Robert L Healton

6428713, Aug 6, 2002

Oct 1, 1999

09/410713

John Carl Christenson - Kokomo IN
Steven Edward Staller - Russiaville IN
John Emmett Freeman - Kempton IN
Troy Allan Chase - Kokomo IN
Robert Lawrence Healton - Kokomo IN
David Boyd Rich - Kokomo IN

Delphi Technologies, Inc. - Troy MI

H01L 2100

216 2, 216 33, 216 41, 216 59, 216 67, 216 79, 438719, 438735

A micro-electro-mechanical structure including a semiconductor layer mounted to an annular support structure via an isolation layer wherein the semiconductor layer is micromachined to form a suspended body having a plurality of suspension projections extending from the body to the rim and groups of integral projections extending toward but spaced from the rim between said suspension projections. Each projection in said groups has a base attached to the body and a tip proximate the rim. The structure includes a plurality of inward projections extending from and supported on the rim and toward the body. Each such projection has a base attached to the rim and a tip proximate the body; wherein the grouped projections and the inward projections are arranged in an interdigitated fashion to define a plurality of proximate projection pairs independent of the suspension elements such that a primary capacitive gap is defined between the projections of each projection pair. Also, a process is disclosed for fabricating the micro-electro-mechanical structure including the steps of removing a highly doped etch termination layer and thereafter etching through a lightly doped epitaxial layer to thereby define and release the structure.

6750152, Jun 15, 2004

Oct 1, 1999

09/411339

John Carl Christenson - Kokomo IN
Steven Edward Staller - Russiaville IN
John Emmett Freeman - Kempton IN
Troy Allan Chase - Kokomo IN
Robert Lawrence Healton - Kokomo IN

Delphi Technologies, Inc. - Troy MI

H01L 2100

438735, 73517 R, 216 2, 216 61, 216 86, 438 17, 438719, 438 8

A semiconductor wafer is etched to create an array of MEMS devices and at the same time, test sites having geometry which represent critical geometry of the MEMS devices. Probe contacts are provided in the test sites to permit measurement of resistance and capacitance between test site geometry as a way of determining the effectiveness of the etch. One test site comprises a ladder of semiconductor structures separated by gaps of graded width. Another test site comprises finger structures formed over a cavity and the probe contacts are located so as to detect inter-finger capacitance and resistance (or continuity) as well as intra-finger resistance.

20020125208, Sep 12, 2002

May 9, 2002

10/141740

John Christenson - Kokomo IN, US
Steven Staller - Russiaville IN, US
John Freeman - Kempton IN, US
Troy Chase - Kokomo IN, US
Robert Healton - Kokomo IN, US
David Rich - Kokomo IN, US

DELPHI TECHNOLOGIES, INC.

C23F001/00

216/002000

A micro-electro-mechanical structure including a semiconductor layer mounted to an annular support structure via an isolation layer wherein the semiconductor layer is micromachined to form a suspended body having a plurality of suspension projections extending from the body to the rim and groups of integral projections extending toward but spaced from the rim between said suspension projections. Each projection in said groups has a base attached to the body and a tip proximate the rim. The structure includes a plurality of inward projections extending from and supported on the rim and toward the body. Each such projection has a base attached to the rim and a tip proximate the body; wherein the grouped projections and the inward projections are arranged in an interdigitated fashion to define a plurality of proximate projection pairs independent of the suspension elements such that a primary capacitive gap is defined between the projections of each projection pair. Also, a process is disclosed for fabricating the micro-electro-mechanical structure including the steps of removing a highly doped etch termination layer and thereafter etching through a lightly doped epitaxial layer to thereby define and release the structure.

54279755, Jun 27, 1995

May 10, 1993

8/059222

Douglas R. Sparks - Kokomo IN
Ronald E. Brown - Kokomo IN
Robert L. Healton - Kokomo IN
John C. Christenson - Kokomo IN

Delco Electronics Corporation - Kokomo IN

H01L 213065

437 79

A method for micromachining the surface of a silicon substrate which encompasses a minimal number of processing steps. The method involves a preferential etching process in which a chlorine plasma etch is capable of laterally etching an N+ buried layer beneath the surface of the bulk substrate. Such a method is particularly suitable for forming sensing devices which include a small micromachined element, such as a bridge, cantilevered beam, membrane, suspended mass or capacitive element, which is supported over a cavity formed in a bulk silicon substrate. The method also permits the formation of such sensing devices on the same substrate as their controlling integrated circuits. This invention also provides novel methods by which such structures can be improved, such as through optimizing the dimensional characteristics of the micromachined element or by encapsulating the micromachined element.

55311210, Jul 2, 1996

Jan 19, 1995

8/375040

Douglas R. Sparks - Kokomo IN
Ronald E. Brown - Kokomo IN
Robert L. Healton - Kokomo IN
John C. Christenson - Kokomo IN

Delco Electronics Corporation - Kokomo IN

G01L 1302
G01L 1306

73716

A method is disclosed for micromachining the surface of a silicon substrate which encompasses a minimal number of processing steps. The method involves a preferential etching process in which a chlorine plasma etch is capable of laterally etching an N+ buried layer beneath the surface of the bulk substrate. Such a method is particularly suitable for forming sensing devices which include a small micromachined element, such as a bridge, cantilevered beam, membrane, suspended mass or capacitive element, which is supported over a cavity formed in a bulk silicon substrate. The method also permits the formation of such sensing devices on the same substrate as their controlling integrated circuits. This invention also provides novel methods by which such structures can be improved, such as through optimizing the dimensional characteristics of the micromachined element or by encapsulating the micromachined element.