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Hamid F Borzabadi

from Noblesville, IN
Age ~63

Hamid Borzabadi Phones & Addresses

  • 125 Scarborough Cir, Noblesville, IN 46060 (317) 877-1937
  • Anderson, IN

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Vehicle Records

Hamid Borzabadi

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Address:
125 Scarborough Cir, Noblesville, IN 46062
VIN:
5FNRL38467B008400
Make:
HONDA
Model:
ODYSSEY
Year:
2007

Publications

Us Patents

Surface Mount Package For A Micromachined Device

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US Patent:
6750521, Jun 15, 2004
Filed:
Oct 22, 1999
Appl. No.:
09/422723
Inventors:
Dan W. Chilcott - Greentown IN
Hamid Reza Borzabadi - Noblesville IN
Douglas Ray Sparks - Kokomo IN
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H01L 2984
US Classification:
257414
Abstract:
A semiconductor device and method by which a device chip with a micromachine is directly surface mounted to a circuit board. A capping chip is bonded to the device chip and encloses the micromachine. The capping chip has a first surface facing the device chip, an oppositely-disposed second surface, and electrical interconnects through the capping chip between the first and second surfaces. The electrical interconnects electrically communicate with runners on the device chip that are electrically connected to the micromachine, thereby providing a signal path from the micromachine to the exterior of the device. The capping chip further includes bond pads for electrical communication with the electrical interconnects. With the bond pads, the capping chip can be surface mounted to a circuit board by reflowing solder bumps formed on the bond pads. Depending on the placement of the bond pads on the capping chip, the semiconductor device can be mounted to the circuit board with the capping chip between the device chip and circuit board, or the semiconductor device can be mounted with one side of the device attached to the circuit board.

Integrated Light Concentrator

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US Patent:
6828560, Dec 7, 2004
Filed:
Jan 31, 2002
Appl. No.:
10/059401
Inventors:
David K. Lambert - Sterling Heights MI
Han-Sheng Lee - Bloomfield Hills MI
Dan W. Chilcott - Greentown IN
Hamid R. Borzabadi - Noblesville IN
Qin Jiang - Kokomo IN
James H. Logsdon - Kokomo IN
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
G01J 508
US Classification:
250353
Abstract:
An infrared sensor including an absorber for absorbing incident infrared power to produce a signal representing the temperature of a target object, a frame supporting a membrane which carries the absorber, the frame including a plurality of reflecting surfaces disposed about the circumference of an opening over which the membrane spans for reflecting incident infrared power toward the absorber. By concentrating incident infrared power through reflection, the temperature difference between the absorber and the surrounding frame is increased, thereby producing an increased electrical output from the sensor.

Surface-Mount Package For An Optical Sensing Device And Method Of Manufacture

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US Patent:
6844606, Jan 18, 2005
Filed:
Oct 18, 2002
Appl. No.:
10/065446
Inventors:
James H. Logsdon - Kokomo IN, US
Abhijeet V. Chavan - Carmel IN, US
Hamid R. Borzabadi - Noblesville IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H01L 2302
US Classification:
257434, 257432, 257680, 257703, 257704, 2503381, 2503384
Abstract:
An optical sensor package capable of being surface mounted, and in a form that enables multiple packages to be fabricated simultaneously and then array tested in a wafer stack prior to singulation. The package comprises a chip carrier, a device chip electrically and mechanically connected to a first surface of the chip carrier with solder connections, and a capping chip secured to the chip carrier to hermetically enclose the device chip. The device chip has an optical sensing element on a surface thereof, while the capping chip has means for enabling radiation to pass therethrough to the device chip. The chip carrier includes conductive vias that are electrically connected to the solder connections of the device chip and extend through the chip carrier to bond pads on a second surface of the chip carrier, enabling the package to be surface mounted with solder connections to a suitable substrate.

Pressure Sensor Module Having Stress Isolation Platform

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US Patent:
6993975, Feb 7, 2006
Filed:
Nov 3, 2003
Appl. No.:
10/699752
Inventors:
Hamid R. Borzabadi - Noblesville IN, US
Dennis M. Koglin - Carmel IN, US
Gregory J. Manlove - Kokomo IN, US
Stephen P. Long - Tipton IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
G01L 9/00
US Classification:
73754
Abstract:
A pressure sensor module is provided with an isolation platform which isolates stress. The pressure sensor module includes a base structure and a cantilever member formed in the base structure by an isolation gap. A pressure sensing element is located on the cantilever member such that the cantilever member provides stress isolation to the pressure sensing element.

