Search

Bill E Buel

from Portland, OR
Deceased
Get Report
Also known as:
Bill Buel
Related to:
Teresa K Henderson, 58Michael G Heisler, 54Bailee WaibelTawnya Reck, 53Chase Buel, 25
Connected to:
Dennis G Buel, 64Keith Buel, 58Laurel B Buel, 68Roger L Buel, 90Troy Buel, 53Jose G Buele, 41Ann M Bueler, 66Jack R Bueler, 77Dennis C Buelin, 69Andrew D Buell, 53

Bill Buel Phones & Addresses

  • Portland, OR
  • Concord, CA
  • 2125 Citrus Ct, Pittsburg, CA 94565 (925) 439-7263

Skills

Engineering

Resumes

Resumes

Bill Buel Photo 1

Bill Buel

View page
Skills:
Engineering

Publications

Us Patents

Method For Regulating Temperature At A Resin Interface In An Additive Manufacturing Process

View page
US Patent:
20230034915, Feb 2, 2023
Filed:
Oct 13, 2022
Appl. No.:
17/965685
Inventors:
- Eden Prairie MN, US
Christopher Prucha - San Francisco CA, US
Stephanie Benight - San Francisco CA, US
Bill Buel - San Francisco CA, US
International Classification:
B29C 64/364
B29C 64/393
B29C 64/135
B33Y 50/02
B29C 64/295
B33Y 10/00
B29C 64/255
B29C 64/124
B29C 64/232
B29C 64/129
B33Y 40/00
Abstract:
A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.

Method For Regulating Temperature At A Resin Interface In An Additive Manufacturing Process

View page
US Patent:
20210023791, Jan 28, 2021
Filed:
Oct 8, 2020
Appl. No.:
17/066249
Inventors:
- San Francisco CA, US
Christopher Prucha - San Francisco CA, US
Stephanie Benight - San Francisco CA, US
Bill Buel - San Francisco CA, US
International Classification:
B29C 64/364
B33Y 50/02
B29C 64/295
B33Y 10/00
B29C 64/124
B29C 64/393
B29C 64/135
B29C 64/255
B29C 64/232
Abstract:
A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.

Method For Regulating Temperature At A Resin Interface In An Additive Manufacturing Process

View page
US Patent:
20210023792, Jan 28, 2021
Filed:
Oct 8, 2020
Appl. No.:
17/066372
Inventors:
- San Francisco CA, US
Christopher Prucha - San Francisco CA, US
Stephanie Benight - San Francisco CA, US
Bill Buel - San Francisco CA, US
International Classification:
B29C 64/364
B33Y 50/02
B29C 64/295
B33Y 10/00
B29C 64/124
B29C 64/393
B29C 64/135
B29C 64/255
B29C 64/232
Abstract:
A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.

Method For Regulating Temperature At A Resin Interface In An Additive Manufacturing Process

View page
US Patent:
20200331209, Oct 22, 2020
Filed:
Apr 17, 2020
Appl. No.:
16/852078
Inventors:
- San Francisco CA, US
Christopher Prucha - San Francisco CA, US
Stephanie Benight - San Francisco CA, US
Bill Buel - San Francisco CA, US
International Classification:
B29C 64/393
B29C 64/135
B29C 64/255
B29C 64/295
B33Y 10/00
B33Y 50/02
Abstract:
A method for additive manufacturing includes: at a build tray arranged over a build window and containing a resin reservoir of a resin, heating the resin reservoir toward a target bulk resin temperature less than a heat deflection temperature of the resin in a photocured state; at a resin interface between a surface of the build window and the resin reservoir, heating an interface layer of the resin reservoir toward a target reaction temperature; and, in response to the resin reservoir exhibiting a first temperature proximal the target bulk resin temperature and to the interface layer exhibiting a second temperature proximal the target reaction temperature: at the resin interface, selectively photocuring a first volume of the resin to form a first layer of a build adhered to a build platform; and retracting the build platform away from the build window.
Control profile
Bill E Buel from Portland, ORDeceased Get Report