Inventors:
James H. Lie - Santa Clara CA
Yue Chen - San Jose CA
Assignee:
Cypress Semiconductor Corp. - San Jose CA
International Classification:
H01L 2362
US Classification:
257355, 257356, 257357, 257360, 257361, 257546, 257786, 361 19, 361 54, 361 56, 361111, 361 911, 361 912, 361 915
Abstract:
A semiconductor device that includes an integrated circuit and an HBM structure formed on different semiconductor substrates is provided. The HBM structure may include input or output or input/output circuitry coupled to the integrated circuit and protection structures coupled to the input or output or input/output circuitry. In an embodiment, the integrated circuit may include input or output or input/output structures spaced across an area of the integrated circuit. The input or output or input/output circuitry of the HBM structure may be coupled to the input or output or input/output structures of the integrated circuit. A method for developing a design for an HBM structure is also provided. The method may include coupling an HBM structure formed on a first semiconductor substrate to an integrated circuit formed on a second semiconductor substrate. The method may also include testing the HBM structure and altering the HBM design based on the testing.