Search

Mario Bran Phones & Addresses

  • Henderson, NV
  • North Las Vegas, NV
  • Las Vegas, NV
  • Dolan Springs, AZ
  • Lawndale, CA
  • Big Bear Lake, CA
  • 15322 Eastwood Ave, Lawndale, CA 90260 (310) 977-3617

Work

Position: Production Occupations

Education

Degree: Associate degree or higher

Resumes

Resumes

Mario Bran Photo 1

Server Assistant

View page
Location:
14337 north Bullhead Rd, Dolan Springs, AZ 86441
Industry:
Information Technology And Services
Work:
Cisco Dream Team Gsx Aug 2017 - Aug 2017
Lead

Nba Dream Team Summer League Jul 2017 - Jul 2017
Lead

Cisco Live Dreamteam Jul 2016 - Jul 2016
Intern

College of Southern Nevada Aug 2015 - Dec 2015
Computer Lab Assistant

Cisco Dreamteam Gsx Aug 2015 - Sep 2015
Intern
Education:
College of So. Nv High School East 2009 - 2014
Associates, Telecommunications, Computer Systems
Skills:
Integrity
Problem Solving
Communication
Leadership
Customer Service
Troubleshooting
Management
Computer Hardware
Windows 7
Cross Functional Team Leadership
Cisco Networking
Interests:
Teaching
Playing Sports
Gardening
Yoga
Skydiving
Traveling
Scuba Diving
Hiking
Camping
Fitness
Languages:
English
Spanish
Mario Bran Photo 2

Mario Bran

View page

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mario Bran
Owner
The Quality Cleaners
Drycleaning Plant
6795 W Flamingo Rd, Las Vegas, NV 89103
(702) 889-8089
Mario S. Bran
Director
Corporate Janitorial and Maintenance Inc
2688 S Rainbow Blvd, Las Vegas, NV 89146
Mario S. Bran
Director, President, Secretary, Treasurer
Gloria's Treasure Chest Consignment
2688 S Rainbow Blvd, Las Vegas, NV 89146
Mario Bran
Director, President, Secretary, Treasurer
Corporate Housewives Cleaning Service Inc
7470 Commercial Way, Henderson, NV 89011
Mario Bran
Director, Secretary
Gleamtek
2700 E Sunset Rd, Las Vegas, NV 89120
Mario Bran
President, Secretary, Treasurer, Director
Specifically 5 Star Inc
Building Maintenance Services
7470 Commercial Way, Henderson, NV 89011
Mario Bran
Director, President, Secretary, Treasurer
Corporate Janitorial Cleaning Service Inc
1030 Lone Pne, Henderson, NV 89002
PO Box 92222, Henderson, NV 89009

Publications

Wikipedia References

Mario Bran Photo 3

Mario Alfonso Bran

Us Patents

Wafer Cleaning Method

View page
US Patent:
6463938, Oct 15, 2002
Filed:
Sep 13, 2001
Appl. No.:
09/953504
Inventors:
Mario E. Bran - Garden Grove CA
Assignee:
Verteq, Inc. - Santa Ana CA
International Classification:
B08B 312
US Classification:
134 13, 134 1, 134 2, 134 6, 134 7, 134 255, 134 32, 134 34, 134105, 134147, 134148, 134184, 134199, 134902
Abstract:
Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe. In one arrangement, fluid is sprayed onto both sides of a wafer while a probe is positioned close to an upper side.

Megasonic Probe Energy Attenuator

View page
US Patent:
6679272, Jan 20, 2004
Filed:
Aug 3, 2001
Appl. No.:
09/922509
Inventors:
Mario E. Bran - Garden Grove CA
Michael B. Olesen - Yorba Linda CA
Yi Wu - Irvine CA
Assignee:
Verteq, Inc. - Santa Ana CA
International Classification:
C25F 500
US Classification:
134 13, 134 1, 134 34, 134902, 134137, 134148, 134151, 134153, 134184, 134198, 34255, 310311, 310320, 310367, 310368, 310369, 310370
Abstract:
The present invention provides a megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate. The apparatus includes a probe having one of a variety of cross-sections configured to decrease the ratio of normal-incident waves to shallow-angle waves. One such cross-section includes a channel running along a portion of the lower edge of the probe. Another cross-section includes a narrow lower edge of the probe. Another cross-section is elliptical. Another cross-section includes transverse bores originating in the lower edge of the probe. As an alternative to, or in addition to, providing a probe having a cross-section other than circular, the present invention may also provide a probe having a roughened lower surface.

Wafer Cleaning

View page
US Patent:
6681782, Jan 27, 2004
Filed:
Sep 12, 2002
Appl. No.:
10/243463
Inventors:
Mario E. Bran - Garden Grove CA
Assignee:
Verteq, Inc. - Santa Ana CA
International Classification:
B08B 312
US Classification:
134148, 134 13, 134 254, 134147, 134151, 134153, 134184, 134199, 134902
Abstract:
Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe. In one arrangement, fluid is sprayed onto both sides of a wafer while a probe is positioned close to an upper side.

