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Bharat Mangrolia Phones & Addresses

  • Fullerton, CA
  • Costa Mesa, CA
  • Eastvale, CA
  • 13697 Star Ruby Ave, Corona, CA 92880 (951) 808-0055 (949) 247-9982
  • Huntington Beach, CA
  • Santa Ana, CA
  • Riverside, CA
  • Mission Viejo, CA
  • 13697 Star Ruby Ave, Corona, CA 92880

Business Records

Name / Title
Company / Classification
Phones & Addresses
Bharat M. Mangrolia
President
MANTRARAJ, INC
3334 E Coast Hwy SUITE 333, Corona del Mar, CA 92625
Bharat Mangrolia
President
THERMALWORKS, INC
2973 Hbr Blvd SUITE 575, Costa Mesa, CA 92626
Bharat M. Mangrolia
President
NATURE'S OUTREACH, A CALIFORNIA NONPROFIT MUTUAL BENEFIT CORPORATION
1427 N Wilcox Ave, Los Angeles, CA 90028

Publications

Us Patents

Expansion Constrained Die Stack

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US Patent:
7173325, Feb 6, 2007
Filed:
Aug 30, 2004
Appl. No.:
10/930397
Inventors:
Kalu K. Vasoya - Huntington Beach CA, US
Bharat M. Mangrolia - Huntington Beach CA, US
Assignee:
C-Core Technologies, Inc. - Costa Mesa CA
International Classification:
H01L 23/02
H01L 23/48
H01L 23/34
H01L 23/06
H01L 23/52
US Classification:
257686, 257685, 257688, 257689, 257723, 257725, 257729, 257777, 257778
Abstract:
Structures and techniques for mounting semiconductor dies are disclosed. In one embodiment, the invention includes a stack of printed wiring board assemblies that are connected via interconnection components. At least one of the printed wiring board assemblies includes an interposer substrate having a constraining layer that includes carbon.

Lightweight Circuit Board With Conductive Constraining Cores

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US Patent:
7635815, Dec 22, 2009
Filed:
Aug 18, 2004
Appl. No.:
10/921649
Inventors:
Kalu K. Vasoya - Santa Ana CA, US
Bharat M. Mangrolia - Santa Ana CA, US
William E. Davis - Huntington Beach CA, US
Richard A. Bohner - Hermosa Beach CA, US
Assignee:
Stablcor, Inc. - Costa Mesa CA
International Classification:
H05K 1/03
US Classification:
174255, 174256, 428368
Abstract:
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Lightweight Circuit Board With Conductive Constraining Cores

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US Patent:
7667142, Feb 23, 2010
Filed:
Aug 18, 2004
Appl. No.:
10/921616
Inventors:
Kalu K. Vasoya - Santa Ana CA, US
Bharat M. Mangrolia - Santa Ana CA, US
William E. Davis - Huntington Beach CA, US
Richard A. Bohner - Hermosa Beach CA, US
Assignee:
Stablcor, Inc. - Costa Mesa CA
International Classification:
H05K 1/09
US Classification:
174255, 174256, 428368
Abstract:
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Lightweight Circuit Board With Conductive Constraining Cores

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US Patent:
8097335, Jan 17, 2012
Filed:
Feb 18, 2010
Appl. No.:
12/708459
Inventors:
Kalu K. Vasoya - Santa Ana CA, US
Bharat M. Mangrolia - Santa Ana CA, US
William E. Davis - Hungtington Beach CA, US
Richard A. Bohner - Hermosa Beach CA, US
Assignee:
Stablcor Technology, Inc. - Huntington Beach CA
International Classification:
B32B 15/00
US Classification:
4282991, 428209, 4283011, 174255, 174256, 174266
Abstract:
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Lightweight Circuit Board With Conductive Constraining Cores

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US Patent:
20020157859, Oct 31, 2002
Filed:
Dec 11, 2001
Appl. No.:
10/020506
Inventors:
Kalu Vasoya - Santa Ana CA, US
Bharat Mangrolia - Santa Ana CA, US
William Davis - Huntington Beach CA, US
Richard Bohner - Hermosa Beach CA, US
International Classification:
H05K001/00
US Classification:
174/250000
Abstract:
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.

Edge Plated Printed Wiring Boards

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US Patent:
20060104035, May 18, 2006
Filed:
Aug 24, 2005
Appl. No.:
11/211942
Inventors:
Kalu Vasoya - Placentia CA, US
Bharat Mangrolia - Huntington Beach CA, US
Don Roy - Huntington Beach CA, US
International Classification:
H05K 7/20
US Classification:
361704000
Abstract:
Printed wiring board assemblies are described that include printed wiring boards having at least on thermally conductive plane. In addition, the printed wiring boards can also include edge plating on at least a portion of an edge of the printed wiring board. The printed wiring boards can also include heat spreaders, heat sinks and/or thermally conductive heat paths to dissipate heat from the printed wiring board assembly. In many instances, the heat spreaders include microfoils. In one embodiment, the invention includes at least one circuit layer, at least one dielectric layer, at least one thermally conductive plane and edge plating that contacts the at least one thermally conductive plane.

Lightweight Circuit Board With Conductive Constraining Cores

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US Patent:
20120097431, Apr 26, 2012
Filed:
Dec 28, 2011
Appl. No.:
13/339244
Inventors:
Kalu K. Vasoya - Santa Ana CA, US
Bharat M. Mangrolia - Santa Ana CA, US
William E. Davis - Huntington Beach CA, US
Richard A. Bohner - Hermosa Beach CA, US
Assignee:
Stablcor Technology, Inc. - Huntington Beach CA
International Classification:
H05K 7/20
H05K 1/09
H05K 1/03
H01K 3/10
US Classification:
174252, 29852, 174257, 174255
Abstract:
Prepregs, laminates, printed wiring board structures and processes for constructing materials and printed wiring boards that enable the construction of printed wiring boards with improved thermal properties. In one embodiment, the prepregs include substrates impregnated with electrically and thermally conductive resins. In other embodiments, the prepregs have substrate materials that include carbon. In other embodiments, the prepregs include substrates impregnated with thermally conductive resins. In other embodiments, the printed wiring board structures include electrically and thermally conductive laminates that can act as ground and/or power planes.
Bharat M Mangrolia from Fullerton, CA, age ~45 Get Report