US Patent:
20120070996, Mar 22, 2012
Inventors:
Jennifer Fangli Hao - Cupertino CA, US
International Classification:
H01L 21/3065
B05C 13/02
H01L 21/306
H01L 21/683
H01L 21/30
US Classification:
438710, 361234, 438758, 15634551, 118500, 257E21211, 257E21218
Abstract:
An apparatus for electrostatic chucking and dechucking of a semiconductor wafer includes an electrostatic chuck with a number of zones. Each zone includes one or more polar regions around a lift pin that contacts a bottom surface of the semiconductor wafer. The apparatus also includes one or more controllers that control the lift pins and one or more controllers that control the polar regions. The controller for the lift pins receives data from one or more sensors and uses the data to adjust the upward force of the lift pins. Likewise, the controller for the polar regions receives data from the sensors and uses the data to adjust the voltage in the polar regions.
