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Andrew Low Phones & Addresses

  • 2121 Branchwood Dr, Grapevine, TX 76051 (817) 251-6251
  • 729 Greymoor Pl, Southlake, TX 76092 (817) 251-6251 (817) 329-9329
  • 5116 Hawks Nest, Mc Kinney, TX 75070 (972) 529-5629
  • 3600 Hayden Rd, Scottsdale, AZ 85251 (480) 994-1242
  • Phoenix, AZ
  • Arlington, TX
  • Maricopa, AZ
  • Rohnert Park, CA
  • 2121 Branchwood Dr, Grapevine, TX 76051 (817) 329-9329

Work

Company: Kennedy middle school Jan 2007 Position: 6th and 7th grade english teacher and 6-8th grade reading improvement teacher

Education

School / High School: University of Texas at Arlington- Arlington, TX 1996 Specialities: Bachelor of Science in Business

Emails

Resumes

Resumes

Andrew Low Photo 1

Dry Cleaning Delivered

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Position:
Franchisee #1202 Tysons Corner, VA at Pressed4Time
Location:
Mclean, Virginia
Industry:
Consumer Services
Work:
Pressed4Time - US since Aug 2010
Franchisee #1202 Tysons Corner, VA

self-employed Jun 2000 - Oct 2011
President

Rocky Mountain Apparel Apr 2002 - Jun 2008
President/owner

Resources Connection/Resources Global Professionals Jul 2000 - Sep 2001
Contract Accountant

Marriott International Feb 1995 - Jun 2000
Controller/financial analyst
Education:
Rochester Institute of Technology 1993 - 1994
masters, Corporate Accounting
Ithaca College 1988 - 1992
Bachelors, Finance
Skills:
New Business Development
Sales Management
Andrew Low Photo 2

Sr Principal Engineer At Tellabs

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Location:
Dallas/Fort Worth Area
Industry:
Telecommunications
Andrew Low Photo 3

Andrew Low

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Location:
United States
Education:
Brigham Young University
Andrew Low Photo 4

Student At Homestead High School

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Position:
Student at Homestead High School
Location:
Sunnyvale, California
Industry:
Mechanical or Industrial Engineering
Work:
Homestead High School since Aug 2009
Student

Temasek Polytechnic Jun 2012 - Jul 2012
Intern
Education:
Homestead High School 2009 - 2013
Andrew Low Photo 5

Andrew Low

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Location:
United States
Andrew Low Photo 6

Andrew Low Cedar Hill, TX

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Work:
Kennedy Middle School

Jan 2007 to 2000
6th and 7th Grade English Teacher and 6-8th Grade Reading Improvement Teacher

Lindamood-Bell Learning Processes
Dallas, TX
May 1998 to Dec 2006
Associate Clinic Director

Johns Elementary
Arlington, TX
Aug 2001 to May 2002
Special Education Teacher - Resource/Content Mastery

Education:
University of Texas at Arlington
Arlington, TX
1996 to 2000
Bachelor of Science in Business

Publications

Us Patents

Apparatus And Method For Correlating The Air Flow Velocity In An Environmental Chamber To A Rack Assembly

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US Patent:
7096147, Aug 22, 2006
Filed:
Nov 24, 2004
Appl. No.:
10/997776
Inventors:
Andrew G. Low - Southlake TX, US
Assignee:
Tellabs Bedford, Inc. - Bedford TX
International Classification:
G01K 1/08
US Classification:
702132
Abstract:
A system and method are disclosed for measuring the airflow velocity within a chamber in order to qualify electronic equipment based on airflow velocity in combination with temperature rating. Furthermore, a system and method are disclosed for measuring and monitoring the airflow velocity at various positions within an equipment assembly rack during operation in order to determine the position of and eliminate hot-spots that occur based on temperature and airflow velocity tolerance parameters.

Power Distribution System And Method

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US Patent:
7368835, May 6, 2008
Filed:
Apr 21, 2005
Appl. No.:
11/111004
Inventors:
David R. VanOrden - Bedford TX, US
Andrew G. Low - Southlake TX, US
Thyagarajan Ramachandran - Arlington TX, US
Jose A. Garcia - Frisco TX, US
Monty C. Carpenter - Lewisville TX, US
Assignee:
Tellabs Bedford, Inc. - Bedford TX
International Classification:
H02J 7/00
US Classification:
307 64
Abstract:
A backplane in a power distribution shelf has power outputs connected to corresponding primary card slots and adjacent card slots. Power distribution cards are seated in the card slots. A maintenance card can be configured to selectively provide redundant power to the power outputs of a failed power distribution circuit card via an adjacent power distribution circuit card and a maintenance connection.

Mass Customization Configurator

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US Patent:
7472043, Dec 30, 2008
Filed:
Feb 18, 2005
Appl. No.:
11/061097
Inventors:
Andrew G. Low - Southlake TX, US
Franz T. Crystal - Plano TX, US
Assignee:
Tellabs Bedford, Inc. - Naperville IL
International Classification:
G06F 17/50
US Classification:
703 1, 703 18, 702132
Abstract:
The present invention provides an automated configuration system and method for electronics enclosures. The system receives user requirements generates a configuration including placement schedule, power usage schedules and heat flow schedules. Included as output of the system is a bill of materials, an equipment layout drawing and pricing based on predetermined material and labor pricing. Methods for generating a configuration are described that include iteratively repeating combinations of the steps of generating design rules, deriving a placement schedule, mapping the distribution of power usage within the enclosure and producing a heat flow analysis. Processes used to generate the configuration can be controlled by design rules derived from user requirements.

