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Alfred Carl Phones & Addresses

  • Weare, NH
  • 14 Copperdale Dr, Simpsonville, SC 29681
  • 101 Joppa Rd, Merrimack, NH 03054 (603) 423-9977
  • Nashua, NH
  • 2010 Skyline Dr, Lowell, MA 01854 (978) 455-0480
  • Dracut, MA

Publications

Wikipedia

Alfred Carl Graefe

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Alfred Carl Graefe (November 23, 1830 - April 12, 1899) was a German ophthalmologist who was born in Martinskirchen. He studied medicine in Halle and Berlin ...

Alfred Fuller

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Alfred Carl Fuller (January 13, 1885 in Welsford, Nova Scotia - December 4, 1973 in Hartford, Connecticut) was a Canadian-born American businessman. ...

Us Patents

Near Chip Scale Package Integration Process

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US Patent:
7824965, Nov 2, 2010
Filed:
Oct 25, 2007
Appl. No.:
11/924233
Inventors:
David J. Fryklund - Hampton Falls NH, US
Alfred H. Carl - Nashua NH, US
Brian P. Murphy - Revere MA, US
Assignee:
Skyworks Solutions, Inc. - Woburn MA
International Classification:
H01L 21/00
US Classification:
438114, 257E21502, 257E23116
Abstract:
Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.

Near Chip Scale Semiconductor Packages

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US Patent:
8022557, Sep 20, 2011
Filed:
Aug 31, 2010
Appl. No.:
12/872583
Inventors:
David J Fryklund - Hampton Falls NH, US
Alfred H Carl - Nashua NH, US
Brian P Murphy - Revere MA, US
Assignee:
Skyworks Solutions, Inc. - Woburn MA
International Classification:
H01L 23/48
H01L 23/52
H01L 29/40
US Classification:
257778, 257781, 257E21502, 257E21116, 438114
Abstract:
Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.

Near Chip Scale Package Integration Process

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US Patent:
8105879, Jan 31, 2012
Filed:
Sep 22, 2010
Appl. No.:
12/887747
Inventors:
David J Fryklund - Hampton Falls NH, US
Alfred H Carl - Nashua NH, US
Brian P Murphy - Revere MA, US
Assignee:
Skyworks Solutions, Inc. - Woburn MA
International Classification:
H01L 21/00
US Classification:
438114, 257E21502, 257E23116
Abstract:
Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.

Near Chip Scale Semiconductor Packages

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US Patent:
8222085, Jul 17, 2012
Filed:
Jul 25, 2011
Appl. No.:
13/189658
Inventors:
David J Fryklund - Hampton Falls NH, US
Alfred H Carl - Nashua NH, US
Brian P Murphy - Revere MA, US
Assignee:
Skyworks Solutions, Inc. - Woburn MA
International Classification:
H01L 21/00
US Classification:
438114, 257E21502, 257E21116
Abstract:
Flip chip ball grid array semiconductor devices and methods for fabricating the same. In one example, a near chip scale method of semiconductor die packaging may comprise adhering the die to a substrate in a flip chip configuration, coating the die with a first polymer layer, selectively removing the first polymer layer to provide at least one opening to expose a portion of the die, and depositing a first metal layer over the first polymer layer, the first metal layer at least partially filling the at least one opening to provide an electrical contact to the die, and including a portion that substantially surrounds the die in a plane of an upper surface of the first metal layer to provide an electromagnetic shield around the die.
Alfred Henry Carl from Weare, NH, age ~50 Get Report