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Michael Previti Phones & Addresses

  • Canton, GA
  • Rotonda West, FL
  • Delray Beach, FL
  • Egg Harbor Twp, NJ
  • Suwanee, GA
  • Alpharetta, GA
  • New Britain, CT
  • West Warwick, RI
  • Torrington, CT
  • Atlanta, GA
  • Burlington, CT
  • Lehigh Acres, FL

Professional Records

Real Estate Brokers

Michael Previti Photo 1

Michael Previti, Plantation FL Mortgage Loan Originator, NMLS

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Specialties:
Purchase Loan
Refinancing
Home Equity
Mortgage Planning
Work:
NationsMortgage
300 S Pine Island Rd Ste 304, Plantation, FL 33324
(954) 424-1818 (Office), (954) 298-9900 (Cell), (954) 424-1818 (Fax)
Experience:
21 years
Licenses:
326123 (NMLS)
Links:
Site
Michael Previti Photo 2

Michael Previti, Plantation FL Mortgage Loan Originator

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Specialties:
Purchase Loan
Refinancing
Home Equity
Mortgage Planning
Work:
Nations Mortgage
8751 W Broward Blvd Ste 404, Plantation, FL 33322
(954) 424-1818 (Office), (954) 298-9900 (Cell), (954) 827-8410 (Fax)
Experience:
21 years
Links:
Site

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mr. Michael Previti
President
Nations Mortgage Capital, Inc.
Mortgage Brokers
8751 W Broward Blvd SUITE 404, Plantation, FL 33322
(954) 424-1818, (954) 827-8410
Michael Previti
President
Nations Mortgage Capital, Inc
Mortgage Brokers
8751 W Broward Blvd, Fort Lauderdale, FL 33324
300 S Pne Is Rd, Fort Lauderdale, FL 33324
(954) 424-1818, (954) 827-8410

Publications

Us Patents

Thermoplastic/Thermoset Composition Material And Method Of Attaching A Wafer To A Substrate

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US Patent:
20070020810, Jan 25, 2007
Filed:
Jun 16, 2006
Appl. No.:
11/455226
Inventors:
Brian Eisenach - Alpharetta GA, US
Michael Previti - Alpharetta GA, US
Mark Wilson - Cumming GA, US
Avin Dhoble - Alpharetta GA, US
Assignee:
Cookson Singapore Pte Ltd. - Singapore
International Classification:
H01L 21/00
H01L 23/48
H01L 29/40
H01L 23/52
B32B 33/00
B32B 9/00
US Classification:
438118000, 428040100
Abstract:
A process for mounting a wafer on a substrate includes applying a pre-applied die attach on a backside of the wafer with a composition having a thermoplastic portion and a thermoset portion. The composition has a predetermined cure temperature. The process further includes heating the wafer to a temperature sufficient to remove solvents from the thermoplastic portion of the composition below the cure temperature, mounting the wafer on the substrate, and heating the wafer and the substrate to a temperature above the cure temperature to cure the thermoset portion of the pre-applied die attach composition. A composition for performing the process is further disclosed.

Bus Bar System For Heatable Glass

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US Patent:
20060042076, Mar 2, 2006
Filed:
Aug 24, 2004
Appl. No.:
10/925306
Inventors:
Michael Previti - Alpharetta GA, US
International Classification:
H01P 11/00
US Classification:
029825000, 029600000, 343713000, 343704000
Abstract:
A composition for forming an electrically conductive bus, which comprises a polymer and conductive filler particles. A composition for forming an electrically conductive bus, comprising silver-based flakes within a polymer adhesive carrier such as polyurethane for forming a conductive bus for vehicle glass. A method for forming a glass laminate structure such as a windshield, with an electrically conductive bus for delivering current to a conductor for resistive heating of the structure.
Michael A Previti from Canton, GA, age ~54 Get Report