US Patent:
20130301273, Nov 14, 2013
Inventors:
J.R. Bushik - North Huntingdon PA, US
Jeffrey Shoup - Delmont PA, US
Narsimhan Raghunathan - Export PA, US
Luis Fanor Vega - Cheswick PA, US
Jason Bely - New Kensington PA, US
Gary L. Myers - Sarver PA, US
Gary L. Hunker - North Apollo PA, US
Barry E. Soxman - Tarentum PA, US
Anthony J. Fedusa - Lower Burrell PA, US
Robert E. Dick - Cheswick PA, US
Darl G. Boysel - Delmont PA, US
Eileen M. Kenzevich - Apollo PA, US
Assignee:
ALCOA INC. - Pittsburgh PA
International Classification:
F21V 29/00
Abstract:
A device for thermal management of an electronic component includes an inner shell dimensioned to house an electrical circuit and a thermally conductive metal outer shell. The metal outer shell has a thickness less than 6.3246 mm; a first closed end having a first diameter and dimensioned to support an electronic component operably connected to the electrical circuit; and a second end having a second diameter, wherein the first diameter is greater than the second diameter. The inner shell is at least partially within the outer shell. The outer shell is comprised of a single metal sheet. The thinnest portion of the outer metal shell is less than or equal to 0.75 times the thickest portion of the outer metal shell.