Integrated Pressure Sensor And Method Of Manufacture

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US Patent:
7117747, Oct 10, 2006
Filed:
Jan 3, 2005
Appl. No.:
11/028343
Inventors:
Hamid R. Borzabadi - Noblesville IN, US
Dennis M. Koglin - Carmel IN, US
Stephen P. Long - Tipton IN, US
Timothy A. Vas - Kokomo IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
G01L 9/00
US Classification:
73754, 73753
Abstract:
A technique for manufacturing an integrated pressure sensor includes a number of steps. Initially, a substrate with conductive electrical traces located on first and second sides of the substrate is provided. A plurality of compensation circuits are positioned in an array on the first side of the substrate in electrical contact with one or more of the conductive electrical traces on the first side of the substrate. A plurality of pressure sensors are positioned on the second side of the substrate in electrical contact with one or more of the conductive electrical traces on the second side of the substrate. Each one of the sensors is associated with one of the compensation circuits to form a plurality of pressure sensor-compensation circuit pairs. The substrate includes conductive vias to electrically connect each of the sensor-compensation circuit pairs. Each of the compensation circuits provides temperature compensation for an associated one of the sensors.

Leak-Testing Technique For Differential Pressure Sensor Array

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US Patent:
7174773, Feb 13, 2007
Filed:
Apr 19, 2005
Appl. No.:
11/109315
Inventors:
Hamid R. Borzabadi - Noblesville IN, US
Dennis M. Koglin - Carmel IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
G01M 3/26
G01L 19/14
US Classification:
73 493, 73 157, 73 171, 73 46, 73 492, 73 497, 73 52
Abstract:
A leak-testing technique and apparatus for differential pressure sensor arrays is provided. A reference pressure sensor array is provided, wherein a seal is disposed between the reference pressure sensor array and a target differential pressure sensor array. A probe socket is utilized to communicate with each individual sensor in the reference pressure sensor array. The target pressure sensor array and the reference pressure sensor array are sealed via a pressure plate and plunger assembly. The target pressure sensor array, seal, and reference pressure sensor array are exposed to a first pressure. The target differential pressure sensor array, seal, and reference pressure sensor array are then exposed to a second pressure. The probe socket verifies that all reference pressure sensors continue to output the first pressure. If the probe socket identifies a reference pressure sensor that reads the second pressure, then the corresponding target pressure sensor is identified as being defective because of leakage.

Electrical Feedthrough For Varied Environmental Conditions

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US Patent:
7244895, Jul 17, 2007
Filed:
May 2, 2006
Appl. No.:
11/416268
Inventors:
Hamid R. Borzabadi - Noblesville IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
H02G 3/18
US Classification:
174650, 174652, 174656, 174659, 248 56, 439930
Abstract:
A cost efficient electrical feedthrough is provided for forming a hermetic seal with a container and allowing a desired number of inputs to be connected between varied environmental conditions. The electrical feedthrough can be employed for environmental conditions including high pressures, high temperatures, low temperatures and the presence of corrosive gases. A first wire situated in a first environmental condition and a second wire situated in a second environmental condition are connected via a conducting material. The first environmental condition and the second environmental condition are separated by a divider having an opening for passing therethrough either the first wire or the second wire. A first seal extends from the divider to a material in contact with the conducting material. In an aspect, a second seal forms an enclosed area with the conducting material for surrounding a wire engaging hole and any wire extended therethrough and sealing the first environmental condition from the second environmental condition.

Sensor Module

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US Patent:
7331212, Feb 19, 2008
Filed:
Jan 9, 2006
Appl. No.:
11/328032
Inventors:
Gregory J. Manlove - Kokomo IN, US
Stephen P. Long - Tipton IN, US
Hamid R. Borzabadi - Noblesville IN, US
Timothy A. Vas - Kokomo IN, US
Kevin J. Hawes - Greentown IN, US
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
G01N 3/30
US Classification:
73 1201, 7350403, 7350404, 73511, 73778, 73804, 73805
Abstract:
A sensor module is provided having a compact housing containing a sensor. A low temperature co-fired ceramic substrate is located on the housing. The sensor and signal processing circuitry are located on the low temperature co-fired ceramic substrate. The sensor module further includes a metal shield substantially encapsulating the sensor.
Hamid F Borzabadi from Noblesville, IN, age ~63 Get Report