Search

Jason P Goodelle

from San Jose, CA
Age ~54
Get Report
Also known as:
Jp P Goodelle, Jason Paul Goodelk, Jay P Goodelle
Phone and address:
1872 Huxley Ct, San Jose, CA 95125
Related to:
Victoria Gerlach, 75Lord Sansom, 87Abby Gerlach, 49
Connected to:
Aaron J Goodell, 56Anna M Goodell, 51Anne S Goodell, 99Austin J Goodell, 39Bethany Goodell, 37Bill J Goodell, 70Carol J Goodell, 81Charlie J Goodell, 102Clarice M Goodell, 70Darlene Goodell, 53

Jason Goodelle Phones & Addresses

  • 1872 Huxley Ct, San Jose, CA 95125
  • 814 Main St UNIT 301, Melrose, MA 02176
  • Stoneham, MA
  • Boston, MA
  • 914 Delaware Ave, Fountain Hill, PA 18015
  • Mc Kees Rocks, PA
  • Coraopolis, PA
  • Kutztown, PA
  • Allentown, PA

Work

Company: Synaptics Mar 2018 Position: Senior director, packaging engineering

Education

Degree: Doctorates, Doctor of Philosophy School / High School: Lehigh University 1992 to 1999 Specialities: Materials Science

Skills

Semiconductors • Ic • Design of Experiments • Product Engineering • Mems • Electronics • Failure Analysis • Semiconductor Industry • Sensors • Spc • Mixed Signal • Simulations • Engineering Management

Industries

Semiconductors

Resumes

Resumes

Jason Goodelle Photo 1

Senior Director, Packaging Engineering

View page
Location:
San Jose, CA
Industry:
Semiconductors
Work:
Synaptics
Senior Director, Packaging Engineering
Synaptics
Director, Packaging Engineering
Lilliputian Systems Inc. Jul 2012 - Apr 2014
Director of Packaging Development
Sand 9, Inc. Feb 2010 - Jul 2012
Director of Operations
Akustica Sep 2005 - Mar 2010
Assembly and Packaging Director
Education:
Lehigh University 1992 - 1999
Doctorates, Doctor of Philosophy, Materials Science Allegheny College 1988 - 1992
Bachelors, Bachelor of Science, Physics
Skills:
Semiconductors
Ic
Design of Experiments
Product Engineering
Mems
Electronics
Failure Analysis
Semiconductor Industry
Sensors
Spc
Mixed Signal
Simulations
Engineering Management

Publications

Us Patents

Robust Electronic Device Packages

View page
US Patent:
6894400, May 17, 2005
Filed:
May 25, 2004
Appl. No.:
10/853395
Inventors:
Jason P. Goodelle - Kutztown PA, US
John W. Osenbach - Kutztown PA, US
Assignee:
Agere Systems Inc. - Allentown PA
International Classification:
H01L023/22
H01L023/24
H01L023/02
H01L023/48
H01L023/29
US Classification:
257795, 257789, 257687, 257678
Abstract:
Packages for electronic devices are formed from a die such as a silicon die in electrical communication with a substrate through a mating array, e. g. ball array, on the substrate. An underfill material is present between the die and substrate in the region of the array. For large dies (a dimension of 15 mm or greater) failure of the connection between the die and substrate is avoided by employing a particle filled underfill material with specifically chosen Young moduli both below and above the glass transition temperature of the underfill material.

Device Packages Having Stable Wirebonds

View page
US Patent:
7314781, Jan 1, 2008
Filed:
Nov 5, 2003
Appl. No.:
10/702875
Inventors:
Brett J. Campbell - Hatfield PA, US
Patrick J. Carberry - Laury's Station PA, US
Jason P. Goodelle - Allentown PA, US
Michael Francis Quinn - Allentown PA, US
Assignee:
LSI Corporation - Milpitas CA
International Classification:
H01L 21/60
US Classification:
438111, 438123, 438466, 438617, 257E23025
Abstract:
A method of making a packaged electrical device comprises the steps of (a) connecting one end of a wire to a first point (e. g. , a first electrical node) in the package, and (b) connecting the other end of the wire to a second point (e. g. , a second electrical node) in the package, characterized by (c) causing energy from an external source to heat at least one predetermined segment of the wire to a temperature that is below its melting point (MP) but not below its recrystallization temperature (RCT), and (d) cooling the heated segment to a temperature below its RCT [e. g. , to room temperature (RT)], thereby to increase the stiffness modulus of the segment. In one embodiment, the external source is a laser whose optical output is absorbed by the segment. In another embodiment, the heated segment is rapidly cooled (i. e. , quenched) to RT.

