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Glen E Leinbach

from Fort Collins, CO
Age ~73
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Also known as:
Glen Edward Leinbach
Phone and address:
1400 Longs Peak Dr, Fort Collins, CO 80524
(970) 493-2187
Related to:
Evelyn Fay Leinbach, 67
Connected to:
Brian S Leinbach, 43Clay K Leinbach, 37Heidi M Leinbach, 40Owen G Leinbach, 58Patricia A Leinbach, 83Philip M Leinbach, 59Ricky Leinbach, 73Vera L Leinbach, 75Pamela S Leinbaugh, 69Bradford T Leinberger, 51

Glen Leinbach Phones & Addresses

  • 1400 Longs Peak Dr, Fort Collins, CO 80524 (970) 493-2187
  • 211 E Mulberry St #1, Fort Collins, CO 80524 (970) 493-2187
  • 1400 Longs Peak Dr, Fort Collins, CO 80524

Work

Position: Private Household Service Occupations

Education

Degree: Associate degree or higher

Industries

Computer Software

Resumes

Resumes

Glen Leinbach Photo 1

Glen Leinbach

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Location:
Fort Collins, CO
Industry:
Computer Software

Business Records

Name / Title
Company / Classification
Phones & Addresses
Glen Leinbach
Principal
Caber Contacts LLC
Business Services at Non-Commercial Site
1400 Longs Peak Dr, Fort Collins, CO 80524

Publications

Us Patents

Method And Apparatus For Manufacturing And Probing Test Probe Access Structures On Vias

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US Patent:
7518384, Apr 14, 2009
Filed:
Jan 31, 2005
Appl. No.:
11/047070
Inventors:
Glen E Leinbach - Fort Collins CO, US
Kenneth P Parker - Ft Collins CO, US
Assignee:
Agilent Technologies, Inc. - Santa Clara CA
International Classification:
G01R 31/02
US Classification:
324754, 324756
Abstract:
One or more test probe access structures for accessing vias on a printed circuit assembly and method of fabrication thereof is presented. Each test probe access structure is conductively connected to a via at a test probe access location above an exposed surface of a via to be accessible for probing by a test probe.

Method And Apparatus For Improving Defective Solder Joint Detection Using X-Ray Inspection Of Printed Assemblies

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US Patent:
20050087886, Apr 28, 2005
Filed:
Oct 27, 2003
Appl. No.:
10/694104
Inventors:
Glen Leinbach - Fort Collins CO, US
International Classification:
H01L023/48
H01L021/44
US Classification:
257786000, 438666000
Abstract:
An assembly and method for detecting defective and open solder joints of an area array packages attached to a printed circuit assembly is presented. The assembly employs offset pad layout on either or both of the printed circuit assembly or the area array package allowing improved solder joint defect detection.

Statistical Process Control Of Solder Paste Stenciling Using A Replicated Solder Paste Feature Distributed Across A Printed Circuit Board

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US Patent:
20080083816, Apr 10, 2008
Filed:
Oct 4, 2006
Appl. No.:
11/542907
Inventors:
Glen E. Leinbach - Ft. Collins CO, US
Stacy Kalisz Johnson - Gilbert AZ, US
International Classification:
B23K 31/00
US Classification:
228102, 228 8
Abstract:
Methods and systems for improving a solder paste stenciling process include obtaining data pertaining to solder paste deposits on a printed circuit board, the solder paste deposits deposited by a solder paste stenciling process through multiple identical apertures of a solder paste stencil, statistically analyzing the data, and correlating the data with a plurality of solder paste stenciling process problems to identify at least one solder paste stenciling process problem in the solder paste stenciling process.

Printed Circuit Board Test Access Point Structures And Method For Making The Same

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US Patent:
20050061540, Mar 24, 2005
Filed:
Sep 24, 2003
Appl. No.:
10/670649
Inventors:
Kenneth Parker - Ft. Collins CO, US
Ronald Peiffer - Loveland CO, US
Glen Leinbach - Ft. Collins CO, US
International Classification:
H05K001/11
H05K001/00
US Classification:
174250000
Abstract:
A test access point structure for accessing test points of a printed circuit board and method of fabrication thereof is presented. In an x-, y-, z-coordinate system where traces are printed along an x-y plane, the z-dimension is used to implement test access point structures. Each test access point structure is conductively connected to a trace at a test access point directly on top of the trace and along the z axis of the x-, y-, z-coordinate system above an exposed surface of the printed circuit board to be accessible for electrical probing by an external device.
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Glen E Leinbach from Fort Collins, CO, age ~73 Get Report