US Patent:
20200234982, Jul 23, 2020
Inventors:
- Santa Clara CA, US
Jeongmin LEE - San Ramon CA, US
Paul CONNORS - San Mateo CA, US
Dale R. DU BOIS - Los Gatos CA, US
Prashant Kumar KULSHRESHTHA - San Jose CA, US
Karthik Thimmavajjula NARASIMHA - San Francisco CA, US
Brett BERENS - San Jose CA, US
Kalyanjit GHOSH - Pleasanton CA, US
Jianhua ZHOU - Campbell CA, US
Ganesh BALASUBRAMANIAN - Fremont CA, US
Kwangduk Douglas LEE - Redwood City CA, US
Juan Carlos ROCHA-ALVAREZ - San Carlos CA, US
Hiroyuki OGISO - Sunnyvale CA, US
Liliya KRIVULINA - Santa Clara CA, US
Rick GILBERT - San Jose CA, US
Mohsin WAQAR - Alameda CA, US
Venkatanarayana SHANKARAMURTHY - San Jose CA, US
Hari K. PONNEKANTI - San Jose CA, US
International Classification:
H01L 21/67
H01J 37/32
H01L 21/687
Abstract:
Implementations disclosed herein describe a bevel etch apparatus within a loadlock bevel etch chamber and methods of using the same. The bevel etch apparatus has a mask assembly within the loadlock bevel etch chamber. During an etch process, the mask assembly delivers a gas flow to control bevel etch without the use of a shadow frame. As such, the edge exclusion at the bevel edge can be reduced, thus increasing product yield.