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Mark O Landram

from Saint Louis, MO
Age ~68
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Also known as:
Mark Owen Landram, Maria Landram, Michael Landram, Mark M
Phone and address:
13005 Pingry Pl, Saint Louis, MO 63131
(314) 603-6407
Related to:
Susan ThompsonDorothy Benson, 98Richard W Gillette, 66Mary Benson, 74William Benson, 75Brian Benson
Connected to:
Shirley Landram, 54Denise Landrau, 60Donna K Landrau, 63Kimberly J Landrau, 56Mariely Landrau, 45Michelle L Landrau, 40Rafael A Landrau, 64Selima Landrau, 40Tashana K Landray, 49Chanel P Landreaux, 55

Mark Landram Phones & Addresses

  • 13005 Pingry Pl, Saint Louis, MO 63131 (314) 603-6407
  • 16761 Newbury Xing, Florissant, MO 63034
  • Flor, MO
  • East Alton, IL
  • 13005 Pingry Pl, Saint Louis, MO 63131

Work

Company: Boeing Jul 1, 2010 Position: Supplier program manager

Education

School / High School: Columbia High School

Skills

Supplier Management • Lean Manufacturing • Materials Science • Mechanical Engineering • Geometric Dimensioning and Tolerancing • Quality Assurance • Design For Manufacturing • Value Stream Mapping • Electronics Manufacturing • Cnc Manufacturing • Continuous Process Improvement • Earned Value Management • Statistical Process Control • Root Cause Analysis • Quality Management • Supply Chain Management

Interests

Science and Technology

Industries

Aviation & Aerospace

Resumes

Resumes

Mark Landram Photo 1

Supplier Program Manager

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Location:
Atlanta, GA
Industry:
Aviation & Aerospace
Work:
Boeing
Supplier Program Manager
Education:
Columbia High School
Georgia Tech
Washington University In St. Louis
Masters, Master of Science In Mechanical Engineering Washington University In St. Louis
Masters, Materials Science Georgia Institute of Technology
Bachelors, Mechanical Engineering
Skills:
Supplier Management
Lean Manufacturing
Materials Science
Mechanical Engineering
Geometric Dimensioning and Tolerancing
Quality Assurance
Design For Manufacturing
Value Stream Mapping
Electronics Manufacturing
Cnc Manufacturing
Continuous Process Improvement
Earned Value Management
Statistical Process Control
Root Cause Analysis
Quality Management
Supply Chain Management
Interests:
Science and Technology

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mark Landram
Engineer
Micro Medical Instruments Inc
Medical Devices · Mfg Surgical/ Medical Instruments
123 Clf Cave Rd, Saint Louis, MO 63129
(314) 845-3663, (314) 845-3664

Publications

Us Patents

Cryogenic Glass-To-Metal Seal

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US Patent:
47265078, Feb 23, 1988
Filed:
Dec 4, 1986
Appl. No.:
6/938109
Inventors:
Mark O. Landram - Florissant MO
Assignee:
The United States of America as represented by the Secretary of the Air
Force - Washington DC
International Classification:
B23K 120
B23K 102
US Classification:
228124
Abstract:
A novel low temperature vacuum seal and method of making same for joining a nonmetallic element, such as an optical port, to a metallic element is described which comprises first and second thin metallic layers applied to the nonmetallic element to provide substantial adhesion and solderability to the nonmetallic element, and a third metallic layer applied to the metallic element to provide solderability to the metallic element, the nonmetallic and metallic elements being joined by a layer of low temperature solder interfacing their respective solder surfaces. A further thin metallic layer may be applied to the nonmetallic element to provide substantial wetability to the solderable second layer.

Cryogenic Glass-To-Metal Seal

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US Patent:
46490850, Mar 10, 1987
Filed:
Aug 29, 1984
Appl. No.:
6/645389
Inventors:
Mark O. Landram - Florissant MO
Assignee:
The United States of America as represented by the Secretary of the Air
Force - Washington DC
International Classification:
H01L 2912
US Classification:
428620
Abstract:
A novel low temperature vacuum seal and method of making same for joining a nonmetallic element, such as an optical port, to a metallic element is described which comprises first and second thin metallic layers applied to the nonmetallic element to provide substantial adhesion and solderability to the nonmetallic element, and a third metallic layer applied to the metallic element to provide solderability to the metallic element, the nonmetallic and metallic elements being joined by a layer of low temperature solder interfacing their respective solder surfaces. A further thin metallic layer may be applied to the nonmetallic element to provide substantial wetability to the solderable second layer.
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Mark O Landram from Saint Louis, MO, age ~68 Get Report