Brian J Marcucci

8253259, Aug 28, 2012

Mar 12, 2010

12/722799

Belgacem Haba - Saratoga CA, US
Brian Marcucci - Phoenix AZ, US

Tessera, Inc. - San Jose CA

H01L 21/306

257784, 257E23024

A microelectronic assembly can include a microelectronic device, e. g. , semiconductor chip, connected together with an interconnection element, e. g. , substrate, the latter having signal contacts and reference contacts. The reference contacts can be connectable to a source of reference potential such as ground or a voltage source other than ground such as a voltage source used for power. Signal conductors, e. g. , signal wirebonds can be connected to device contacts exposed at a surface of the microelectronic device. Reference conductors, e. g. , reference wirebonds can be provided, at least one of which can be connected with two reference contacts of the interconnection element. The reference wirebond can have a run which extends at an at least substantially uniform spacing from a signal conductor, e. g. , signal wirebond that is connected to the microelectronic device over at least a substantial portion of the length of the signal conductor. In such manner a desired impedance may be achieved for the signal conductor.

8269357, Sep 18, 2012

Jan 7, 2011

12/986601

Belgacem Haba - Saratoga CA, US
Brian Marcucci - Phoenix AZ, US

Tessera, Inc. - San Jose CA

H01L 23/48
H01L 23/52
H01L 29/40

257784, 257778, 257783, 257786, 438108, 438119, 438127

A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e. g. , wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

8575766, Nov 5, 2013

Jan 7, 2011

12/986556

Belgacem Haba - Saratoga CA, US
Brian Marcucci - Phoenix AZ, US

Tessera, Inc. - San Jose CA

H01L 23/48
H01L 23/52
H01L 29/40

257784, 257E23024, 438106

A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e. g. , wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

8581377, Nov 12, 2013

Sep 16, 2010

12/883556

Belgacem Haba - Saratoga CA, US
Brian Marcucci - Phoenix AZ, US

Tessera, Inc. - San Jose CA

H01L 23/495

257676, 257666

A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial portion of one conductive element arranged in a plane positioned adjacent the lead frame and substantially parallel to the lead plane, the conductive element being capacitively coupled to the leads such that the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path, and an encapsulant which encapsulates the leads and the conductive element. The leads and, desirably, the conductive element have respective connection regions which are not covered by the encapsulant.

8624407, Jan 7, 2014

Aug 20, 2012

13/589558

Belgacem Haba - Saratoga CA, US
Brian Marcucci - Phoenix AZ, US

Tessera, Inc. - San Jose CA

H01L 21/306

257784

A microelectronic device, e. g. , semiconductor chip, is connected with an interconnection element having signal contacts and reference contacts, the reference contacts being connectable to a reference potential such as ground or power. Signal conductors, e. g. , signal wirebonds can be connected to device contacts of the microelectronic device, and at least one reference conductor, e. g. , reference wirebond can be connected with two reference contacts. The reference wirebond can have a run extending at an at least substantially uniform spacing from an at least a substantial portion of a length of a signal conductor, e. g. , signal wirebond. In such manner a desired impedance may be achieved for the signal conductor.

20100230828, Sep 16, 2010

Mar 12, 2010

12/722784

Belgacem Haba - Saratoga CA, US
Brian Marcucci - Phoenix AZ, US

TESSERA RESEARCH LLC - San Jose CA

H01L 23/49

257784, 257773, 257E23024

A microelectronic assembly can include a microelectronic device having device contacts exposed at a surface thereof and an interconnection element having element contacts and having a face adjacent to the microelectronic device. Conductive elements, e.g., wirebonds connect the device contacts with the element contacts and have portions extending in runs above the surface of the microelectronic device. A conductive layer has a conductive surface disposed at at least a substantially uniform distance above or below the plurality of the runs of the conductive elements. In some cases, the conductive material can have first and second dimensions in first and second horizontal directions which are smaller than first and second corresponding dimensions of the microelectronic device. The conductive material is connectable to a source of reference potential so as to achieve a desired impedance for the conductive elements.

20140038363, Feb 6, 2014

Oct 11, 2013

14/052037

Brian Marcucci - Phoenix AZ, US

TESSERA, INC. - San Jose CA

H01L 23/00

438123

A semiconductor device of an illustrative embodiment includes a die, a lead frame including a plurality of leads having substantial portions arranged in a lead plane and electrically connected to the die. Most preferably, the package includes at least a substantial portion of one conductive element arranged in a plane positioned adjacent the lead frame and substantially parallel to the lead plane, the conductive element being capacitively coupled to the leads such that the conductive element and at least one of the leads cooperatively define a controlled-impedance conduction path, and an encapsulant which encapsulates the leads and the conductive element. The leads and, desirably, the conductive element have respective connection regions which are not covered by the encapsulant.

20140117567, May 1, 2014

Jan 6, 2014

14/147984

- San Jose CA, US
Brian Marcucci - Phoenix AZ, US

TESSERA, INC. - San Jose CA

H01L 23/00
B81B 7/00
H01L 23/66

257784

A microelectronic assembly can include a microelectronic device, e.g., semiconductor chip, connected together with an interconnection element, e.g., substrate, the latter having signal contacts and reference contacts. The reference contacts can be connectable to a source of reference potential such as ground or a voltage source other than ground such as a voltage source used for power. Signal conductors, e.g., signal wirebonds can be connected to device contacts exposed at a surface of the microelectronic device. Reference conductors, e.g., reference wirebonds can be provided, at least one of which can be connected with two reference contacts of the interconnection element. The reference wirebond can have a run which extends at an at least substantially uniform spacing from a signal conductor, e.g., signal wirebond that is connected to the microelectronic device over at least a substantial portion of the length of the signal conductor. In such manner a desired impedance may be achieved for the signal conductor.