Joel A Kubby

6340216, Jan 22, 2002

Sep 30, 1998

09/164250

Eric Peeters - Fremont CA
Jaan Noolandi - Mountain View CA
Raj B. Apte - Palo Alto CA
Philip D. Floyd - Sunnyvale CA
Jonathan A. Small - Los Altos CA
Gregory J. Kovacs - Mississauga, CA
Meng H. Lean - Briarcliff Manor NY
Armin R. Volkel - Palto Alto CA
Steven B. Bolte - Rochester NY
An-Chang Shi - Hamilton, CA
Frederick J. Endicott - San Carlos CA
Gregory B. Anderson - Woodside CA
Dan A. Hays - Fairport NY
Joel A. Kubby - Rochester NY
Warren B. Jackson - San Francisco CA
Karen A. Moffat - Brantford, CA
T. Brian McAneney - Burlington, CA
Richard P. N. Veregin - Mississauga, CA
Maria N. V. McDougall - Burlington, CA
Danielle C. Boils - Mississauga, CA
Paul D. Szabo - Islington, CA

Xerox Corporation - Stamford CT

B41J 2015

347 21, 347 47, 347 75, 347 83

An apparatus for treating a substrate is disclosed in which a propellant stream is passed through a channel and directed toward a substrate. Substrate pre-marking or post-marking treatment material is controllably introduced into the propellant stream and imparted with sufficient kinetic energy thereby to be made incident upon a substrate. A multiplicity of channels for directing the propellant and treatment material allow for high throughput, high resolution in-situ treatment. Marking materials and treatment materials may be introduced into the channel and mixed therein prior to being made incident on the substrate, or mixed or superimposed on the substrate without registration. One example is a single-pass, full-color printer.

6357865, Mar 19, 2002

Oct 12, 1999

09/416329

Joel A. Kubby - Rochester NY
Jingkuang Chen - Ann Arbor MI
Feixia Pan - Webster NY

Xerox Corporation - Stamford CT

B41J 2045

347 68, 347 9, 347 20

A micro-electromechanical fluid ejector that is easily fabricated in a standard polysilicon surface micromachining process is disclosed, which can be batch fabricated at low cost using existing external foundry capabilities. In addition, the surface micromachining process has proven to be compatible with integrated microelectronics, allowing for the monolithic integration of the actuator with addressing electronics. A voltage drive mode and a charge drive mode for the power source actuating a deformable membrane is also disclosed.

6362512, Mar 26, 2002

Dec 21, 1999

09/468423

Joel A. Kubby - Rochester NY
Jingkuang Chen - Ann Arbor MI
Alex T. Tran - Ithaca NY

Xerox Corporation - Stamford CT

H01L 2982

257415, 257619, 438 50, 438459, 438723

A device structure is defined in a single-crystal silicon (SCS) layer separated by an insulator layer, such as an oxide layer, from a handle wafer. The SCS can be attached to the insulator by wafer bonding, and is selectively etched, as by photolithographic patterning and dry etching. A sacrificial oxide layer can be deposited on the etched SCS, on which polysilicon can be deposited. A protective oxide layer is deposited, and CMOS circuitry and sensors are integrated. Silicon microstructures with sensors connected to CMOS circuitry are released. In addition, holes can be etched through the sacrificial oxide layer, sacrificial oxide can be deposited on the etched SCS, polysilicon can be deposited on the sacrificial oxide, PSG can be deposited on the polysilicon layer, which both can then be patterned.

6379989, Apr 30, 2002

Dec 21, 1999

09/468141

Joel A. Kubby - Rochester NY
Jingkuang Chen - Ann Arbor MI
Alex T. Tran - Ithaca NY

Xerox Corporation - Stamford CT

H01L 2100

438 52, 216 24, 216 26, 216 39, 438 29, 438694

A microoptomechanical structure produced by defining a microoptical structure in a single-crystal silicon layer separated by an insulator layer from a handle wafer, such as a SOI wafer, selectively etching the single crystal silicon layer, depositing a sacrificial oxide layer on the etched single crystal silicon layer, depositing and etching a polysilicon layer on the sacrificial oxide layer, with remaining polysilcon forming hinge elements, and releasing formed microoptical structures. Embodiments use an oxide as an insulator, and other embodiments provide for wafer bonding of the silicon layer to the insulator layer.

