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Eric J Tabaska

from Slinger, WI
Age ~40
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Related to:
Rannon E Bronecki, 41Austin J PlosMadeline M Plos, 74Mary A Tabaska, 92Maryann K Tabaska, 92Sara N Tabaska, 37John P Tabaska, 93Ryan M Francis, 40Roberta J Tabaska, 58Brian K Tabaska, 61Randall J Bronecki, 72Renee E Bronecki, 72Paul R Tabaska, 59David A Tabaska, 65
Connected to:
Muhammad Z Tabassam, 42Hans H Tabassian, 56Fathima Tabassum, 54Hina Tabassum, 34Nazia Tabassum, 38Yasmeen Tabassum, 57Kaila W Tabasz, 39Anthony B Tabat, 51Dawn A Tabat, 72Jessa K Tabat, 35

Eric Tabaska Phones & Addresses

  • Slinger, WI
  • 220 16Th Ave, South Milwaukee, WI 53172
  • 9366 Springhill Ln, Franklin, WI 53132 (414) 421-8025
  • Milwaukee, WI

Work

Company: Rockwell automation Oct 2016 to Sep 2017 Position: Project engineer - industrialization

Education

Degree: Masters School / High School: Capella University 2010 to 2012 Specialities: Business Administration, Business

Skills

Lean Manufacturing • Manufacturing • Product Development • Electronics • Root Cause Analysis • Engineering • Continuous Improvement • Testing • Project Management • Process Engineering • Six Sigma • Product Design • Microsoft Office • Automation • Contract Manufacturing • International Project Management • Troubleshooting • Plastics • Manufacturing Engineering • Cross Functional Team Leadership • Process Improvement • Cad • Solidworks • Sql • Autocad • Plc • Manufacturing Operations • Electrical Engineering • Ami • Amr • Smart Metering • Rf • Project Engineering • Design of Experiments • Injection Molding • Fmea • Engineering Management • Mechanical Engineering • Machining • Manufacturing Operations Management • Software Documentation • Iso • Machine Tools • 5S • Minitab • Sap • Ms Project • Iso 9000 • Materials • Analysis

Industries

Utilities

Resumes

Resumes

Eric Tabaska Photo 1

Senior Development Project Manager

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Location:
2614 Brick Church Pike, Nashville, TN 37207
Industry:
Utilities
Work:
Rockwell Automation Oct 2016 - Sep 2017
Project Engineer - Industrialization
Badger Meter Oct 2016 - Sep 2017
Senior Development Project Manager
Rockwell Automation May 2013 - Sep 2016
Senior Industrialization Engineer
Badger Meter Nov 2009 - Apr 2010
Manufacturing Engineer and Mrt Supervisor
Badger Meter Jan 2007 - Oct 2009
Manufacturing Engineer
Education:
Capella University 2010 - 2012
Masters, Business Administration, Business University of Wisconsin - Platteville 2002 - 2006
Bachelors, Bachelor of Science, Management
Skills:
Lean Manufacturing
Manufacturing
Product Development
Electronics
Root Cause Analysis
Engineering
Continuous Improvement
Testing
Project Management
Process Engineering
Six Sigma
Product Design
Microsoft Office
Automation
Contract Manufacturing
International Project Management
Troubleshooting
Plastics
Manufacturing Engineering
Cross Functional Team Leadership
Process Improvement
Cad
Solidworks
Sql
Autocad
Plc
Manufacturing Operations
Electrical Engineering
Ami
Amr
Smart Metering
Rf
Project Engineering
Design of Experiments
Injection Molding
Fmea
Engineering Management
Mechanical Engineering
Machining
Manufacturing Operations Management
Software Documentation
Iso
Machine Tools
5S
Minitab
Sap
Ms Project
Iso 9000
Materials
Analysis

Publications

Us Patents

Electronic Meter Register And Method Having A Bottom Formed By Sealing Material

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US Patent:
20130094125, Apr 18, 2013
Filed:
Oct 14, 2011
Appl. No.:
13/273426
Inventors:
Dennis W. Schwartz - West Bend WI, US
Eric Metzger - Franklin WI, US
John A. Olson - Brookfield WI, US
Ronald D. Benson - Colgate WI, US
Eric Tabaska - South Milwaukee WI, US
International Classification:
H05K 5/00
H05K 13/00
US Classification:
36167901, 295921
Abstract:
A sealed electronic meter register with no moving parts and no bottom wall or bottom cover includes a casing of plastic with an open bottom. A viewing window is snap fitted into a top wall of the casing. A gasket is placed on top of an electronic numerical display and under the viewing window. The display is placed on top of a frame that is positioned face down into the casing. An electronic circuit board with the processing circuitry of the device is attached to the bottom of the frame. A polyurethane compound sealing material is deposited though a hole in the circuit board and onto the backside of the display. An epoxy-resin sealant is then deposited from the bottom of the housing to seal over everything in the housing to protect the components and provide an exposed bottom surface for the assembly.
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Eric J Tabaska from Slinger, WI, age ~40 Get Report