Inventors:
Indira Adhihetty - Tempe AZ
Brian J. Miller - Chandler AZ
Ramaswamy Padmanabhan - Mesa AZ
Assignee:
Motorola, Inc. - Schaumburg IL
International Classification:
H01L 3902
H01L 2302
H05K 702
Abstract:
A semiconductor chip package is manufactured comprising a heatsink bonded to an aluminum nitride insulative layer by a thermally conductive and electrically nonconductive epoxy. The aluminum nitride insulative layer is bonded to several portions of a leadframe by an epoxy which is thermally conductive and electrically nonconductive and another epoxy which is thermally conductive and electrically conductive. A semiconductor die is bonded to the aluminum nitride insulative layer by a thermally conductive and electrically conductive epoxy.