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Jan Kuypers Phones & Addresses

  • Ocoee, FL
  • La Jolla, CA
  • 910 Clinton St APT 3F, Philadelphia, PA 19107
  • Cambridge, MA
  • Boston, MA
  • Berkeley, CA

Publications

Us Patents

Mechanical Resonating Structures Including A Temperature Compensation Structure

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US Patent:
8058769, Nov 15, 2011
Filed:
Dec 16, 2009
Appl. No.:
12/639161
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Alexei Gaidarzhy - Brighton MA, US
Guiti Zolfagharkhani - Brighton MA, US
Assignee:
Sand9, Inc. - Cambridge MA
International Classification:
H01L 41/04
US Classification:
310313R, 310346
Abstract:
Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.

Methods And Apparatus For Mechanical Resonating Structures

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US Patent:
8174170, May 8, 2012
Filed:
Apr 21, 2010
Appl. No.:
12/764703
Inventors:
Jan H. Kuypers - Cambridge MA, US
David M. Chen - Brookline MA, US
Guiti Zolfagharkhani - Brighton MA, US
Alexei Gaidarzhy - Brighton MA, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H01L 41/09
US Classification:
310368, 310345
Abstract:
Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.

Oscillators Having Arbitrary Frequencies And Related Systems And Methods

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US Patent:
8228127, Jul 24, 2012
Filed:
Mar 10, 2010
Appl. No.:
12/721472
Inventors:
Reimund Rebel - Maricopa AZ, US
Klaus Juergen Schoepf - Chandler AZ, US
Jan H. Kuypers - Boston MA, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H04B 1/38
H04L 27/00
US Classification:
331 17, 331 16, 4551641, 4551821, 4551921
Abstract:
Systems and methods for operating with oscillators configured to produce an oscillating signal having an arbitrary frequency are described. The frequency of the oscillating signal may be shifted to remove its arbitrary nature by application of multiple tuning signals or values to the oscillator. Alternatively, the arbitrary frequency may be accommodated by adjusting operation one or more components of a circuit receiving the oscillating signal.

Mechanical Resonating Structures Including A Temperature Compensation Structure

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US Patent:
8362675, Jan 29, 2013
Filed:
Nov 7, 2011
Appl. No.:
13/290405
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Alexei Gaidarzhy - Brighton MA, US
Guiti Zolfagharkhani - Brighton MA, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H01L 41/04
US Classification:
310346, 310313 R
Abstract:
Mechanical resonating structures are described, as well as related devices and methods. The mechanical resonating structures may have a compensating structure for compensating temperature variations.

Methods And Apparatus For Mechanical Resonating Structures

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US Patent:
8441176, May 14, 2013
Filed:
Feb 7, 2012
Appl. No.:
13/367759
Inventors:
Jan H. Kuypers - Cambridge MA, US
David M. Chen - Brookline MA, US
Guiti Zolfagharkhani - Brighton MA, US
Alexei Gaidarzhy - Brighton MA, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H01L 41/09
US Classification:
310368, 310345
Abstract:
Mechanical resonating structures and related methods are described. The mechanical resonating structures may provide improved efficiency over conventional resonating structures. Some of the structures have lengths and widths and are designed to vibrate in a direction approximately parallel to either the length or width. They may have boundaries bounding the length and width dimensions, which may substantially align with nodes or anti-nodes of vibration.

Methods And Apparatus For Tuning Devices Having Resonators

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US Patent:
8456250, Jun 4, 2013
Filed:
Jul 2, 2010
Appl. No.:
12/830056
Inventors:
David Locascio - Chandler AZ, US
Reimund Rebel - Maricopa AZ, US
Jan H. Kuypers - Cambridge MA, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H03B 5/30
H03B 5/32
US Classification:
331107A, 331116 R, 331116 M, 331154
Abstract:
Methods and apparatus for tuning devices having resonators are described. Phase shifters are included in the circuits and used to shift the phase of the output signal(s) of the resonators. In some implementations, the phase shifters are configured in a feedback loop with the resonators. One or more of the apparatus described herein may be implemented as part, or all, of a microelectromechanical system (MEMS).

Integration Of Piezoelectric Materials With Substrates

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US Patent:
8466606, Jun 18, 2013
Filed:
Oct 6, 2010
Appl. No.:
12/899447
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Alexei Gaidarzhy - Brighton MA, US
Guiti Zolfagharkhani - Brighton MA, US
Jason Goodelle - Boston MA, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H01L 41/053
US Classification:
310348, 310344, 310349
Abstract:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.

Microelectromechanical Systems (Mems) Resonators And Related Apparatus And Methods

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US Patent:
8476809, Jul 2, 2013
Filed:
May 8, 2012
Appl. No.:
13/466767
Inventors:
David M. Chen - Brookline MA, US
Jan H. Kuypers - Cambridge MA, US
Pritiraj Mohanty - Los Angeles CA, US
Klaus Juergen Schoepf - Chandler AZ, US
Guiti Zolfagharkhani - Brighton MA, US
Jason Goodelle - Boston MA, US
Reimund Rebel - Maricopa AZ, US
Assignee:
Sand 9, Inc. - Cambridge MA
International Classification:
H01L 41/053
H03B 1/00
H03B 5/32
US Classification:
310344, 331 68, 331154
Abstract:
Devices having piezoelectric material structures integrated with substrates are described. Fabrication techniques for forming such devices are also described. The fabrication may include bonding a piezoelectric material wafer to a substrate of a differing material. A structure, such as a resonator, may then be formed from the piezoelectric material wafer.
Jan H Kuypers from Ocoee, FL, age ~45 Get Report