US Patent:
20120086113, Apr 12, 2012
Inventors:
Brian Smith - Cambridge MA, US
Maria Cardoso - Cambridge MA, US
International Classification:
H01L 23/28
H01L 21/56
US Classification:
257687, 438124, 438126, 257E23116, 257E23141, 257E21502
Abstract:
Embodiments of the invention relate to a method for creating a flexible circuit, including defining a cavity in a top surface of a substrate before disposing a semiconductor chip within the cavity, such that a backside of the chip is disposed beneath the top surface of the substrate and above a bottom surface of the cavity. The method also includes forming a flexible connecting layer on the top surface of the substrate and extending over the chip. Other embodiments relate to a flexible circuit including a substrate defining a cavity in a top surface thereof. The cavity has encapsulant and a chip disposed therein, wherein a frontside of the chip is substantially coplanar with the top surface of the substrate. A flexible connecting layer is disposed on the top surface of the substrate and is partially supported by the substrate.