US Patent:
20200185290, Jun 11, 2020
Inventors:
- Santa Clara CA, US
Hemanth K. DHAVALESWARAPU - Chandler AZ, US
Venkata Suresh GUTHIKONDA - Chandler AZ, US
John J. BEATTY - Chandler AZ, US
Yonghao AN - Chandler AZ, US
Marco Aurelio CARTAS AYALA - Chandler AZ, US
Luke J. GARNER - Chandler AZ, US
Peng LI - Chandler AZ, US
International Classification:
H01L 23/16
H01L 23/367
H01L 25/16
H01L 21/52
H01L 23/538
H01L 23/498
H01L 25/065
Abstract:
Semiconductor packages having a sealant bridge between an integrated heat spreader and a package substrate are described. In an embodiment, a semiconductor package includes a sealant bridge anchoring the integrated heat spreader to the package substrate at locations within an overhang gap laterally between a semiconductor die and a sidewall of the integrated heat spreader. The sealant bridge extends between a top wall of the integrated heat spreader and a die side component, such as a functional electronic component or a non-functional component, or a satellite chip on the package substrate. The sealant bridge modulates warpage or stress in thermal interface material joints to reduce thermal degradation of the semiconductor package.