Passive Cooling For Fiber To The Premise (Fttp) Electronics

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US Patent:
20070115635, May 24, 2007
Filed:
Nov 18, 2005
Appl. No.:
11/282941
Inventors:
Andrew Low - Southlake TX, US
Thyagarajan Ramachandran - Arlington TX, US
International Classification:
H05K 7/20
US Classification:
361700000, 361704000, 165104330
Abstract:
A phase change material, including multiple phase change materials of different formulations, is placed in heat transfer association with an electronics enclosure (e.g., a sealed enclosure) deployed in an environment that causes the electronics and the phase change material to experience periods of heating and periods of cooling. During the periods of heating, the phase change material absorbs heat and changes at least partially from a first state to a second state to maintain the temperature of the electronics at a desirable level. During the periods of cooling, the phase change material reverts at least partially back to the first state for future heat absorption. The phase change material is cooled by a thermally cooler body such as the night sky. The electronics enclosure and phase change material may be placed in a second enclosure covered with a paint having a paint additive that reflects solar radiation.

Delivery Of Gpon Technology

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US Patent:
20140072264, Mar 13, 2014
Filed:
Sep 10, 2012
Appl. No.:
13/608156
Inventors:
Richard Schroder - Plano TX, US
Russell W. Brown - Euless TX, US
Thomas C. Ruvarac - Naperville IL, US
John Silovich - Fox Lake IL, US
Andrew G. Low - Grapevine TX, US
Assignee:
Tellabs Bedford, Inc. - Bedford TX
International Classification:
G02B 6/36
US Classification:
385 76
Abstract:
A wall-mountable outlet comprising an enclosure and a faceplate mechanically coupled to the enclosure. An optical network terminal (ONT) is provided in the enclosure. In one example embodiment, the ONT comprises an optical-electrical (O-E) data module, and the O-E data module comprises an O-E converter. The O-E data module can further comprise a switch arranged to selectively couple at least one signal with the O-E converter. The O-E data module further can comprise a Passive Optical Network (PON) controller interposed between the O-E converter and the switch.

Housing For A Fan

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US Patent:
59064757, May 25, 1999
Filed:
Nov 12, 1997
Appl. No.:
8/969068
Inventors:
Marcus L. Melane - Irving TX
Curtis L. Hargroves - Double Oak TX
David S. Tunnell - Garland TX
Andrew G. Low - McKinney TX
Assignee:
Alcatel USA Sourcing, L.P. - Plano TX
International Classification:
F01D 2524
B25G 318
F16D 100
US Classification:
4152141
Abstract:
A housing (10) for a cooling fan (56) includes a first side wall (12) and a second side wall (14) separated by a front wall (16). A first wall portion (22) extends from the first side wall (22) toward the second side wall (14) and opposite from the front wall (16). A second wall portion (26) extends from the second side wall (14) toward the first side wall (12) and opposite from the front wall (16). A first flexible member (30) on the first wall portion (22) extends along the first side wall (12) and is arched toward the front wall (16). A second flexible member (32) on the second wall portion (26) extends along the second side wall (14) and is arched toward the front wall (16). A cooling fan (56) is inserted into the housing (10), compressing the first flexible member (30) and the second flexible member (32) that force the cooling fan (56) against the front wall (16). The front wall (16) may include tabs (42, 46, 48, 50) to enhance the ability to secure the cooling fan (56) within the housing (10).

Thermal Management Device And System For An Electronic Component Enclosure

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US Patent:
60241659, Feb 15, 2000
Filed:
Aug 26, 1998
Appl. No.:
9/140454
Inventors:
Marcus L. Melane - Irving TX
David A. Bartek - Plano TX
Paul A. Tucker - Richardson TX
Andrew Low - McKinney TX
Assignee:
DSC Telecom L.P. - Plano TX
International Classification:
F28D 1500
US Classification:
16510433
Abstract:
A thermal management device for an enclosure, the enclosure disposed in an environment exposed to ambient air and having an interior area for housing heat generating electronic components includes a heat exchanger having an evaporator portion and a condenser portion, the evaporator portion is adapted for mounting within the enclosure interior area adjacent to the heat generating electronic components. The condenser portion is exposed to the ambient air for removal of heat from the enclosure interior area generated by the electronic components adjacent to the heat exchanger evaporator portion. The device is incorporated in a system which includes an air duct disposed within the enclosure interior area. The duct includes an air inlet port and air outlet port. The ports communicate with the ambient air to thereby create an airflow path through the air duct from the inlet port to the outlet port.

Integral Heat Pipe Enclosure

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US Patent:
58846930, Mar 23, 1999
Filed:
Dec 31, 1997
Appl. No.:
/001624
Inventors:
Thomas A. Austin - Santa Rosa CA
Stephen Greer - Santa Rosa CA
Andrew Low - McKinney TX
Assignee:
DSC Telecom L.P. - Plano TX
International Classification:
F28D 1500
US Classification:
16510433
Abstract:
A passive cooling system for cooling an enclosure containing electronic components. A hollowed portion of the enclosure is formed as an integral heat pipe containing a working fluid. The hollowed portion has an evaporator section located at the top and a condenser section located at the bottom. The enclosure also has hollowed side walls which serve as passage ways for the working fluid to flow through in between the evaporator and condenser sections. Gravity and the pressure of evaporation force the working fluid down to the condenser section. A wick is provided for returning the working fluid to the evaporator section by capillary action. Additionally, an ultrasonic transducer driven by the heat rejected from the condenser section may be used to help return the working fluid to the evaporator section. Finally, a check valve may be employed before the evaporator section for the working fluid to flow through.
Andrew Gordon Low from Grapevine, TX, age ~63 Get Report