Inventors:
David Emil Nelson - Waterford MI
Bob X. Li - Grand Blanc MI
Mark David Hemingway - Columbiaville MI
Suresh Baskaran - Kennewick WA
Joachim Kupe - Davisburg MI
Gregory Stephen Sims - Detroit MI
Delbert L. Lessor - Richland WA
Carl Elmer Miller - Millington MI
Darrell R. Herling - Kennewick WA
Assignee:
Delphi Technologies, Inc. - Troy MI
International Classification:
B01J 1908
Abstract:
A non-thermal plasma (NTP) reactor structural conductor element includes a base conductor support and a high dielectric constant (âhigh kâ) barrier layer supported by and substantially surrounding the base conductor support to form a structural conductor NTP reactor element. The structural conductor element may comprise a variety of shapes such as plates, sheets, half-box, I shapes, C shapes, or comb shapes, among others. In one embodiment, the dielectric barrier layer includes a coating applied to the base conductor support. In another embodiment, the dielectric barrier layer includes a high k film laminated to the base conductor support. In yet another embodiment, the base conductor support integrally forms the dielectric barrier layer via conversion of surfaces of the base conductor using electrochemical, thermal or chemical means to form the dielectric barrier layer.