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Guangcai C Xing

from Fremont, CA
Age ~66

Guangcai Xing Phones & Addresses

  • 117 Esparito Ave, Fremont, CA 94539 (510) 573-1378 (510) 573-1379 (510) 656-0615
  • Morgan Hill, CA
  • Raleigh, NC
  • Newark, CA
  • Smithfield, NC
  • Santa Clara, CA
  • 117 Esparito Ave, Fremont, CA 94539 (510) 717-8981

Work

Position: Machine Operators, Assemblers, and Inspectors Occupations

Education

Degree: Associate degree or higher

Publications

Us Patents

Method And Apparatus For Insitu Vapor Generation

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US Patent:
6410456, Jun 25, 2002
Filed:
Nov 21, 2000
Appl. No.:
09/718443
Inventors:
Christian M. Gronet - Portola Valley CA
Peter A. Knoot - San Carlos CA
Gary E. Miner - Newark CA
Guangcai Xing - Fremont CA
David R. Lopes - Sunnyvale CA
Satheesh Kuppurao - Santa Clara. CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
C23C 16455
US Classification:
438769, 438770, 438773, 438787, 4272554, 42725537
Abstract:
A method of forming an oxide on a substrate. According to the method of the present invention a substrate is placed in a chamber. An oxygen containing gas and a hydrogen containing gas are then fed into the chamber. The oxygen containing gas and the hydrogen containing gas are then caused to react with one another to form water vapor in the chamber. The water vapor then oxidizes the substrate.

Apparatus For Exposing A Substrate To Plasma Radicals

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US Patent:
6450116, Sep 17, 2002
Filed:
Nov 12, 1999
Appl. No.:
09/439476
Inventors:
David B. Noble - Sunnyvale CA
Nathan DAstici - Campbell CA
Gary Miner - Fremont CA
Turgut Sahin - Cupertino CA
Guangcai Xing - Fremont CA
Yashraj Bhatnagar - Santa Clara CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
C23C 1600
US Classification:
118723R, 118723 MW, 118 501, 15634535, 15634536, 1563455
Abstract:
An apparatus and method for exposing a substrate to plasma including a first reaction chamber adapted to generate a plasma comprising ions and radicals and a second reaction chamber coupled to the first reaction chamber and adapted to house a substrate at a sight in the second reaction chamber. The second reaction chamber is coupled to the first reaction chamber by an inlet member and radicals of the plasma flow through the inlet member into the second reaction chamber.

Single Wafer Thermal Cvd Processes For Hemispherical Grained Silicon And Nano-Crystalline Grain-Sized Polysilicon

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US Patent:
7341907, Mar 11, 2008
Filed:
Apr 5, 2005
Appl. No.:
11/099081
Inventors:
Ming Li - Cupertino CA, US
Kevin Cunningham - Palo Alto CA, US
Sheeba Panayil - Santa Clara CA, US
Guangcai Xing - Fremont CA, US
R. Suryanarayanan Iyer - Santa Clara CA, US
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H01L 21/8242
US Classification:
438240, 438 97, 438640, 257E2117, 257E21412
Abstract:
Methods for depositing hemispherical grained silicon layers and nanocrystalline grain-sized polysilicon layers are provided. The hemispherical grained silicon layers and nanocrystalline grain-sized polysilicon layers are deposited in single substrate chemical vapor deposition chambers. The hemispherical grained silicon layers and nanocrystalline grain-sized polysilicon layers may be used as electrode layers in semiconductor devices. In one aspect, a two step deposition process is provided to form a nanocrystalline grain-sized polysilicon layer with a reduced roughness.

Method And Apparatus For Growing Thin Oxide Films On Silicon While Minimizing Impact On Existing Structures

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US Patent:
8236706, Aug 7, 2012
Filed:
Dec 12, 2008
Appl. No.:
12/334425
Inventors:
Bruce W. Peuse - San Carlos CA, US
Yaozhi Hu - San Jose CA, US
Paul Janis Timans - Mountain View CA, US
Guangcai Xing - Fremont CA, US
Wilfried Lerch - Dornstadt, DE
Stephen E. Savas - Fremont CA, US
Georg Roters - Duelmen, DE
Zsolt Nenyei - Blaustein, DE
Ashok Sinha - Los Altos Hills CA, US
Assignee:
Mattson Technology, Inc. - Fremont CA
International Classification:
H01L 21/31
H01L 21/469
US Classification:
438770, 438771, 438772
Abstract:
Plasma assisted low temperature radical oxidation is described. The oxidation is selective to metals or metal oxides that may be present in addition to the silicon being oxidized. Selectivity is achieved by proper selection of process parameters, mainly the ratio of H2 to O2 gas. The process window may be enlarged by injecting H2O steam into the plasma, thereby enabling oxidation of silicon in the presence of TiN and W, at relatively low temperatures. Selective oxidation is improved by the use of an apparatus having remote plasma and flowing radicals onto the substrate, but blocking ions from reaching the substrate.

