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Michael S Kuszaj

from Brooklyn, CT
Age ~66
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Also known as:
Michael Stanley Kuszay, Michaek S Kuszaj, William S Fletcher
Phone and address:
38 Westview Dr, Brooklyn, CT 06234
Related to:
Mark Alan Jones, 63
Connected to:
Linda M Kuszaj, 74Adam B Kuszak, 30Breanna Kuszak, 32Kiela M Kuszak, 28Shauna J Kuszak, 37Jeanette Kuszlyk, 55Carol Kuszmaul, 65Kyle K Kuszpit, 50Desiree Kusztyb, 39Jok A Kut, 32

Michael Kuszaj Phones & Addresses

  • 38 Westview Dr, Brooklyn, CT 06234
  • 77 Dog Hill Rd, Dayville, CT 06241
  • Danielson, CT
  • Indianapolis, IN
  • Atlanta, GA

Work

Position: Manager, circuit prcoessing technology

Industries

Defense & Space

Resumes

Resumes

Michael Kuszaj Photo 1

Manager, Circuit Prcoessing Technology

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Location:
Brooklyn, CT
Industry:
Defense & Space
Work:

Manager, Circuit Prcoessing Technology
Rogers Corproation
Manager, Circuit Prcoessing Technology Group

Publications

Us Patents

Fluoropolymer Composites Containing Two Or More Ceramic Fillers To Achieve Independent Control Of Dielectric Constant And Dimensional Stability

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US Patent:
20050244662, Nov 3, 2005
Filed:
Mar 18, 2005
Appl. No.:
11/083551
Inventors:
Allen Horn - Danielson CT, US
Robert Daigle - Sterling CT, US
Michael Kuszaj - Dayville CT, US
International Classification:
B32B015/08
US Classification:
428469000, 428421000, 428701000
Abstract:
A dimensionally stable high K′ microwave laminate comprises independent control of the K′ and CTE (coefficient of thermal expansion) of the fluoropolymer microwave laminates. The laminate comprises a composite having at least two types of ceramic filler. At least one type of ceramic filler exhibits a K′ of greater than 30. The two or more fillers are necessary to be able to independently control the K′ and the CTE of the composite, thereby achieving a dimensional stability of absolute magnitude less than 0.1% change. The present invention allows the manufacture of microwave laminate with any specified K′ (within the achievable range) and the XY CTE of the material nearly matched to that of copper, resulting in good dimensioned stability during circuit fabrication.

Circuit Laminates, And Method Of Manufacture Thereof

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US Patent:
20110229709, Sep 22, 2011
Filed:
Mar 22, 2011
Appl. No.:
13/053417
Inventors:
Michael S. Kuszaj - Brooklyn CT, US
Assignee:
ROGERS CORPORATION - Rogers CT
International Classification:
H05K 1/03
H05K 3/00
H05K 3/07
H05K 3/42
B32B 5/18
B32B 7/12
US Classification:
4283171, 29846, 29847, 29852, 4283044
Abstract:
A method of making a supported foam circuit laminate comprises fitting a dielectric foam substrate having a shape defined by edges to a support frame having a thickness, an inner rim and an outer rim, wherein the edges of the dielectric foam substrate are flush with the inner rim of the support frame, and the dielectric foam substrate has a thickness that is greater than the thickness of the support frame; disposing an electrically conductive layer onto a side of the dielectric foam substrate and the support frame, wherein the edges of the electrically conductive layer overlap the inner rim of the support frame; and co-laminating the electrically conductive layer to the dielectric foam substrate and the overlapped support frame under heat and pressure to provide a supported foam circuit laminate.
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Michael S Kuszaj from Brooklyn, CT, age ~66 Get Report