6384918, May 7, 2002

Mar 23, 2000

09/535007

Joel A. Kubby - Rochester NY

Xerox Corporation - Stamford CT

G01J 351

356402, 356419, 356425, 250226

An improved spectrophotometer for non-contact measuring of the colors of colored target areas, especially, test patches on moving printed test sheets in an unrestrained normal output path of a color printer, which test patches may be sequentially angularly illuminated with multiple different colors, with a photosensor providing electrical signals in response, the spectrophotometer having a lens system for transmitting that reflected illumination from the test patch to the photosensor with a lens magnification ratio of approximately one to one. The exemplary spectrophotometer provides noncontact color measurements of moving color target areas variably displaced therefrom within normal paper path baffle spacings, with a displacement insensitivity of at least 6 millimeters about a nominal target to spectrophotometer separation.

6399405, Jun 4, 2002

Dec 20, 1999

09/467482

Jingkuang Chen - Ann Arbor MI
Joel A. Kubby - Rochester NY

Xerox Corporation - Stamford CT

H01L 2100

438 22, 438 32, 438 57, 438 73, 438142, 438128, 438700, 216 2

A process for constructing a monolithic spectrophotometer from a monolithic substrate, which includes the steps of etching a grating for dispersing input optical waves in the monolithic substrate, etching a suspended bridge positioned over an undercut cavity in the monolithic substrate, forming photodiode array on the suspended bridge to receive dispersed optical waves from the grating, orienting the suspended bridge to receive dispersed optical waves from the grating, locking the suspended bridge in a oriented position with an anchor, and photolithographically defining signal processing circuitry on the monolithic substrate.

6416157, Jul 9, 2002

Sep 30, 1998

09/164124

Eric Peeters - Fremont CA
Jaan Noolandi - Mountain View CA
Raj B. Apte - Palo Alto CA
Philip D. Floyd - Sunnyvale CA
Jonathan A. Small - Los Altos CA
Gregory J. Kovacs - Mississauga, CA
Meng H. Lean - Briarcliff Manor NY
Armin R. Volkel - Palo Alto CA
Steven B. Bolte - Rochester NY
An-Chang Shi - Hamilton, CA
Frederick J. Endicott - San Carlos CA
Gregory B. Anderson - Woodside CA
Dan A. Hays - Fairport NY
Joel A. Kubby - Rochester NY
Warren B. Jackson - San Francisco CA

Xerox Corporation - Stamford CT

B41J 214

347 21

A method of marking employs a marking apparatus in which a propellant stream is passed through a channel and directed toward a substrate. Marking material, such as ink, toner, etc. , is controllably introduced into the propellant stream and imparted with sufficient kinetic energy thereby to be made incident upon a substrate. At sufficient velocity, and with appropriate marking material, the marking material may be kinetically fused to the substrate. A multiplicity of channels for directing the propellant and marking material allow for high throughput, high resolution marking. Multiple marking materials may be introduced into the channel and mixed therein prior to being made incident on the substrate, or mixed or superimposed on the substrate without registration. One example is single-pass, full-color printing.

6454384, Sep 24, 2002

Sep 30, 1998

09/163924

Eric Peeters - Fremont CA
Jaan Noolandi - Mountain View CA
Raj B. Apte - Palo Alto CA
Philip D. Floyd - Sunnyvale CA
Jonathan A. Small - Los Altos CA
Gregory J. Kovacs - Mississauga, CA
Meng H. Lean - Briarcliff Manor NY
Armin R. Volkel - Palo Alto CA
Steven B. Bolte - Rochester NY
An-Chang Shi - Hamilton, CA
Frederick J. Endicott - San Carlos CA
Gregory B. Anderson - Woodside CA
Dan A. Hays - Fairport NY
Joel A. Kubby - Rochester NY
Warren B. Jackson - San Francisco CA
Andrew A. Berlin - San Jose CA
G. A. Neville Connell - Cupertino CA

Xerox Corporation - Stamford CT

B41J 205

347 21

A method of marking is disclosed in which a propellant stream is passed through a channel and directed toward a substrate. Liquid marking material, such as ink, is controllably introduced into the propellant stream and imparted with sufficient kinetic energy thereby to be made incident upon a substrate. A multiplicity of channels for directing the propellant and marking material allow for high throughput, high resolution marking. Multiple marking materials may be introduced into the channel and mixed therein prior to being made incident on the substrate, or mixed or superimposed on the substrate without registration. One example is a single-pass, full-color printer.