Method And Apparatus For Insitu Vapor Generation

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US Patent:
20020136831, Sep 26, 2002
Filed:
May 7, 2002
Appl. No.:
10/140678
Inventors:
Christian Gronet - Portola Valley CA, US
Peter Knoot - San Carlos CA, US
Gary Miner - Newark CA, US
Guangcai Xing - Fremont CA, US
David Lopes - Sunnyvale CA, US
Satheesh Kuppurao - Santa Clara CA, US
International Classification:
C23C016/00
B05D003/02
US Classification:
427/255280, 427/314000
Abstract:
A method of forming an oxide on a substrate. According to the method of the present invention a substrate is placed in a chamber. An oxygen containing gas and a hydrogen containing gas are then fed into the chamber. The oxygen containing gas and the hydrogen containing gas are then caused to react with one another to form water vapor in the chamber. The water vapor then oxidizes the substrate.

Method Of Annealing An Oxide Film

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US Patent:
20030124873, Jul 3, 2003
Filed:
Dec 28, 2001
Appl. No.:
10/040614
Inventors:
Guangcai Xing - Fremont CA, US
Lee Luo - Fremont CA, US
Aihua Chen - San Jose CA, US
Errol C. Sanchez - Dublin CA, US
Christopher Quentin - Fremont CA, US
Kuan-Ting Lin - Keelung, TW
Shih-Che Lin - Keelung, TW
International Classification:
H01L021/31
H01L021/469
US Classification:
438/770000, 438/763000, 438/787000
Abstract:
The present invention is a method of annealing an oxide film. According to the present invention, an oxide film is deposited over a substrate. The oxide film is then annealed by exposing the oxide film to an ambient containing atomic oxygen for a predetermined period of time. In an embodiment of the present invention, the ambient containing atomic oxygen (O) is formed in the chamber by reacting a hydrogen containing gas and an oxygen containing gas together. In another embodiment of the present invention, the ambient containing atomic oxygen (O) is formed by decomposing NO.

Method And Apparatus For Growing Thin Oxide Films On Silicon While Minimizing Impact On Existing Structures

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US Patent:
20120298039, Nov 29, 2012
Filed:
Aug 6, 2012
Appl. No.:
13/568002
Inventors:
Bruce W. PEUSE - San Carlos CA, US
Yaozhi HU - San Jose CA, US
Paul Janis TIMANS - Mountain View CA, US
Guangcai XING - Fremont CA, US
Wilfried LERCH - Dornstadt, DE
Stephen E. SAVAS - Fremont CA, US
Georg ROTERS - Duelmen, DE
Zsolt NENYEI - Blaustein, DE
Ashok SINHA - Los Altos Hills CA, US
Assignee:
MATTSON TECHNOLOGY, INC. - Fremont CA
International Classification:
C23C 16/50
C23C 16/505
US Classification:
118723 I, 118723 R
Abstract:
Plasma assisted low temperature radical oxidation is described. The oxidation is selective to metals or metal oxides that may be present in addition to the silicon being oxidized. Selectivity is achieved by proper selection of process parameters, mainly the ratio of H2 to O2 gas. The process window may be enlarged by injecting H2O steam into the plasma, thereby enabling oxidation of silicon in the presence of TiN and W, at relatively low temperatures. Selective oxidation is improved by the use of an apparatus having remote plasma and flowing radicals onto the substrate, but blocking ions from reaching the substrate.

Method For Insitu Vapor Generation For Forming An Oxide On A Substrate

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US Patent:
61598666, Dec 12, 2000
Filed:
Feb 22, 2000
Appl. No.:
9/507946
Inventors:
Christian M. Gronet - Portola Valley CA
Peter A. Knoot - San Carlos CA
Gary E. Miner - Newark CA
Guangcai Xing - Fremont CA
David R. Lopes - Sunnyvale CA
Satheesh Kuppurao - Santa Clara CA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
H01L 2131
US Classification:
438769
Abstract:
A method of forming an oxide on a substrate. According to the method of the present invention a substrate is placed in a chamber. An oxygen containing gas and a hydrogen containing gas are then fed into the chamber. The oxygen containing gas and the hydrogen containing gas are then caused to react with one another to form water vapor in the chamber. The water vapor then oxidizes the substrate.
Guangcai C Xing from Fremont, CA, age ~66 Get Report