US Patent:
20030131973, Jul 17, 2003
Inventors:
Rajesh Nair - Nashua NH, US
Izundu Obinelo - Nashua NH, US
International Classification:
F28D015/00
Abstract:
A uniform heat dissipating and cooling heat sink for increasing conductive cooling at locations where conductive cooling and temperature differential is reduced. The heat sink includes a base having a variable thickness with a maximum thickness at the interior thereof and a plurality of fins upstanding from the base with adjacent fins separated by a flow channel having diverging sides.