Joseph A Iannotti

6356823, Mar 12, 2002

Jan 27, 2000

09/492687

Joseph A. Iannotti - Whitesboro NY
Richard J. Gawrelski - Amsterdam NY
David Russell - Rome NY

ITT Research Institute - Chicago IL

G06F 1300

701 35, 369 21

A motor vehicle data collection, monitoring and management system is provided for ready connection to the vehicles onboard data network through the data interface provided by the vehicle manufacturer. The data collected includes data available on the manufacturers network, such as network data traffic between control modules, as well as data from discrete components located outside of the motor vehicle network. The data collecting and monitoring system exhibits power saving features including automatic shutdown when the motor vehicle is switched off. A methodology for configuring the system is also disclosed.

6711312, Mar 23, 2004

Dec 20, 2002

10/248148

William Kornrumpf - Schenectady NY
Glenn Claydon - Wynantskill NY
Samhita Dasgupta - Niskayuna NY
Robert Filkins - Niskayuna NY
Glenn Forman - Niskayuna NY
Joseph Iannotti - Glenville NY
Matthew Christian Nielsen - Schenectady NY

General Electric Company - Schenectady NY

G02B 612

385 14, 385 2, 385129, 359245

The invention comprises a novel combination of microwave and photonic packaging to arrive a compact, self contained MZI modulator. The nature of the NLO polymer, that is, its large electro-optic coefficient reduces the drive requirements for the integrated power amplifier, allowing a small to medium power amplifier to be used. Microwave high density interconnect (HDI) packaging techniques allow the medium power amplifier to be fabricated into a small assembly, which can be mounted directly to the MZI substrate. The integrated amplifier and modulator provides a significant reduced size and lower power, and high bandwidth advantage when compared with existing devices based on inorganic materials.

6818466, Nov 16, 2004

Dec 4, 2003

10/728148

William Kornrumpf - Schenectady NY
Glenn Claydon - Wynantskill NY
Samhita Dasgupta - Niskayuna NY
Robert Filkins - Niskayuna NY
Glenn Forman - Niskayuna NY
Joseph Iannotti - Glenville NY
Matthew Christian Nielsen - Schenectady NY

General Electric Company - Schenectady NY

H01L 2100

438 31, 438 29, 438 99, 438107

A method of fabricating an integrated optoelectronic circuit. The method includes positioning a microchip on a first flexible dielectric substrate. A polymer electro-optic waveguide is positioned on or within the first flexible dielectric substrate. A ground electrode is positioned along the electro-optic waveguide. A signal electrode is positioned along the electro-optic waveguide opposite the ground electrode. A first patterned metallization layer is applied to the first flexible dielectric substrate. A second flexible dielectric substrate is positioned along the first flexible dielectric substrate. A plurality of via openings are provided in the first and second flexible dielectric substrates. A second patterned metallization layer is applied to the second flexible dielectric substrate.

7109888, Sep 19, 2006

Oct 9, 2002

10/267703

Joseph A. Iannotti - Whitesboro NY, US
Richard J. Gawrelski - Amsterdam NY, US

G08G 1/01

340935, 340541, 324 66

A method and apparatus employing an array of spaced detectors and a detection circuit to detect disturbance of first and second conductors and provide signals to a computer system to determine both the presence of the intruder and the direction of travel of the intruder. The velocity of the intruder's travel may also be determined. When used with a destruction device to destroy an intruder such as an explosive shell, the lob time and the killing distance may also be calculated and used to fire the shell and to explode it at a position to destroy the intruder. Often the intruder is an armored vehicle or a tank. The conductors may be spaced in an array that has the appearance of a spider web. The conductors may be light weight conductive elastomeric conductors.

7123015, Oct 17, 2006

Sep 29, 2004

10/953924

Glen Peter Koste - Niskayuna NY, US
Ronald Dean Watkins - Niskayuna NY, US
Richard Louis Frey - Delanson NY, US
Matthew Christian Nielsen - Scotia NY, US
Joseph Alfred Iannotti - Glenville NY, US
Todd Ryan Tolliver - Clifton Park NY, US

General Electric Company - Niskayuna NY

G01V 3/00

324322, 324318

A magnetic resonance (MR) system and method for generating information about an object is provided. The MR system comprises at least one MR detector configured to sense a plurality of electromagnetic signals and a modulator coupled to the MR detector and configured to modulate optical signals with the electromagnetic signals to generate corresponding modulated optical signals. The MR system further comprises a resonant matching circuit configured for matching an impedance of the MR detector to an impedance of the modulator to achieve at least one of a voltage gain or a noise performance. An optical conduit coupled to the modulator is configured to transmit the modulated optical signals from within a shielded environment to outside the shielded environment. A signal detector coupled to the optical conduit is configured to convert the modulated optical signals to electrical signals.

7570133, Aug 4, 2009

Dec 6, 2006

11/634107

William J. Taft - Yardville NJ, US
Joseph Alfred Iannotti - Glenville NY, US
Christopher James Kapusta - Delanson NY, US
Anthony W. Jacomb-Hood - Yardley PA, US

Lockheed Martin Corporation - Bethesda MD

H01P 3/00
H01P 9/00

333164, 333156, 333161

A true time delay (“TTD”) system with wideband passive amplitude compensation is provided. The TTD system includes an input switch, an output switch, a reference delay line disposed between the input switch and the output switch, and time delay lines disposed between the input switch and the output switch. Each time delay line (“TDL”) has a different line length, and includes a center conductor between two corresponding ground planes. Each center conductor has a width and is separated from the two corresponding ground planes by a gap space. For each TDL, the width of the center conductor is configured such that a loss of the TDL is substantially the same as a loss of every other TDL over a range of operating frequencies. For each TDL, the gap space is configured such that an impedance of the TDL is substantially the same as an impedance of every other TDL.

7605466, Oct 20, 2009

Oct 15, 2007

11/872562

Marco Francesco Aimi - Niskayuna NY, US
Christopher James Kapusta - Delanson NY, US
Arun Virupaksha Gowda - Niskayuna NY, US
David Cecil Hays - Niskayuna NY, US
Oliver Charles Boomhower - Waterford NY, US
Glenn Scott Claydon - Wynantskill NY, US
Joseph Alfred Iannotti - Glenville NY, US
Christopher Fred Keimel - Schenectady NY, US

General Electric Company - Niskayuna NY

H01L 23/34

257723, 257E2301, 438107

Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.

7633667, Dec 15, 2009

Oct 22, 2007

11/876070

Glen Peter Koste - Niskayuna NY, US
Christopher James Kapusta - Delanson NY, US
Joseph Alfred Iannotti - Glenville NY, US

General Electric Company - Niskayuna NY

G02F 1/07

359254, 359245

An integrated electro-optical module apparatus includes in one embodiment an optical modulator configured to modulate an input optical signal coupled thereto; and a control circuit assembly configured to provide electrical control signals to the optical modulator to modulate the input optical signal; wherein the control circuit assembly is attached to the optical modulator in a stacked arrangement.