US Patent:
20080254313, Oct 16, 2008
Inventors:
Scott D. Kennedy - Pomfret Center CT, US
Vincent R. Landi - Phoenix AZ, US
Michael S. White - Pomfret Center CT, US
Daniel J. Navarro - Pomfret Center CT, US
Donald P. Magrey - Sterling CT, US
International Classification:
H01L 29/12
H05K 3/20
Abstract:
A circuit assembly comprises two or more circuit laminates, each comprising a conductive metal layer disposed on a poly(arylene ether ketone) substrate layer, wherein at least one of the conductive metal layers has been patterned to form a circuit, and a bond ply layer comprising a thermoplastic or thermosetting material. The thermoplastic bond ply has a melting point between 250 C. and 370 C., a decomposition temperature greater than about 290 C. and a dissipation factor of less than 0.01 at 10 GHz. The thermoset bond ply has a dissipation factor less than 0.01 at 10 GHz and a decomposition temperature greater than about 290 C. after lamination. Methods of forming the above circuit assemblies are also disclosed.