Inventors:
Harish Bhaskaran - New Haven CT, US
Mikael T. Bjoerk - Affoltern am Albis, CH
Michel Despont - Zurich, CH
Bernd W. Gotsmann - Horgen, CH
Heinz Schmid - Waedenswil, CH
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H01L 21/265
Abstract:
The invention relates to a method of fabricating a semiconductor device. The method includes: providing a semiconductor substrate and locally heating the semiconductor substrate by using a heated tip structure. Locally heating the semiconductor substrate is carried out to locally modify the electrical properties of the semiconductor substrate. The semiconductor substrate can be implanted with dopants, so that locally heating step causes a local activation of the implanted dopants. Furthermore, the semiconductor substrate can be provided with a dopant layer, so that locally heating step causes dopants to diffuse into the semiconductor substrate.