Integration Of Piezoelectric Materials With Substrates

View page
US Patent:
8466606, Jun 18, 2013
Filed:
Oct 6, 2010
Appl. No.:
12/899447
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Alexei Gaidarzhy - Brighton MA, US
Guiti Zolfagharkhani - Brighton MA, US
Jason Goodelle - Boston MA, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H01L 41/053
US Classification:
310348, 310344, 310349
Abstract:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Microelectromechanical Systems (Mems) Resonators And Related Apparatus And Methods

View page
US Patent:
8476809, Jul 2, 2013
Filed:
May 8, 2012
Appl. No.:
13/466767
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Pritiraj Mohanty - Los Angeles CA, US
Klaus Juergen Schoepf - Chandler AZ, US
Guiti Zolfagharkhani - Brighton MA, US
Jason Goodelle - Boston MA, US
Reimund Rebel - Maricopa AZ, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H01L 41/053
H03B 1/00
H03B 5/32
US Classification:
310344, 331 68, 331154
Abstract:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Microelectromechanical Systems (Mems) Resonators And Related Apparatus And Methods

View page
US Patent:
8587183, Nov 19, 2013
Filed:
Nov 20, 2012
Appl. No.:
13/681873
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Pritiraj Mohanty - Los Angeles CA, US
Klaus Juergen Schoepf - Chandler AZ, US
Guiti Zolfagharkhani - Brighton MA, US
Jason Goodelle - Boston MA, US
Reimund Rebel - Maricopa AZ, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H03H 9/25
H01L 41/053
US Classification:
310346, 310313 R, 310344
Abstract:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Process For Packaging Electronic Devices Using Thin Bonding Regions

View page
US Patent:
20030111437, Jun 19, 2003
Filed:
Dec 13, 2001
Appl. No.:
10/017942
Inventors:
Bradley Barber - Chatham NJ, US
LaRue Dunkleberger - Kintnersville PA, US
Jason Goodelle - Bethlehem PA, US
Thomas Shilling - Macungie PA, US
International Classification:
C23F001/00
H01B013/00
US Classification:
216/002000
Abstract:
In the method, a cap wafer surface is lithographically etched at time of fabrication, so that a raised ridge onto which bonding material is placed is formed near a perimeter of a desired cavity region. This is done in order to reduce the bonding area between the cap wafer and electronic device wafers, so as to provide a better defined standoff. In another aspect of the method, the cap wager surface is lithographically etched to form recesses or trenches near the perimeter of a cavity region, each recess being filled with a sealing material, and polished if necessary to be flush with the cap wafer surface. Thereafter, the cap wafer surface is etched so that the filled recesses become the raised ridges which are used to bond a cap wafer to an electronic device wafer.

Microelectromechanical Systems (Mems) Resonators And Related Apparatus And Methods

View page
US Patent:
20130140651, Jun 6, 2013
Filed:
Nov 20, 2012
Appl. No.:
13/681893
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Pritiraj Mohanty - Los Angeles CA, US
Klaus Juergen Schoepf - Chandler AZ, US
Guiti Zolfagharkhani - Brighton MA, US
Jason Goodelle - Boston MA, US
Reimund Rebel - Maricopa AZ, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
B81B 3/00
US Classification:
257415
Abstract:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Microelectromechanical Systems (Mems) Resonators And Related Apparatus And Methods

View page
US Patent:
20130140944, Jun 6, 2013
Filed:
Nov 20, 2012
Appl. No.:
13/681904
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Pritiraj Mohanty - Los Angeles CA, US
Klaus Juergen Schoepf - Chandler AZ, US
Guiti Zolfagharkhani - Brighton MA, US
Jason Goodelle - Boston MA, US
Reimund Rebel - Maricopa AZ, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H02N 1/00
US Classification:
310300
Abstract:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
Control profile
Jason P Goodelle from San Jose, CA, age ~54 Get Report