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Evan Jeffrey Phones & Addresses

  • 281 Canon Dr, Santa Barbara, CA 93105
  • 1613 Union St, Champaign, IL 61821 (217) 351-2998 (217) 356-5803
  • 2503 Springfield Ave, Champaign, IL 61821 (217) 356-5803
  • 237 Wildflower Dr, Ames, IA 50014 (515) 292-3576
  • 1300 Coconino Rd, Ames, IA 50014 (515) 292-1152
  • Fillmore, CA
  • 237 Wildflower Dr, Ames, IA 50014 (217) 413-0559

Work

Position: Building and Grounds Cleaning and Maintenance Occupations

Education

Degree: Bachelor's degree or higher

Publications

Us Patents

Quantum Random Number Generator

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US Patent:
20060010182, Jan 12, 2006
Filed:
Jul 6, 2004
Appl. No.:
10/885503
Inventors:
Joseph Altepeter - Urbana IL, US
Evan Jeffrey - Champaign IL, US
Paul Kwiat - Champaign IL, US
International Classification:
G06F 1/02
G06F 7/58
US Classification:
708250000
Abstract:
A method and apparatus for generating random numbers. Events characteristic of a random process are registered, and a particular time segment, from among a set of time segments, is identified based upon registration of an event within that time segment, and a value is associated based on the identified time segment. The events may be detections of a particle by a particle detector such as a photon detector. A random number is outputted based at least upon the associated value. Outputting of the random numbers may be followed by a whitening process. The source of particles may be driven to provided various specified probability distributions of values.

Single Line Qubit Control

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US Patent:
20220246677, Aug 4, 2022
Filed:
May 10, 2019
Appl. No.:
17/610241
Inventors:
- Mountain View CA, US
Anthony Edward Megrant - Goleta CA, US
Rami Barends - San Diego CA, US
Charles Neill - Goleta CA, US
Daniel Thomas Sank - Goleta CA, US
Evan Jeffrey - Santa Barbara CA, US
Amit Vainsencher - Goleta CA, US
Paul Klimov - Santa Barbara CA, US
Christopher Michael Quintana - Goleta CA, US
International Classification:
H01L 27/18
G06N 10/40
H01L 39/22
Abstract:
A quantum computing device includes: a qubit; a single XYZ control line, in which the qubit and the single control line are configured and arranged such that, during operation of the quantum computing device, the single XYZ control line allows coupling of an XY qubit control flux bias, from the single XYZ control line to the qubit, over a first frequency range at a first predetermined effective coupling strength, and coupling of a Z qubit control flux bias, from the single XYZ control line to the qubit, over a second frequency range at a second predetermined effective coupling strength.

Low Footprint Resonator In Flip Chip Geometry

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US Patent:
20230056318, Feb 23, 2023
Filed:
Sep 2, 2022
Appl. No.:
17/902360
Inventors:
Evan Jeffrey - Santa Barbara CA, US
International Classification:
H01L 39/02
G06N 10/00
H01L 39/12
H01L 39/22
H01L 39/24
H01P 3/00
H01P 11/00
H01P 5/02
Abstract:
A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.

Interleaved Cryogenic Cooling System For Quantum Computing Applications

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US Patent:
20210326739, Oct 21, 2021
Filed:
Apr 14, 2021
Appl. No.:
17/230085
Inventors:
- Mountain View CA, US
Evan Robert Jeffrey - Santa Barbara CA, US
International Classification:
G06N 10/00
H03K 19/195
Abstract:
A cryogenic cooling system for use in quantum computing applications can include a plurality of cryogenic cooling stages. Each of the plurality of cryogenic cooling stages can include a plurality of interleaved cooling units. The plurality of interleaved cooling units can include a first cooling unit and a second cooling unit. Each of the plurality of interleaved cooling units can have an associated operating temperature range. One or more signal lines that couple one or more classical processors to one or more quantum systems can pass through each of the plurality of interleaved cooling units for each of the plurality of cryogenic cooling stages.

Low Footprint Resonator In Flip Chip Geometry

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US Patent:
20200321506, Oct 8, 2020
Filed:
Oct 5, 2017
Appl. No.:
16/753431
Inventors:
- Mountain View CA, US
Evan Jeffrey - Santa Barbara CA, US
International Classification:
H01L 39/02
H01P 3/00
H01P 11/00
H01L 39/12
H01L 39/22
H01L 39/24
G06N 10/00
Abstract:
A device includes a first substrate having a principal surface; a second substrate having a principal surface, in which the first substrate is bump-bonded to the second substrate such that the principal surface of the first substrate faces the principal surface of the second substrate; a circuit element having a microwave frequency resonance mode, in which a first portion of the circuit element is arranged on the principal surface of the first substrate and a second portion of the circuit element is arranged on the principal surface of the second substrate; and a first bump bond connected to the first portion of the circuit element and to the second portion of the circuit element, in which the first superconductor bump bond provides an electrical connection between the first portion and the second portion.
Evan R Jeffrey from Santa Barbara, CA, age ~46 Get Report