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Robert G Gargione

from Chester, NJ
Age ~49
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Also known as:
Bob G Gargione, Rob G Gargione, Michelle Gargione
Phone and address:
4 Beacon Hill Dr, Chester, NJ 07930
(302) 376-5262
Related to:
Michell GargioneDanielle N Gomes, 44Gabrielle Gomes, 36Barbara R Gomes, 77Douglas S Gomes, 60Dennis Gomes
Connected to:
Andrew J Gargiso, 31Albert A Gargiulo, 78Antonio S Gargiulo, 68Brandon Gargiulo, 31Christine M Gargiula, 83Elvira Gargiulo, 109Gerardo Gargiulo, 91Jerry Gargiulo, 92Julia B Gargiulo, 55Louisa R Gargiulo, 64

Robert Gargione Phones & Addresses

  • 4 Beacon Hill Dr, Chester, NJ 07930 (302) 376-5262
  • Dewey Beach, DE
  • 227 Bucktail Dr, Middletown, DE 19709
  • 150 Littondale Ct, Middletown, DE 19709
  • New Castle, DE
  • Philadelphia, PA
  • Egg Harbor City, NJ

Publications

Us Patents

Silicate Composite Polishing Pad

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US Patent:
8257152, Sep 4, 2012
Filed:
Nov 12, 2010
Appl. No.:
12/945557
Inventors:
Andrew R. Wank - Avondale PA, US
Donna M. Alden - Bear DE, US
Joseph K. So - Wilmington DE, US
Robert Gargione - Middletown DE, US
Mark E. Gazze - Lincoln University PA, US
David Drop - West Grove PA, US
Mai Tieu Banh - Oakville, CA
Shawn Riley - Wilmington DE, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B24D 11/00
US Classification:
451526, 451527, 451534
Abstract:
The invention provides a polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. It includes a polymeric matrix having a polishing surface. Polymeric microelements are distributed within the polymeric matrix and at the polishing surface of the polymeric matrix. Silicate-containing regions distributed within each of the polymeric microelements coat less than 50 percent of the outer surface of the polymeric microelements. Less than 0. 1 weight percent total of the polymeric microelements are associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm.

Hollow Polymeric-Silicate Composite

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US Patent:
8357446, Jan 22, 2013
Filed:
Nov 12, 2010
Appl. No.:
12/945587
Inventors:
Andrew R. Wank - Avondale PA, US
Donna M. Alden - Bear DE, US
Mark E. Gazze - Lincoln University PA, US
Robert Gargione - Middletown DE, US
Joseph K. So - Wilmington DE, US
David Drop - West Grove PA, US
Mai Tieu Banh - Oakville, CA
Shawn Riley - Wilmington DE, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
D06N 7/04
B32B 3/26
B24D 18/00
B24D 3/02
C09C 1/68
US Classification:
428147, 4283055, 51293, 51308
Abstract:
The invention provides a plurality of polymeric particles embedded with silicate that include gas-filled polymeric microelements. The gas-filled polymeric microelements have a shell and a density of 5 g/liter to 200 g/liter. The shell having an outer surface and a diameter of 5 μm to 200 μm with silicate particles embedded in the polymer. The silicate particles have an average particle size of 0. 01 to 3 μm. The silicate-containing regions are spaced to coat less than 50 percent of the outer surface of the polymeric microelements; and less than 0. 1 weight percent total of the polymeric microelements is associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric micro elements agglomerated with silicate particles to an average cluster size of greater than 120 μm.

Method Of Forming Silicate Polishing Pad

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US Patent:
20120117889, May 17, 2012
Filed:
Nov 12, 2010
Appl. No.:
12/945504
Inventors:
Donna M. Alden - Bear DE, US
Andrew R. Wank - Avondale PA, US
Robert Gargione - Middletown DE, US
Mark E. Gazze - Lincoln University PA, US
Joseph K. So - Wilmington DE, US
David Drop - West Grove PA, US
Shawn Riley - Wilmington DE, US
Mai Tieu Banh - Oakville, CA
International Classification:
B24D 11/00
US Classification:
51308
Abstract:
The method provides a method of preparing a silicate-containing polishing pad useful for polishing at least one of semiconductor, magnetic and optical substrates. The method includes introducing a feed stream of gas-filled polymeric microelements into a gas jet. The polymeric microelements have varied densities, varied wall thickness and varied particle size. Passing the gas-filled microelements in the gas jet adjacent a Coanda block, the Coanda block having a curved wall for separates the polymeric microelements with Coanda effect, inertia and gas flow resistance. The coarse polymeric microelements from the curved wall of the Coanda block to clean the polymeric microelements. The polymeric microelements collected contain less than 0.1 weight percent total of the polymeric microelements being associated with i) silicate particles having a particle size of greater than 5 μm; ii) silicate-containing regions covering greater than 50 percent of the outer surface of the polymeric microelements; and iii) polymeric microelements agglomerated with silicate particles to an average cluster size of greater than 120 μm. Inserting the cleaned polymeric microelements into a polymeric matrix forms the polishing pad.
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Robert G Gargione from Chester, NJ, age ~49 Get Report