US Patent:
20110139183, Jun 16, 2011
Inventors:
Katrina Mikhaylichenko - San Jose CA, US
Denis Syomin - Fremont CA, US
Mark Wilcoxson - Fremont CA, US
International Classification:
B08B 3/00
B08B 7/04
Abstract:
A system for processing a wafer with a low surface tension liquid includes a low surface tension liquid source including a first heat source capable of heating the low surface tension liquid to not more than 25 degrees C. less than boiling point of the low surface tension liquid, a delivery mechanism for delivering the heated low surface tension liquid to an air/liquid interface region and a second heat source directed toward the air/liquid interface region, the second heat source capable of heating the air/liquid interface region to at least 2 degrees C. greater than the boiling point of the low surface tension liquid. A method for processing a wafer with a low surface tension liquid is also described.