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Lawrence I Frazee

from Streamwood, IL
Age ~41
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Also known as:
Larry I Frazee, Lawrence I Franzee
Related to:
Tracie A Reichel, 45Mary Frazee, 70Lawrence Franzee, 41
Connected to:
Angela Frazee, 45Arnold D Frazee, 64Carrie A Frazee, 55Christina M Frazee, 82Constance J Frazee, 75Damon E Frazee, 54Darrel C Frazee, 66Deri L Frazee, 50Fredrick A Frazee, 64Harold P Frazee, 56

Lawrence Frazee Phones & Addresses

  • Streamwood, IL
  • Mount Prospect, IL
  • Bensenville, IL
  • Dekalb, IL
  • Freeport, IL
  • Bolingbrook, IL
  • Twentynine Palms, CA
  • 2160 Oriole Dr, Freeport, IL 61032

Resumes

Resumes

Lawrence Frazee Photo 1

Cdd Instructor At Itt Technical Institute

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Lawrence Frazee Photo 2

Quality Analyst At Riverside Publishing

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Location:
Greater Chicago Area
Industry:
Publishing
Lawrence Frazee Photo 3

Computer Programmer

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Location:
Greater Chicago Area
Industry:
Information Technology and Services

Publications

Us Patents

Vane Actuated Magnetic Drive Mode Sensor

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US Patent:
7245122, Jul 17, 2007
Filed:
Dec 21, 2005
Appl. No.:
11/315924
Inventors:
Eugene D. Alfors - Rockford IL, US
Kenneth L. Eichholz - Freeport IL, US
Lawrence E. Frazee - Freeport IL, US
John S. Patin - Freeport IL, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
G01B 7/14
G01R 33/07
US Classification:
3242072, 324251, 32420724
Abstract:
A vane actuated drive mode sensor is generally composed of two primary components, including a drive mode sensor array and an actuator. The sensor array can be provided as a housing composed of a plurality of Hall Effect (HE) sensors, magnets and the electronics associated with the sensors. The actuator, also referred to as a vane, can be provided as a plate constructed from a magnetic material, such as, for example, ferrous steel, and can be provided with holes punched thereon at different places depending on the requirement of a user. The actuator can be connected to a user's driver and can slide on and/or within the housing.

Magnet Orientation And Calibration For Small Package Turbocharger Speed Sensor

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US Patent:
7269992, Sep 18, 2007
Filed:
Jun 15, 2005
Appl. No.:
11/155203
Inventors:
Wayne A. Lamb - Freeport IL, US
Lawrence E. Frazee - Freeport IL, US
Peter A. Schelonka - Plymouth MN, US
Joel D. Stolfus - Freeport IL, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
G01P 21/02
US Classification:
73 141, 324202
Abstract:
A method and system for orienting and calibrating a magnet for use with a speed sensor. A magnet can be mapped two or more planes thereof in order to locate the magnet accurately relative to one or more magnetoresistive elements maintained within a speed sensor housing. An optical location of the magnet with respect to the magnetoresistive element and the sensor housing can then be identified in response to mapping of the magnet. Thereafter, the magnet can be bonded to the speed sensor housing in order to implement a speed sensor thereof maintained by the speed sensor housing for use in speed detection operations.

Chip On Lead Frame For Small Package Speed Sensor

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US Patent:
7378721, May 27, 2008
Filed:
Dec 5, 2005
Appl. No.:
11/295371
Inventors:
Lawrence E. Frazee - Freeport IL, US
Wayne A. Lamb - Freeport IL, US
John S. Patin - Freeport IL, US
Peter A. Schelonka - Plymouth MN, US
Joel D. Stolfus - Freeport IL, US
Assignee:
Honeywell International Inc. - Morristown NJ
International Classification:
H01L 23/495
G01P 3/42
US Classification:
257666, 257670, 257678, 257787, 257793, 257E23001, 257E23007, 257E23015, 324160, 324161, 324162, 324163, 324164, 324165
Abstract:
A sensor package apparatus includes a lead frame substrate that supports one or more electrical components, which are connected to and located on the lead frame substrate. A plurality of wire bonds are also provided, which electrically connect the electrical components to the lead frame substrate, wherein the lead frame substrate is encapsulated by a thermoset plastic to protect the plurality of wire bonds and at least one electrical component, thereby providing a sensor package apparatus comprising the lead frame substrate, the electrical component(s), and the wire bonds, while eliminating a need for a Printed Circuit Board (PCB) or a ceramic substrate in place of the lead frame substrate as a part of the sensor package apparatus. A conductive epoxy can also be provided for maintaining a connection of the electrical component(s) to the lead frame substrate. The electrical components can constitute, for example, an IC chip and/or a sensing element (e. g.

Magnetic Sensor With A Chip Attached To A Lead Assembly Within A Cavity At The Sensor's Sensing Face

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US Patent:
59125560, Jun 15, 1999
Filed:
Nov 6, 1996
Appl. No.:
8/744592
Inventors:
Lawrence E. Frazee - Freeport IL
Lamar F. Ricks - Freeport IL
Paul E. Smith - Freeport IL
Assignee:
Honeywell Inc. - Minneapolis MN
International Classification:
G01B 714
G01B 730
G01R 3306
H01L 4308
US Classification:
3242072
Abstract:
A geartooth sensor is provided with a carrier shaped to form a cavity in which semiconductor chips can be disposed. The carrier partially encapsulates a permanent magnet and a lead assembly. Unencapsulated portions of the lead assembly are exposed within the cavity to permit semiconductor components to be attached to a portion of the lead assembly. A cover is attached to the carrier to seal the cavity and protect the magnetically sensitive components located therein. The carrier, with its associated lead assembly and permanent magnet, can then be attached to a printed circuit board and a support structure to form a geartooth sensor. A protective enclosure can be disposed over the sensitive components of the geartooth sensor.
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Lawrence I Frazee from Streamwood, IL, age ~41 Get Report