Kenneth T Dishart

59088222, Jun 1, 1999

Oct 28, 1997

8/959612

Kenneth T. Dishart - Wilmington DE

E. I. du Pont de Nemours and Company - Wilmington DE

C11D 306
C11D 330
C11D 324

510467

Novel surfactants and drying and/or cleaning compositions containing such surfactants are disclosed. The surfactants are 1:1 primary or secondary amine salts of. gamma. omega. -perfluoro-C. sub. 6 -C,. sub. 8 -alkyl dihydrogen phosphates and bis(y,co-perfluoro-C. sub. 6 -Cis-alkyl) hydrogen phosphates. The surfactants are soluble in, and convert halocarbons, especially HFC 43-10mee (1,1,1,2,2,3,4,5,5,5-decafluoropentane), into highly effective displacement drying and/or cleaning compositions. These compositions have the ability to remove water or aqueous films from the surface of a broad range of substrates.

51961369, Mar 23, 1993

Jun 20, 1991

7/718543

Kenneth T. Dishart - Wilmington DE
Harold L. Jackson - Hockessin DE
Abraham B. Cohen - late of Princeton NJ

E. I. Du Pont de Nemours and Company - Wilmington DE

C11D 750
C23G 5024

252170

A cleaning composition is disclosed which is suitable for cleaning substrates and particularly for cleaning flux residues from a printed circuit board. The cleaning composition comprises a hydrocarbon component, a compatibilizing agent, a multibasic ester additive, and optionally water. The multibasic ester may be an alkanoic acid ester of a diol or polyol, an alkanoic acid ester of a hydroxy alkanoate alkyl ester, or and alkyl ester of a compound containing two or more carboxylic acid groups and one or more hydroxyl groups which are optionally esterified with an alkanoic acid group. The cleaning composition may be used as a solution or as an emulsion or dispersion to clean a substrate.

50116207, Apr 30, 1991

Aug 7, 1989

7/392996

Kenneth T. Dishart - Wilmington DE
Mark C. Wolff - Wilmington DE

E. I. Du Pont de Nemours and Company - Wilmington DE

C11D 930
C11D 1504
C11D 1700
C11D 750

252118

A cleaning composition is disclosed which is suitable for cleaning flux residue from a printed circuit board and comprises dibasic ester solvent and a hydrocarbon solvent.

46457100, Feb 24, 1987

Sep 25, 1985

6/780075

Stacey A. Baitinger - Wilmington DE
Robert C. Brothers - Wilmington DE
Kenneth T. Dishart - Wilmington DE

E. I. Du Pont de Nemours and Company - Wilmington DE

B32B 712
B32B 326

4283177

Laminate structures comprising a foamed polyurethane or polyisocyanurate resin core with a facer material uniformly adhered thereto with an adhesive material having functional groups capable of interacting chemically with isocyanate groups in the foamed resin core are disclosed. Suitable adhesive materials include. alpha. -olefin-acid copolymers, ethylene vinyl alcohol, polyimides, polyamines and phenolic resins. The bond between the foam core and the facer material has a peel strength of at least 1. 5 lbs/in. , preferably 5 lbs/in.

50965018, Mar 17, 1992

Aug 27, 1990

7/573602

Kenneth T. Dishart - Wilmington DE
David S. Lermond - Wilmington DE

E. I. Du Pont de Nemours & Company - Wilmington DE

B08B 704
C23G 136
C11D 318
C11D 724

134 10

A substrate cleaning process employs a substantially aqueous immiscible cleaning composition and a water rinse followed by phase separation of the cleaning composition and water and reuse of the water.

51045648, Apr 14, 1992

Dec 19, 1989

7/452405

David S. Lermond - Wilmington DE
Kenneth T. Dishart - Wilmington DE
Abid N. Merchant - Wilmington DE

E. I. du Pont de Nemours and Company - Wilmington DE

C23G 5028
C11D 750

252170

A high-boiling hydrochlorofluorofluorocarbon (HCFC) solvent comprising a blend of for every 100 parts by weight of a hydrochlorofluorocarbon (e. g. , 1,1,1-trifluorodichloroethane or 1,1-dichloro-1-fluoroethane) from about 25 to about 400 parts by weight of a selected organic solvent (e. g. , dipropylene glycol monomethyl ether, dipropylene glycol monomethyl ether acetate, or mixture of dimethyladipate, dimethylglutarate, and dimethylsuccinate). Such solvents are useful in liquid/vapor phase cleaning applications even at elevated temperatures above the boiling temperature predicted by Raoult's law.

47215780, Jan 26, 1988

Oct 6, 1986

6/915415

Kenneth T. Dishart - Wilmington DE

E. I. Du Pont de Nemours and Company - Wilmington DE

C09K 504

252 781

A vapor phase heat transfer process which uses low molecular weight fully fluorinated hexafluoropropylene oxide (HFPO) oligomers having the formula: ##STR1## where n is 9 or less, as heat transfer mediums.

50629883, Nov 5, 1991

Aug 7, 1989

7/392997

Kenneth T. Dishart - Wilmington DE
Mark C. Wolff - Wilmington DE

E. I. Du Pont de Nemours and Company - Wilmington DE

C11D 930
C11D 1504
C11D 1700
C11D 750

252170

A cleaning composition is disclosed which is suitable for cleaning flux residue from a printed circuit board and comprises dibasic ester solvent, a hydrocarbon solvent and a compatibilizing component.