In particular, crevices are potentially formed between the bonding wire and bonding pad that are not passivated and that promote corrosion. Avoidance of crevice formation through, for example, appropriately choosing the bonding pad and wire configuration substantially avoids such corrosion.

Moisture Barrier For A Wire Bond

View page
US Patent:
20120223432, Sep 6, 2012
Filed:
Mar 1, 2011
Appl. No.:
13/037836
Inventors:
JOHN M. DELUCCA - WAYNE PA, US
FRANK A. BAIOCCHI - ALLENTOWN PA, US
RONALD J. WEACHOCK - POTTSVILLE PA, US
JOHN W. OSENBACH - KUTZTOWN PA, US
BARRY J. DUTT - PEN ARGYL PA, US
Assignee:
LSI Corporation - Milpitas CA
International Classification:
H01L 23/49
H01L 21/60
US Classification:
257771, 257780, 257741, 438612, 257E23025, 257E21509
Abstract:
An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface

Moisture Barrier For A Wire Bond

View page
US Patent:
20140349475, Nov 27, 2014
Filed:
May 21, 2014
Appl. No.:
14/283602
Inventors:
- Milpitas CA, US
Ronald J. Weachock - Pottsville PA, US
Barry J. Dutt - Argyl PA, US
Frank A. Baiocchi - Allentown PA, US
John W. Osenbach - Kutztown PA, US
Assignee:
LSI Corporation - Milpitas CA
International Classification:
H01L 23/00
US Classification:
438612
Abstract:
An electronic device comprising a bond pad on a substrate and a wire bonded to the bond pad. The device further comprises an intermetallic compound interface located between the bond pad and the wire and a silicon nitride or silicon carbonyl layer covering the intermetallic compound interface
Control profile
Ronald J Weachock from Pottsville, PA, age ~68 Get Report