US Patent:
20200033920, Jan 30, 2020
Inventors:
- Redmond WA, US
Chau Van Ho - Des Moines WA, US
Jason Marlan Pursel - Lake Stevens WA, US
International Classification:
G06F 1/20
G05D 23/19
H05K 7/20
G05B 15/02
G06F 17/11
Abstract:
Cooling of an electronic device is described herein. A sensor located at a first position determines a temperature at the first position. A processor identifies a fan speed of a fan positioned within the electronic device. The processor identifies a correlation between at least the determined temperature at the first position and the identified fan speed of the fan, and a temperature at a second position. The processor calculates an expected temperature at the second position using the identified correlation based on the determined temperature at the first position and the identified fan speed of the fan. The processor compares the calculated expected temperature at the second position to a predetermined temperature for the second position. The processor controls, based on the comparison, at least one component of the electronic device when the calculated expected temperature at the second position is greater than the predetermined temperature for the second position.