Wafer Cleaning

View page
US Patent:
6684891, Feb 3, 2004
Filed:
Sep 12, 2002
Appl. No.:
10/243486
Inventors:
Mario E. Bran - Garden Grove CA
Assignee:
Verteq, Inc. - Santa Ana CA
International Classification:
B08B 312
US Classification:
134148, 134147, 134184, 134199, 134902, 134 13
Abstract:
Semiconductor wafers are cleaned using megasonic energy to agitate cleaning fluid applied to the wafer. A source of energy vibrates an elongated probe which transmits the acoustic energy into the fluid. The probe has a solid cleaning rod and a flared or stepped rear base. In one form, the probe is made of one piece, and in another, the rod fits into a socket in the base. This enables a rod to be made of material which is compatible with the cleaning solution, while the base may be of a different material. A heat transfer member acoustically coupled to the probe base and to a transducer conducts heat away from the transducer. A housing for the heat transfer member and the transducer supports those components and provides means for conducting coolant through the housing to control the temperature of the transducer. In another arrangement, an end of the housing is coupled between the transducer and the probe. In one arrangement, fluid is sprayed onto both sides of a wafer while a probe is positioned close to an upper side.

Apparatus And Methods For Reducing Damage To Substrates During Megasonic Cleaning Processes

View page
US Patent:
6892738, May 17, 2005
Filed:
Jan 20, 2004
Appl. No.:
10/760596
Inventors:
Mario E. Bran - Garden Grove CA, US
Michael B. Olesen - Yorba Linda CA, US
Yi Wu - Irvine CA, US
Assignee:
Goldfinger Technologies, LLC - Allentown PA
International Classification:
C25F005/00
US Classification:
134 13, 134 34, 134137, 134148, 134151, 134153, 134184, 134198, 134902, 310311, 310320, 310367, 310368, 310369, 310370, 438906
Abstract:
The present invention provides a megasonic cleaning apparatus configured to provide effective cleaning of a substrate without causing damage to the substrate. The apparatus includes a probe having one of a variety of cross-sections configured to decrease the ratio of normal-incident waves to shallow-angle waves. One such cross-section includes a channel running along a portion of the lower edge of the probe. Another cross-section includes a narrow lower edge of the probe. Another cross-section is elliptical. Another cross-section includes transverse bores originating in the lower edge of the probe. As an alternative to, or in addition to, providing a probe having a cross-section other than circular, the present invention may also provide a probe having a roughened lower surface.

Method Of Cleaning A Side Of A Thin Flat Substrate By Applying Sonic Energy To The Opposite Side Of The Substrate

View page
US Patent:
7117876, Oct 10, 2006
Filed:
Dec 3, 2003
Appl. No.:
10/726774
Inventors:
Mario E. Bran - Garden Grove CA, US
Assignee:
Akrion Technologies, Inc. - Wilmington DE
International Classification:
B08B 3/12
US Classification:
134 13, 134 1, 134 6, 134 7, 134 255, 134 32, 134 34, 134 36, 134902
Abstract:
A method of processing thin flat articles, particularly semiconductor wafers, utilizing sonic energy. In one aspect, the invention is a method comprising: supporting a substrate in a generally horizontal orientation and transmitting sonic energy to the substrate while flowing liquid onto both sides of the substrate to loosen particles on both sides of the substrate while maintaining said orientation. In another aspect, the invention is a cleaning method comprising: applying cleaning fluid to one side of a thin flat article while supporting the article in a generally horizontal orientation; and applying energy to the other one of the sides with sufficient power to produce vibration on the one side in the area of the cleaning fluid to loosen particles on the one side, while maintaining said orientation.

Reciprocating Megasonic Probe

View page
US Patent:
7185661, Mar 6, 2007
Filed:
May 6, 2002
Appl. No.:
10/140029
Inventors:
Mario E. Bran - Garden Grove CA, US
Assignee:
Akrion Technologies, Inc. - Wilmington DE
International Classification:
B08B 7/04
US Classification:
134 13, 134 1, 134 33, 134184, 134902
Abstract:
A method of cleaning a substrate comprises placing the substrate on a rotating fixture, placing a liquid on at least one side of the substrate, and creating a standing wave of megasonic energy oriented generally parallel to the substrate. The standing wave generates an associated pattern of high-agitation regions in the liquid. The method further comprises moving the standing wave back-and-forth so as to move the pattern of high-agitation regions about with respect to the substrate. An apparatus for cleaning substrates comprises a support to rotate the substrate about a first axis, and a transmitter extending generally parallel to a surface of the substrate. The apparatus further comprises a megasonic transducer in acoustically coupled relation to the transmitter, and a reciprocation drive in fixed relation to the transmitter. The reciprocation drive moves the transmitter back-and-forth within a plane generally parallel to the surface of the substrate.

Apparatus For Megasonic Processing Of An Article

View page
US Patent:
7211932, May 1, 2007
Filed:
Mar 22, 2006
Appl. No.:
11/386634
Inventors:
Mario E. Bran - Garden Grove CA, US
Assignee:
Akrion Technologies, Inc. - Wilmington DE
International Classification:
H01L 41/09
US Classification:
310328, 31032318
Abstract:
A transducer assembly used for the megasonic processing of an article. In one aspect, the transducer assembly comprises: a vibration transmitter having a rear portion adapted to be supported adjacent to an article to be processed and having an elongated forward portion adapted to extend close to a surface of the article so that when a fluid is applied to the surface of the article, a meniscus of the fluid is formed between the elongated forward portion and the surface of the article; and a transducer coupled to the rear portion of the transmitter, the transducer adapted to oscillate at a frequency for propagating megasonic energy through the elongated forward portion of the transmitter and into the meniscus of the fluid. In one embodiment, the transducer assembly can further comprise a housing with at least one opening for flowing a gas into a space in the housing in contact with the transducer.
Mario S Bran from Henderson, NV, age ~72 Get Report