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Harry Minikel Phones & Addresses

  • 7901 Ripplestir Ct, Raleigh, NC 27615 (919) 848-3794
  • Morrisville, NC
  • High Point, NC
  • King, NC
  • 7901 Ripplestir Ct, Raleigh, NC 27615 (919) 983-9969

Work

Position: Professional/Technical

Education

Degree: Graduate or professional degree

Publications

Us Patents

Alternate Port Apparatus For Manufacturing Test Of Integrated Serial Bus And Method Therefor

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US Patent:
6654913, Nov 25, 2003
Filed:
Feb 17, 1999
Appl. No.:
09/251928
Inventors:
Harry Thomas Minikel - Raleigh NC
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G06F 1100
US Classification:
714 43, 370241
Abstract:
An apparatus and method for integrated serial bus testing in a data processing system are implemented. During testing of the data processing system, serial bus test signals are provided via a predetermined input/output (I/O) device port. Switching circuitry decouples I/O device control circuitry from the I/O port in response to a control signal having a first predetermined value. The switching circuitry additionally decouples the serial bus controller from the serial bus interface which fans out the serial data lines to serial peripheral devices. During operation of the data processing system, the switching circuitry couples the serial bus controller to the interface, couples the I/O device controller to the I/O device port, and decouples the serial interface from the I/O device port, in response to the control signal having a second predetermined value.

Insertion Of Electrical Component Within A Via Of A Printed Circuit Board

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US Patent:
6983535, Jan 10, 2006
Filed:
Jan 22, 2002
Appl. No.:
10/054542
Inventors:
Timothy Wayne Crockett - Raleigh NC, US
Harry Thomas Minikel - Raleigh NC, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 3/30
US Classification:
29832, 29833, 29834, 29842, 29852, 174262, 361760
Abstract:
A method for reducing the impedance of a reference path in a printed circuit board includes forming a printed circuit board having a plurality of conductive layers including first, second, third, and fourth layers. The printed circuit board includes two or more vias interconnecting two or more of the conductive layers. A first via is part of a signal path configured to carry a signal from the first layer to the second layer. A second via is part of a reference path configured to carry said signal from a third layer to a fourth conductive layer. The method further includes embedding an electrical component, such as a capacitor, in the second via between two of the conductive layers.

Insertion Of Electrical Component Within A Via Of A Printed Circuit Board

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US Patent:
7188410, Mar 13, 2007
Filed:
Nov 17, 2004
Appl. No.:
10/991064
Inventors:
Timothy Wayne Crockett - Raleigh NC, US
Harry Thomas Minikel - Raleigh NC, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 3/30
US Classification:
29834, 29832, 29742, 29852, 174262, 361763
Abstract:
A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

Insertion Of Electrical Component Within A Via Of A Printed Circuit Board

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US Patent:
20020100611, Aug 1, 2002
Filed:
Feb 1, 2001
Appl. No.:
09/775250
Inventors:
Timothy Crockett - Raleigh NC, US
Harry Minikel - Raleigh NC, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K001/11
US Classification:
174/261000
Abstract:
A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

Flexible Tab For Releasing An Integrated Circuit Held Within A Zif Socket

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US Patent:
20060110968, May 25, 2006
Filed:
Nov 22, 2004
Appl. No.:
10/994837
Inventors:
Duane Miller - Wake Forest NC, US
Harry Minikel - Raleigh NC, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01R 4/50
US Classification:
439342000
Abstract:
A ZIF connector includes a cover movable between an engaged position and a disengaged position, being moved by movement of an actuator having a flexible tab attached to facilitate movement of the lever. In the engaged position, pins of an integrated circuit mounted in the ZIF connector are held in engagement with terminals within the connector. When the actuator is moved toward the disengaged position by pulling the flexible tab, the pins are released for removal of the integrated circuit from the connector. The tab may be formed from a portion of adhesive tape.
Harry T Minikel from Raleigh, NC, age ~78 Get Report