Curtis J Bocchi

RE38025, Mar 11, 2003

Nov 13, 1995

08/556028

Timothy A. Skunes - Columbia Heights MN
Steven K. Case - St. Louis Park MN
Curtis J. Bocchi - Minnetonka MN

CyberOptics Corporation - Minneapolis MN

G01B 1100

356400

A high speed high precision laser based alignment sensor system for use on surface mount component placement machines. A laser system is utilized to correctly align and position component parts which range between 0. 02 inches and 2. 0 inches in size. The laser sensor system consists of a laser light source which is passed through a collimating lens and then through an aperture to create a stripe of collimated laser light which is focused past the component being aligned to strike a multi-element CCD sensor array. The sensor system is mounted directly on the carrying mechanism for the surface mount component placement machine. During transit of the component between the bin of components is to be placed, the component is rotated and the shadow which falls on the detector array is monitored. When the minimum width of shadow is detected, the correct angular orientation is determined, the average of the edges of the shadow when compared with the center of the quill determines the coordinate (X,Y) location of the component on the quill. Two alignments normally occur displayed by 90Â.

52786340, Jan 11, 1994

Feb 22, 1991

7/659983

Timothy A. Skunes - Columbia Heights MN
Steven K. Case - St. Louis Park MN
Curtis J. Bocchi - Minnetonka MN

CyberOptics Corporation - Minneapolis MN

G01B 1100

356400

A high speed high precision laser based alignment sensor system for use on surface mount component placement machines. A laser system is utilized to correctly align and position component parts which range between 0. 02 inches and 2. 0 inches in size. The laser sensor system consists of a laser light source which is passed through a collimating lens and then through an aperture to create a stripe of collimated laser light which is focused past the component being aligned to strike a multi-element CCD sensor array. The sensor system is mounted directly on the carrying mechanism for the surface mount component placement machine. During transit of the component between the bin of components and the circuit board upon which the component is to be placed, the component is rotated and the shadow which falls on the detector array is monitored. When the minimum width of shadow is detected, the correct angular orientation is determined, the average of the edges of the shadow when compared with the center of the quill determines the coordinate (X,Y) location of the component on the quill. Two alignments normally occur displaced by 90. degree.